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intermediate alloy ingot specified alloy ingot copper-beryllium master alloy alloy ingot polymers total migration test storage life
YS/T 260-2016 in English

YS/T 260-2016 in English

VALID

Copper-beryllium master alloy ingot

  • Issued on:2016-04-05
  • Implemented on:2016-09-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $100.00
$97.00
Standard No: YS/T 260-2016
Document status: VALID
Title in English: Copper-beryllium master alloy ingot
Title in Chinese: 铜铍中间合金锭
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2016-04-05
Implemented on: 2016-09-01
Superseding: YS/T 260-2004 Copper-beryllium master alloy ingot
Professional Classification: YS-Non-ferrous Metal
Related Keywords: intermediate alloy ingot
specified alloy ingot
copper-beryllium master alloy
alloy
ingot
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GB/T 260-2016
GBT260-2016
GB/T260-2016
copper ingot execution
Copper-based master alloy standards
ys/t+1145-2016

本标准规定了铜铍中间合金锭的要求、试验方法、检验规则及标志、包装、运输、贮存和质量证明书和订货单(或合同)内容。
本标准适用于各种工艺生产的铜铍中间合金锭。主要用于铍青铜加工材和电子元件生产等。


Introduction

This standard specifies the technical requirements, testing methods, and inspection rules for a specific type of intermediate alloy ingot used in the production of copper alloys. It covers aspects such as chemical composition, physical properties, and dimensional specifications. The document also outlines the requirements for packaging, marking, and transportation. This standard applies to the production, quality control, and acceptance of the specified alloy ingot. It provides guidelines for manufacturers, suppliers, and users to ensure consistency and reliability in the product's performance. The content includes detailed procedures for sampling and testing to verify compliance with the established criteria. This standard is intended to support the manufacturing processes and quality assurance systems within the relevant industry sector.

*** Please note: This description may not be accurate, please refer to the official documentation.

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