Printed board welding industry

Printed board welding industry, Total:170 items.

The international standard classification for "Printed board welding industry" includes: Printed circuits and boards .

The Chinese standard classification for "Printed board welding industry" includes: Technical management , Printed circuit .

工业和信息化部

SJ/T 10309-2016 Solder resist for printed boards

Professional Standard - Electron

SJ/T 10309-1992 Solder resists for printed boards

Group Standards of the People's Republic of China

T/CPCA 9101-2010 Social accountability for printed circuit industry
T/CCSA 494-2024 Industrial internet technical requirements for industrial applications ─ printed circuit board manufacturing
T/CPCA/JPCA 4306-2011 Solder resists for printed boards

Professional Standard - Aviation

HB 6187-1989 Mounting and welding of printed board components for aviation

未注明发布机构

IPC J-STD-003D CHINESE-2022 Printed board solderability test

Professional Standard - Geology

DZ 57.12-1987 Time quota printed board for geological instrumentation industry

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 4677.10-1984 Test method of solderability for printed boards
GB/T 4588.10-1995 Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections

Professional Standard - Aquaculture

SC 108-1982 Soldering technical requirements and inspection methods for printed boards of fishing boat electronic equipment

Anhui Provincial Standard of the People's Republic of China

DB34/T 3365-2019 Determination of Solderability of Printed Circuit Boards by Edge Dip Method

Military Standard of the People's Republic of China-General Armament Department

GJB 5807-2006 Requirements for post solder cleaning of military PCB assembly

SCC

AS 3508.4:1987 Printed board assemblies - Acceptability of solder, printed boards and soldered joints - Pictorial representation
AS 3508.4:1990 Printed board assemblies - Acceptability of printed boards and soldered joints - Pictorial representation
AS 3508.4:1992 Printed board assemblies - Acceptability of printed boards and soldered joints - Pictorial representation
CEI EN 61188-5-1:2003 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
DANSK DS/EN 61188-5-1:2003 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
BS EN 61191-2:1999 Printed board assemblies-Sectional specification. Requirements for surface mount soldered assemblies
CEI EN 61188-5-3:2008 Printed boards and printed board assemblies - Design and use - - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
UNE 20621-7:1985 PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
DANSK DS/EN 61191-4:2017 Printed board assemblies – Part 4: Sectional specification – Requirements for terminal soldered assemblies
CEI EN 61191-4:2018 Printed board assemblies Part 4: Sectional specification - Requirements for terminal soldered assemblies
BS 2654-1:1956 Vertical mild steel welded storage tanks with butt welded shels for petroleum industry. Design and fabrication
BS 2654-1:1965 Vertical mild steel welded storage tanks with butt welded shels for petroleum industry. Design and fabrication

Korean Agency for Technology and Standards (KATS)

KS C IEC 61188-5-2:2009 Printed boards and printed board assemblies-Design and use-Part 5-2:Attachment(land/joint) considerations-Discrete components
KS C IEC 61188-5-8:2009 Printed board and printed board assemblies-Design and use-Part 5-8:Attachment(land/joint) considerations-Area array components(BGA, FBGA, CGA, LGA)
KS C IEC 61188-5-8:2013 Printed board and printed board assemblies－Design and use－Part 5-8：Attachment(land/joint) considerations－Area array components(BGA, FBGA, CGA, LGA)
KS C IEC 61188-5-5:2013 Printed boards and printed board assemblies－Design and use－Part 5-5：Attachment (land/joint) considerations－Components with gull-wing leads on four sides
KS C IEC 61188-5-5:2009 Printed boards and printed board assemblies-Design and use-Part 5-5:Attachment (land/joint) considerations-Components with gull-wing leads on four sides
KS C IEC 61188-5-4:2013 Printed boards and printed board assemblies－Design and use－Part 5-4：Attachment(land/joint) considerations－Components with J leads on two sides
KS C IEC 61188-5-4:2009 Printed boards and printed board assemblies-Design and use-Part 5-4:Attachment(land/joint) considerations-Components with J leads on two sides
KS C IEC 61188-5-3:2013 Printed boards and printed board assemblies－Design and use－Part 5-3：Attachment(land/joint) considerations－Components with gull-wing leads on two sides
KS C IEC 61188-5-3:2009 Printed boards and printed board assemblies-Design and use-Part 5-3:Attachment(land/joint) considerations-Components with gull-wing leads on two sides
KS C IEC 61188-5-6:2009 Printed boards and printed board assemblies &##8211; Design and use-Part 5-6:Attachment(land/joint) considerations-Chip carriers with J-leads on four sides
KS C IEC 61188-5-6:2013 Printed boards and printed board assemblies ? Design and use－Part 5-6：Attachment(land/joint) considerations－Chip carriers with J-leads on four sides
KS C IEC 61188-5-2-2013 Printed boards and printed board assemblies－Design and use－Part 5-2：Attachment(land/joint) considerations－Discrete components
KS C IEC 61188-5-1-2022 Printed boards and printed board assemblies－Design and use－Part 5－1：Attachment(land/joint) considerations－Generic requirements
KS C IEC 61188-5-4-2013 Printed boards and printed board assemblies－Design and use－Part 5-4：Attachment(land/joint) considerations－Components with J leads on two sides
KS C IEC 61191-4-2007(2017) Printed board assemblies－Part 4：Sectional specification－Requirements for terminal soldered assemblies
KS C IEC 61188-5-3-2013 Printed boards and printed board assemblies－Design and use－Part 5-3：Attachment(land/joint) considerations－Components with gull-wing leads on two sides
KS C IEC 62326-4-2011(2021) Printed boards－Part 4：Rigid multilayer printed boards with interlayer connections－Sectional specification
KS C IEC 62326-4-2011(2016) Printed boards－Part 4：Rigid multilayer printed boards with interlayer connections－Sectional specification
KS C IEC 61188-5-6-2013 Printed boards and printed board assemblies ? Design and use－Part 5-6：Attachment(land/joint) considerations－Chip carriers with J-leads on four sides
KS C IEC 61191-4-2022 Printed board assemblies－Part 4：Sectional specification－Requirements for terminal soldered assemblies
KS C IEC 61191-4-2007(2022) Printed board assemblies－Part 4：Sectional specification－Requirements for terminal soldered assemblies
KS C IEC 61188-5-8-2013 Printed board and printed board assemblies－Design and use－Part 5-8：Attachment(land/joint) considerations－Area array components(BGA, FBGA, CGA, LGA)
KS C IEC 60326-9-2003(2008) Printed boards－Part 9：Specification for flexible multilayer printedboards with through connections
KS C IEC 60326-11-2003(2008) Printed boards－Part 11：Specification for flex-rigidmultilayer printed boards with through connections

Association Francaise de Normalisation

NF C93-711-5-2*NF EN 61188-5-2:2004 Printed boards and printed board assemblies - Design and use - Part 5-2 : attachment (land/joint) considerations - Discrete components
NF C93-711-5-4*NF EN 61188-5-4:2016 Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides
NF C93-711-5-8*NF EN 61188-5-8:2016 Printed boards and printed board assemblies - Design and use - Part 5-8 : Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

German Institute for Standardization

DIN EN 61188-5-1:2003 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements (IEC 61188-5-1:2002); German version EN 61188-5-1:2002
DIN EN 61188-5-2:2004 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003
DIN EN 61188-5-5:2008 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007); German version EN 61188-5-5:2007
DIN EN 61188-5-3:2008 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007
DIN EN 61188-5-8:2008 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008
DIN EN 61188-5-4:2008 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007
DIN EN 61188-5-6:2003-10 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003
DIN EN 61188-5-2:2004-05 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003
DIN EN 61191-4:2018-05 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017 / Note: DIN EN 61191-4 (1999-06) remains valid alongside this standard until 2020-08-30.

Aerospace Industries Association/ANSI Aerospace Standards

AIA/NAS NAS 980-1975 Printed Circuit Board Soldering Machine Automatically Controlled (Rev. 1)

IPC - Association Connecting Electronics Industries

IPC 1071-2010 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
IPC 1071 CD-2010 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
IPC 1071A CD-2014 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
IPC/JEDEC J-STD-033C GERMAN-2012 Solderability Tests for Printed Boards
IPC/JEDEC J-STD-033C GERMAN CD-2012 Solderability Tests for Printed Boards (On CD-ROM - To Purchase Please Contact IHS Customer Care at +1 800 IHS-CARE (+1 800 447-2273) or visit www.ihs.com/CustomerCare)
IPC J-STD-003B CHINESE CD-2007 Printed board solderability test
IPC J-STD-003B CHINESE-2007 Printed board solderability test
IPC J-STD-003-1992 Solderability Tests for Printed Boards
IPC J-STD-003A-2003 Solderability Tests for Printed Boards
IPC J-STD-003C CD-2013 Solderability Tests for Printed Boards
IPC/JEDEC J-STD-033C CHINESE-2013 SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC J-STD-003C AMD 1-2014 Solderability Tests for Printed Boards
IPC J-STD-003C-2013 Solderability Tests for Printed Boards
IPC J-STD-003B CD-2007 Solderability Tests for Printed Boards
IPC A-600G CD-2004 Acceptability Printed Boards
IPC J-STD-001G DUTCH-2017 Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten
IPC 1071A-2014 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing (Effective Date: 6/21/2010)
IPC A-600H RUSSIAN-2010 Acceptability of Printed Boards
IPC A-600H JAPANESE-2010 Acceptability of Printed Boards
IPC A-600E-1995 Acceptability of Printed Boards
IPC A-600G CHINESE-2004 Acceptability of printed boards
IPC A-600G CHINESE CD-2004 Acceptability of Printed Boards
IPC A-600G JAPANESE-2004 Acceptability of printed boards
IPC A-600G JAPANESE CD-2004 Acceptability of printed boards
IPC A-600H CD-2010 Acceptability of Printed Boards
IPC A-600J CD-2016 Acceptability of Printed Boards
IPC A-600F FINNISH-1999 Piirilevyjen hyv?ksytt?vyys
IPC A-600J-2016 Acceptability of Printed Boards
IPC A-600G SWEDISH CD-2004 Acceptanskrav f?r m?nsterkort
IPC A-600J CHINESE-2016 Acceptability of Printed Boards
IPC A-600G AMD 1-2008 Acceptability of Printed Boards
IPC A-600H GERMAN-2010 Abnahmekriterien für Leiterplatten
IPC A-600H ERTA-2010 Acceptability of Printed Boards
IPC A-600H JAPANESE CD-2010 Acceptability of Printed Boards
IPC A-600H-2010 Acceptability of Printed Boards
IPC A-600H GERMAN CD-2010 Abnahmekriterien für Leiterplatten
IPC A-600G POLISH-2004 Kryteria Dopuszczenia Plyt Drukowanych
IPC A-600H CHINESE CD-2010 Acceptability of Printed Boards
IPC A-600J SPANISH-2016 Acceptability of Printed Boards
IPC A-600H CHINESE-2010 Acceptability of Printed Boards
IPC A-600J JAPANESE-2016 Acceptability of Printed Boards
IPC A-600J GERMAN-2016 Abnahmekriterien für Leiterplatten

British Standards Institution (BSI)

BS EN 61188-5-8:2008 Printed boards and printed board assemblies — Design and use — Part 5-8: Attachment (land/joint) considerations — Area array components (BGA, FBGA, CGA, LGA)
BS EN 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Attachment (land/joint) considerations - Components with gull- wing leads on four sides
BS EN 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Attachment (land/joint) considerations - Components with gull- wing leads on two sides
BS EN 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Attachments (land/joint) considerations - Components with J leads on two sides
BS EN 61188-5-2:2003 Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Discrete components
BS EN 61191-4:2017 Printed board assemblies - Sectional specification. Requirements for terminal soldered assemblies
BS EN 61191-4:1999 Printed board assemblies - Sectional specification - Requirements for terminal soldered assemblies
BS 4584 Sec.103.3:1992 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
BS 6221-25:2000 Printed wiring boards - Guide to the rework and repair of soldered surface mounted printed board assemblies
BS EN 61191-2:2017 Printed board assemblies - Sectional specification. Requirements for surface mount soldered assemblies
BS EN 61191-3:1999 Printed board assemblies - Sectional specification - Requirements for through-hole mount soldered assemblies

European Committee for Electrotechnical Standardization（CENELEC）

EN 61188-5-2:2003 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components
EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61188-5-8:2008 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
EN 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
EN 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
EN 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
EN 61188-5-6:2003 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides

RU-GOST R

GOST R IEC 61188-5-1-2012 Printed boards and printed boards assemblies. Design and use. Part 5-1. Attachment (land/joint) considerations. Generic requirements
GOST IEC 61188-5-2-2013 Printed boards and printed board assemblies. Design and use. Part 5-2. Attachment (land/joint) considerations. Discrete components
GOST IEC 61188-5-8-2013 Printed boards and printed board assemblies. Design and use. Part 5-8. Attachment (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
GOST IEC 61188-5-3-2013 Printed boards and printed board assemblies. Design and use. Part 5-3. Attachment (land/joint) considerations. Components with gull-wing leads on two sides
GOST IEC 61188-5-4-2013 Printed boards and printed board assemblies. Design and use. Part 5-4. Attachment (land/joint) considerations. Components with J leads on two sides
GOST IEC 61188-5-5-2013 Printed boards and printed board assemblies. Design and use. Part 5-5. Attachment (land/joint) considerations. Components with gull-wing leads on four sides
GOST IEC 61188-5-6-2013 Printed boards and printed board assemblies. Design and use. Part 5-6. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides
GOST R IEC 61191-4-2010 Printed boards assemblies. Part 4. Terminal mouting. Technical requirements

International Electrotechnical Commission (IEC)

IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

AWS - American Welding Society

A1.1-2001 Metric Practice Guide for the Welding Industry
A1.1-2016 Metric Practice Guide for the Welding Industry
A1.1-1998 Metric Practice Guide for the Welding Industry
A1.1-1980 METRIC PRACTICE GUIDE FOR THE WELDING INDUSTRY SECOND EDITION
PHB-5-2000 Everyday Pocket Handbook on Metric Practices for the Welding Industry

American National Standards Institute （ANSI)

ANSI/EIA 319-A:1970 Printed Wiring Boards, Solderability of
ANSI/EIA 406:1973 Connectors, Electrical, Printed-Wiring Board

American Welding Society (AWS)

AWS WHB-1.9 APP B Metric Practice Guide for the Welding Industry(Welding Handbook, Volume 1)
AWS PHB-5-2000 Everyday Pocket Handbook on Metric Practices for the Welding Industry

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC 9502-1999 PWB Assembly Soldering Process Guideline for Electronic Components

GSO

OS GSO IEC 61188-5-1:2014 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
BH GSO IEC 61188-5-1:2016 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
GSO IEC 61188-5-1:2014 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
OS GSO IEC 61188-5-2:2014 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
BH GSO IEC 61188-5-2:2016 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
GSO IEC 61191-4:2014 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
OS GSO IEC 61191-4:2014 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
GSO IEC 61191-3:2014 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

ES-UNE

UNE-EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use -- Part 5-1: Attachment (land/joint) considerations - Generic requirements (Endorsed by AENOR in January of 2003.)
UNE-EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use -- Part 5-2: Attachment (land/joint) considerations - Discrete components (Endorsed by AENOR in January of 2004.)
UNE-EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.)

Danish Standards Foundation

DS/EN 61188-5-1:2003 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
DS/EN 61188-5-2:2004 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
DS/EN 61191-2:1999 Printed board assemblies - Part 2: Sectional specification - Surface mount soldered assemblies
DS/EN 61191-4:2000 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assembly
DS/EN 61188-5-8:2008 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

US-ACEI

IPC A-600F-1999 Acceptability of Printed Boards

PL-PKN

PN A55605-1990 Fittings for the dairy industry Clamp and weld reducers

CZ-CSN

CSN ON 42 8309-1962 99.9% of copper plates are used in the printing industry. Standard

GOSTR

GOST R IEC 61191-4-2019 Printed board assemblies. Part 4. Installation of contacts. Technical requirements

VN-TCVN

TCVN 6611-9-2000 Printed boards.Part 9.Specification for flexible multilayer printed boards with through connections
TCVN 6611-11-2000 Printed boards.Part 11.Specification for flexrigid multilayer printed boards with through connections
TCVN 6611-10-2000 Printed boards.Part 10.Specification for flexrigid double sided printed boards with through connections

TH-TISI

TIS 2104-2001 Printed boards.part 11: specification for flex-rigid multilayer printed boards with through connections
TIS 2075-2001 Printed boards.part 9: specification for fiexible multilayer printed boards with through connections
TIS 2103-2001 Printed boards.part 10: specification for flex-rigid double-sided printed boards with through connections

AIA/NAS - Aerospace Industries Association of America Inc.

NAS980-1975 Printed Circuit Board Soldering Machine Automatically Controlled (Rev 1)

Others: Printed board industry,Stainless steel pipe fittings for the food and chemical industries - threaded pipe joints for expansion and welding