JB/T 7488-2008 in English

VALID

General technological specification for lead-free wavesoldering

Issued on:2008-02-01
Implemented on:2008-07-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $270.00
$262.00

Standard No:	JB/T 7488-2008
Document status:	VALID
Title in English:	General technological specification for lead-free wavesoldering
Title in Chinese:	无铅波峰焊接通用工艺规范
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2008-02-01
Implemented on:	2008-07-01
Superseding:	JB/T 7488-1994 Wave Soldering Process Specification
ICS Classification:	31.180-Printed circuits and boards
Chinese Classification:	L30-Printed circuit
Professional Classification:	JB-Machinery
Related Keywords:	lead-free wave soldering lead-free wave technological specification lead-free electronic assembly products
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本标准规定了电子组装件产品在进行无铅波峰焊焊接时应遵循的工艺要求和质量检查规范。本标准适用于以印制电路板（PCB）为组装基板的电子组装件的无铅波峰焊接加工和质量检验。

Scope

This standard specifies the process requirements and quality inspection specifications that should be followed when electronic assembly products (referred to as products) are soldered by lead-free wave soldering. This standard applies to lead-free wave soldering processing and quality inspection of electronic assemblies using printed circuit boards (PCBs) as assembly substrates.

More samples: JJG 21-2008 DL/T 368-2010 JGJ 94-2008

Sample only — not a preview of JB/T 7488-2008

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