GB/T 7095.2-2008 in English

《GB/T 7095.2-2008漆包铜扁绕组线 第2部分：120级缩醛漆包铜扁线》由TC213（全国电线电缆标准化技术委员会）归口，TC213SC1（全国电线电缆标准化技术委员会绕组线分会）执行，主管部门为中国电器工业协会。
GB/T7095的本部分规定了120 级以聚乙烯醇缩醛树脂为基的单涂层漆包铜扁绕组线的要求。
如能保留原树脂的化学特性并满足对漆包线规定的所有要求,则该树脂可以改性。
注:改性树脂是一种经过化学变化的,或者含有一种或多种添加剂以提高其某种性能或使用特性的树脂。
120级表示热级,它要求最小温度指数为120,热冲击温度至少为155℃。
对应于温度指数的摄氏温度并不就是推荐的漆包线使用温度,因为这取决于包括所用设备类型在
内的许多因素。
本部分适用的导体标称尺寸范围为:
---宽边尺寸:最小2.00mm,最大16.00mm;
---窄边尺寸:最小0.80mm,最大5.60mm。
本部分包括1级和2级漆膜厚度漆包铜扁线,并适用于导体的全部规格范围。
宽边尺寸和窄边尺寸的组合以及宽/窄比见GB/T7095.1-2008。

This part of GB/T 7095 specifies the requirements of enamelled rectangular copper winding wire of class 120 with a sole coating based on polyvinyl acetal resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements.
Note: A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.
Class 120 is a thermal class that requires a minimum temperature index of 120 and a heat shock temperature of at least 155℃.
The temperature in degrees Celsius corresponding to the temperature index is not necessarily that at which it is recommended that the wire be operated and this will depend on many factors, including the type of equipment involved.
The range of nominal conductor dimensions covered by this part is as follows:
- Width: minimum 2.00 mm; maximum 16.00 mm;
- Thickness: minimum 0.80 mm; maximum 5.60 mm.
Wires of grade 1 and grade 2 are included in this part and apply to the complete range of conductors.
The specified combinations of width and thickness as well as the specified ratio width/thickness are given in GB/T 7095.1-2008.

Foreword I
1 Scope
2 Normative References
3 Definitions and General Notes on Methods of Test and Appearance
4 Dimensions
5 Electrical Resistance
6 Elongation
7 Springiness
8 Flexibility and Adherence
9 Heat Shock
10 Cut-through
11 Resistance to Abrasion
12 Resistance to Solvents
13 Breakdown Voltage
14 Continuity of Insulation
15 Temperature Index
16 Resistance to Refrigerants
17 Solderability
18 Heat or Solvent Bonding
19 Dielectric Dissipation Factor
20 Resistance to Transformer Oil
21 Loss of Mass
23 Pin Hole Test
30 Packaging