Semiconductor product temperature standard document

Semiconductor product temperature standard document, Total:109 items.

The international standard classification for "Semiconductor product temperature standard document" includes: Semiconductor devices in general , Plug-and-socket devices. Connectors , Semiconductor devices .

The Chinese standard classification for "Semiconductor product temperature standard document" includes: Technical Management , Power semiconductor device and parts , Semiconductor discrete devices in general , Dedicated processing equipment , Microcircuit in general .

Professional Standard - Electron

SJ/T 11089-1996 Letter symbols for discrete semiconductor components
SJ/Z 9021.1-1987 Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices
SJ/T 9533-1993 Grading standard of quality for semiconductor discrete devices

Professional Standard - Machinery

JB/T 7059-1993 Guide for Preparation of Standard for Power Semiconductor Modules
JB/T 5631-1991 Epitaxial Furnace for Semiconductor Devices. Energy Efficiency Standard
JB/T 6264.1-1992 Semiconductor Integrated Circuits. Specification for Special Circuit of SJ213CP Chinese & English Typewriters

未注明发布机构

JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)
DIN EN 4840-102 E:2019-10 Aerospace series - Heat shrinkable moulded shapes - Part 102: Elastomeric, semi-rigid, temperature range -75 to 150 °C - Product Standard

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 11499-2001 Letter symbols for discrete semiconductor devices
GB/T 15873-1995 Directives for drafting semiconductor facilities interface specification

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4:Coding system and classification into forms of package outlines for semiconductor device packages

Professional Standard - Military and Civilian Products

WJ/Z 251-1990 Guidelines for the preparation of new product standard system tables

British Standards Institution (BSI)

BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
BS 3934-1:1992 Mechanical standardization of semiconductor devices - Recommendations for the preparation of drawings of semiconductor devices
BS EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Temperature cycling
BS EN 60749-42:2014 Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage
BS IEC 60191-2:1966+A21:2020 Mechanical standardization of semiconductor devices. Dimensions
PD IEC/PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges
BS IEC 60747-14-11:2021 Semiconductor devices - Semiconductor sensors. Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
BS IEC 60191-2:1966+A18:2011 Mechanical standardization of semiconductor devices. Dimensions
BS EN 62258-1:2010 Semiconductor die products. Procurement and use
BS EN 62258-1:2006 Semiconductor die products - Requirements for procurement and use
BS EN 60191-4:2014+A1:2018 Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages
BS IEC 62373-1:2020 Semiconductor devices. Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Fast BTI test for MOSFET
BS EN 13604:2013 Copper and copper alloys. Semiconductor devices, electronic and vacuum products made from high conductivity copper
BS EN 60191-4:2014 Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
BS EN 4840-102:2019 Aerospace series. Heat shrinkable moulded shapes. Elastomeric, semi-rigid, temperature range -75 to 150 °C. Product Standard
BS EN 60191-6:2004 Mechanical standardization of semiconductor devices-Part 6:General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2009 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2005 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages

International Electrotechnical Commission (IEC)

IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
IEC 60191-1C:1974 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.
IEC 60191-1A:1969 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.
IEC PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges
IEC 60191-4:2013+AMD1:2018 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

SCC

MIL MIL-S-19500/335-1965 SEMICONDUCTOR DEVICE, SILICON, VOLTAGE REFERENCE (TEMPERATURE-STABLE) TYPE 1N430A, 1N430B
07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
BS IEC 60191-2:1966+A19:2012 Mechanical standardization of semiconductor devices. Dimensions
AS C379.2:1970 Mechanical standardization of semiconductor devices - Dimensions
BS IEC 60191-2:1966+A20:2018 Mechanical standardization of semiconductor devices-Dimensions
BS IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Dimensions
AS 3708.2:1989 Mechanical standardization of semiconductor devices - Dimensions
IEC 60191-1B:1970 Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Second supplement
SAE EIA4900-2016 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges
BS 3934-4:1992 Mechanical standardization of semiconductor devices-Recommendations for a coding system and classification into forms of package outlines for semiconductor devices
AS 3708.1:1989 Mechanical standardization of semiconductor devices - Preparation of drawings
BS PD IEC/PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges
BS 3934-6:1992 Mechanical standardization of semiconductor devices-Specification for the preparation of outline drawings of surface mounted semiconductor device packages
MIL MIL-S-19500/310-1965 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, GERMANIUM TYPE 2N2834 (NO S/S DOCUMENT)
DIN IEC 60191-6 E:2007 Draft Document - Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)
12/30263960 DC BS EN 60749-42. Semiconductor devices. Mechanical and climatic test methods. Temperature humidity storage
MIL MIL-S-19500/360-1966 SEMICONDUCTOR DEVICE, TRANSISTOR TYPES 2N2996 AND 2N2997 (NO S/S DOCUMENT)
MIL MIL-S-19500/163-1961 SEMICONDUCTOR DEVICE TRANSISTOR, NPN, SILICON TYPE 2N1072 (NO S/S DOCUMENT)
MIL MIL-S-19491F-1985 SEMICONDUCTOR DEVICES, PACKAGING OF (S/S BY MIL-S-19491G)
MIL MIL-S-19500/247-1962 SEMICONDUCTOR DEVICES TRANSISTOR, NPN, SILICON TYPE 2N1493 (NO S/S DOCUMENT)
05/30137514 DC IEC 60747-14-4. Discrete semiconductor devices. Part 14-4. Semiconductor accelerometers
DANSK DS/EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
CEI EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Government Electronic & Information Technology Association

GEIA SP4900-2002 Use of Semiconductor Devices Outside Manufacturers?Specified Temperature Ranges Comment Period Expires: May 27, 2002; ANSI/EIA-4900
GEIA-4900-2001 Use of Semiconductor Devices Outside Manufacturers?Specified Temperature Ranges

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JEP140-2002 Beaded Thermocouple Temperature Measurement of Semiconductor Packages
JEDEC JESD49B-2020 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)

GSO

GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers

American National Standards Institute （ANSI)

ANSI/NFPA 318-2011 Standard for the Protection of Semiconductor Fabrication Facilities

Institute of Electrical and Electronics Engineers (IEEE)

AIEE No 59-1962 (Supersedes AIEE No. 59, 1956 and AIEE Standard for Semiconductor Rectifier Components
IEEE Std 255-1963 IEEE Standard Letter Symbols for Semiconductor Devices
AIEE No 426-1958 AIEE Proposed Standard for Graphical Symbols for Semiconductor Devices

IEEE - The Institute of Electrical and Electronics Engineers@ Inc.

IEEE 662-1992 Standard Terminology for Semiconductor Memory (IEEE Computer Society Document)
IEEE 426-1958 Proposed Standard for GRAPHICAL SYMBOLS for SEMICONDUCTOR DEVICES
IEEE 1131-1987 STANDARD CRYOSTAT END-CAP DIMENSIONS FOR GERMANIUM SEMICONDUCTOR GAMMA-RAY SPECTROMETERS

Defense Logistics Agency

DLA MIL-STD-750 F-2012 TEST METHOD STANDARD FOR SEMICONDUCTOR DEVICES
DLA DSCC-DWG-94022 REV G-2000 SEMICONDUCTOR DEVICE, DIODE, STANDARD RECOVERY
DLA MIL-STD-750 E-2006 TEST METHOD STANDARD FOR SEMICONDUCTOR DEVICES
DLA MIL-S-19500/335 VALID NOTICE 4-2011 Semiconductor Device, Silicon, Voltage Reference (Temperature- Stable) Type 1N430A, 1N430B

Standard Association of Australia （SAA）

AS 4424:1996 Reference guide to Standards for semiconductor devices

European Standard for Electrical and Electronic Components

CECC MUAHAG VOL 9 IS 4-1993 Preferred Products List; Semiconductors (En)

American Society for Testing and Materials (ASTM)

ASTM D341-93(1998) Standard Test Method for Viscosity-Temperature Charts for Liquid Petroleum Products
ASTM F1211-89(1994)e1 Standard Specification for Semiconductor Device Passivation Opening Layouts

German Institute for Standardization

DIN EN 4840-102:2020 Aerospace series - Heat shrinkable moulded shapes - Part 102: Elastomeric, semi-rigid, temperature range -75 to 150 ？C - Product Standard; German and English version EN 4840-102:2019
DIN EN 13604:2013 Copper and copper alloys - Semiconductor devices, electronic and vacuum products made from high conductivity copper; German version EN 13604:2013
DIN EN 60749-25:2004-04 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2006-0...

JP-JEITA

JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)

Association Francaise de Normalisation

NF EN 3373-012:2006 Aerospace series - Terminals and extensions for crimping electrical conductors - Part 012: insulated extensions for crimping copper conductors, temperature up to 150oC - Product standards
NF EN 3373-013:2006 Aerospace series - Terminals and extensions for crimping electrical conductors - Part 013: insulated extensions, moisture resistant, for crimping copper conductors, temperature up to 260oC - Product standards
NF EN 4840-102:2019 Aerospace Series - Heat Shrink Sleeves - Part 102: Semi-Rigid Elastomer, Temperature Range -75oC to 150oC - Product Standard
NF C96-022-42*NF EN 60749-42:2015 Semiconductor devices - Mechanical and climatic test methods - Part 42 : temperature humidity storage
NF L09-503:1978 Standardized electrical cables. Code for operating temperatures and for type of conductor coating.
NF C96-022-25*NF EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25 : temperature cycling.

Korean Agency for Technology and Standards (KATS)

KS C IEC PAS 62240-2008(2018) Use of semiconductor devices outside manufacturers specified temperature range
KS C IEC PAS 62240-2023 Use of semiconductor devices outside manufacturers specified temperature range

Underwriters Laboratories (UL)

UL 1557-2022 UL Standard for Safety Electrically Isolated Semiconductor Devices

CZ-CSN

CSN 35 8797 Cast.11 IEC 747-11 Z1:1993 Semiconductor device. Part 11: Standards for discrete components
CSN 35 8797 Cast.11 IEC 747-11 ZA2:1997 Semiconductor device. Part 11: Standards for discrete components
CSN 35 8760-1973 Seraiconductors. Stabilizing diodes. Measurement of voltage temperature coefficient

RU-GOST R

GOST R 57439-2017 Semiconductor devices. Basic dimensions

KR-KS

KS C IEC PAS 62240-2008(2023) Use of semiconductor devices outside manufacturers specified temperature range

ASD-STAN - Aerospace and Defence Industries Association of Europe - Standardization

PREN 4840-102-2018 Aerospace series Heat shrinkable moulded shapes Part 102: Elastomeric@ semi-rigid@ temperature range -75 to 150 °C Product Standard (Edition P 1)

Danish Standards Foundation

DS/EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

AENOR

UNE-EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling

Others: