GB/T 43799-2024 in English
VALIDSectional specification for high density interconnect printed boards
- Issued on:2024-03-15
- Implemented on:2024-07-01
- File Format:PDF
- Delivery:Via email within 5 business days
$495.00
| Standard No: | GB/T 43799-2024 |
| Document status: | VALID |
| Title in English: | Sectional specification for high density interconnect printed boards |
| Title in Chinese: | 高密度互连印制板分规范 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 5 business days |
| Issued on: | 2024-03-15 |
| Implemented on: | 2024-07-01 |
| Professional Classification: | GB-National Standard |
| Related Topics: | printed board
high density Zirconium plate density Seed board density Zirconium plate density Density is too high Tantalum plate density not too dense The higher the density of states Indian regulations Seed board density indian aluminum plate normative density |
《GB/T 43799-2024高密度互连印制板分规范》由TC47（全国印制电路标准化技术委员会）归口，主管部门为工业和信息化部（电子）。
Introduction
Analysis of the core content of the standard
| Technical dimensions | Level 1 products | Level 2 products | Level 3 products |
|---|---|---|---|
| Minimum thickness of micro via copper plating | 10μm | 12μm | 12μm |
| Allowable size of lamination voids | ≤0.15mm | ≤0.08mm | ≤0.08mm |
| Thermal stress test temperature | 288℃±5℃ | ||
Key process control points
Micro via processing: Laser drilling must ensure a hole bottom/hole opening diameter ratio of 60%-100%, and mechanical drilling must reach the target connection pad. Level 3 products require zero breakage of the capture connection pad, and the contact surface is continuous and has no residue.
Plating quality control: The average thickness of the copper plating in the hole of Class 1 rigid board is ≥20μm, and the copper plating of Class 3 products must be ≥12μm. The depression of the cover plating must be controlled within 76μm (Level 3).
Quality Assurance System
| Inspection Type | Level 1 AQL | Level 2 AQL | Level 3 AQL |
|---|---|---|---|
| Via Protection | 4.0 | 2.5 | 2.5 |
| Thermal Stress Test | 4.0 | 2.5 | 2.5 |
| Periodic Inspection Frequency | 12 Months | ||
Implementation Recommendations
- Material selection:Preferably use resin-coated copper foil that complies with SJ/T11551, with the outer starting copper foil ≥8.5μm
- Design verification:Use SJ20828A-2018 test pattern to verify weak links, and add back drill overlap detection for level 3 products
- Process control:Establish a micro-sectioning database to monitor the uniformity of the coating, and use 30x optical detection of micro-via structure
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