YS/T 1561-2022 in English
VALIDTungsten-copper alloy plate
- Issued on:2022-09-30
- Implemented on:2023-04-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$233.00
| Standard No: | YS/T 1561-2022 |
| Document status: | VALID |
| Title in English: | Tungsten-copper alloy plate |
| Title in Chinese: | 钨铜合金板 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 1~3 business days |
| Issued on: | 2022-09-30 |
| Implemented on: | 2023-04-01 |
| Professional Classification: | YS-Non-ferrous Metal |
| Related Keywords: | tungsten-copper alloy plate introduction analysis
alloy series physical performance requirements performance parameterswcu50wcu30wcu10 thermal conductivity standard product classification system application recommendations selection guide application |
| Related Topics: | Copper Alloy Standard
tungsten Copper Alloy Standard Copper Tungsten Spectroscopy Copper Tungsten Spectroscopy Tungsten plate process Tungsten Copper Tungsten Alloy Prefabricated Fragments Tungsten Copper copper alloy YS/T 1562.3-2022 Tungsten copper industry Tungsten carbide copper alloy industry Tungsten copper alloy Copper tungsten alloy Military tungsten alloy beads ys/t 1523-2022 ys/t1568-2022 |
本文件规定了钨铜合金板的分类和标记、技术要求、试验方法、检验规则、标志、包装、运输、贮存及随行文件和订货单内容。
本文件适用于变形退火态和熔渗态的钨铜合金板。
Introduction
Analysis of the core content of the standard
Product classification system
The standard stipulates a total of 8 grades from WCu50 to WCu10, covering an alloy series with a copper content of 10%-50%. According to the processing technology, it is divided into:
| Process type | Thickness range(mm) | Typical application |
|---|---|---|
| Deformation annealing state(M) | 0.05-20.0 | Precision electronic components |
| Melt infiltration state(S) | 1.5-50.0 | High power heat dissipation devices |
Key technical indicators comparison
Physical performance requirements
| Performance Parameters | WCu50 | WCu30 | WCu10 |
|---|---|---|---|
| Thermal Conductivity (W/m·K) | ≥290 | ≥220 | ≥160 |
| Coefficient of Thermal Expansion (10-6/℃) | ≤13.3 | ≤9.4 | ≤6.5 |
| Electrical Conductivity (%IACS) | ≥54 | ≥42 | ≥27 |
Technology Evolution Analysis
Main improvements compared with the previous standard:
- New WCu15 and WCu10 grades to meet the demand for high tungsten content
- Refined thickness grouping of deformed annealed products (0.05-0.2mm group accuracy reaches ±0.02mm)
- Introduced quantitative indicators for unevenness (0.2-20mm thickness segment requires <0.3%)
Implementation and application recommendations
Selection guide
| Application scenarios | Recommended grades | Key indicators |
|---|---|---|
| High-power electronic packaging | WCu30-WCu40 | Thermal conductivity＞220W/m·K |
| High-precision electrode materials | WCu20-M | Thickness tolerance±0.03mm |
| Aerospace high-temperature resistant components | WCu10-S | Thermal expansion coefficient≤6.5 |
Key points of quality control
- The density uniformity of infiltrated products should be tested (the allowable fluctuation range is ±0.5g/cm3)
- For thin plates (＜1mm), it is recommended to select Class I dimensional tolerance
- The conductivity test should be carried out in accordance with GB/T32791 class=instrument>Eddy Current Tester
Notes on the implementation of the standard
Special attention should be paid to:
- The order form must clearly indicate the deviation level (if not specified, it is assumed to be Level II)
- Surface grinding is allowed for deformed annealed products, but the thickness must not be less than the lower limit
- Both the supplier and the buyer need to take samples together during arbitration inspection
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