SJ/T 10309-2016 in English

VALID

Solder resist for printed boards

Issued on:2016-01-15
Implemented on:2016-06-01
File Format:PDF
Delivery:Via email within 2~4 business days

Price(USD)： $399.00
$388.00

Standard No:	SJ/T 10309-2016
Document status:	VALID
Title in English:	Solder resist for printed boards
Title in Chinese:	印制板用阻焊剂
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 2~4 business days
Issued on:	2016-01-15
Implemented on:	2016-06-01
ICS Classification:	31.180-Printed circuits and boards
Chinese Classification:	L30-Printed circuit
Professional Classification:	SJ-Electronics
Related Keywords:	solder resist photosensitive solder resist interlayer adhesion solder resist performance grade system printed boards introduction core changes requirements level

Introduction

Core changes in the standard revision

Revision dimensions	1992 version	New content in the 2016 version
Definition of terms	Basic performance terms	Added 7 key terms such as electromigration and hydrolytic stability
Environmental protection requirements	Undefined	Added 6 new hazardous substance limits such as cadmium/lead/mercury (e.g. Cd≤0.01%)
Reliability test	Basic physical properties	Add 5 accelerated aging tests such as electromigration and interlayer adhesion

Solder resist performance grade system

The standard divides solder resist into three application grades:

Grade 1: Consumer electronics products (5% appearance defects allowed)
Grade 2: Industrial equipment (need to pass 500h electromigration test)
Grade 3: Medical/aerospace (requires 168h humidity and heat cycle test)

Typical case: After an automotive PCB manufacturer upgraded to Grade 2 solder resist, the insulation resistance in high temperature and high humidity environment increased by 300%.

Key Performance Indicator Analysis

Characteristics Before Curing

Project	Technical Requirements	Test Method
Viscosity Stability	±10% Fluctuation Range	GB/T 5547-2007
Harmful Substances	Cd≤0.01%, Pb≤0.1%	SJ/T 11365-2006

Characteristics After Curing

Project	Level 1 Requirements	Level 3 requirements
Electrical strength	>20kV/mm	>20kV/mm
Electrical migration resistance	≥2×10⁵Ω	Decrease<1 order of magnitude

Implementation suggestions

Material selection: Level 3 products recommend the use of liquid photosensitive solder resist (resistant to high temperature of 280℃)
Process control: The cured film thickness needs to be strictly controlled within the range of 12-16μm
Test focus: Products above level 2 must undergo 500h electromigration testing