QJ 3173-2003 in English

VALID

Reflow soldering technical requirements for space electron element

Issued on:2003-09-25
Implemented on:2003-12-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $150.00
$146.00

Standard No:	QJ 3173-2003
Document status:	VALID
Title in English:	Reflow soldering technical requirements for space electron element
Title in Chinese:	航天电子电气产品再流焊接技术要求
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2003-09-25
Implemented on:	2003-12-01
ICS Classification:	49.060-Aerospace electric equipment and systems
Chinese Classification:	V25-Electronic components
Professional Classification:	QJ-Aerospace
Related Keywords:	reflow soldering space electron element scopethis standard technical requirements process technology requirements requirements
Related Topics:	electronic product board Aerospace Electric Aerospace Electric Touch Current Requirements Electrophoresis product requirements Electronic Sample Request Welding Technology Welding Technology Electronics Aerospace electrical products Electronics re-electrification Aerospace Electronics Product Technology Exchange QJ3173-2003 Marine electrical and electronic products Electronic and electrical products electrical products Other electrical and electronic products Contact current test for electrical and electronic products Electrical and electronic products and electronic information products Electrical and Electronic Products (EMC) QJ 165B-2014 General technical requirements for the installation of aerospace electronic and electrical products qj165b Aerospace electronic and electrical product installation Environmental requirements for aerospace electronic products Aerospace industry standard electronic product installation Avionics reflow soldering Welding fume recovery requirements qj 2003 qj3173 Chinese Spaceflight What are the standards for aerospace electronic products?

Scope

This standard specifies the environment, materials, equipment and welding process technology requirements for reflow soldering of aerospace electronic and electrical products. This standard applies to the soldering of single-sided, double-sided and multi-layer printed circuit board assemblies that use surface mounting and mixed mounting in aerospace electronic and electrical products.

More samples: JGJ 94-2008 GB 18306-2015 JJG 21-2008

Sample only — not a preview of QJ 3173-2003

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