GB/T 10574.3-2003 in English
VALIDMethods for chemical analysis of tin-lead solder-Determination of bismuth content
- Issued on:2003-03-11
- Implemented on:2003-08-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$88.00
《GB/T 10574.3-2003锡铅焊料化学分析方法 铋量的测定》由TC243(全国有色金属标准化技术委员会)归口,TC243SC2(全国有色金属标准化技术委员会重金属分会)执行,主管部门为中国有色金属工业协会。
本部分规定了锡铅焊料中铋含量的测定方法。本部分适用于锡铅焊料中铋含量的测定。测定范围(质量分数):0.003%~0.25%。

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