GB/T 15022-1994 in English

SUPERSEDED

Definitions and general requirements for solventless polymerisable resinous compounds used for electrical insulation

Issued on:1994-04-12
Implemented on:1994-12-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $180.00
$175.00

Standard No:	GB/T 15022-1994
Document status:	SUPERSEDED
Superseded by:	GB/T 15022.1-2009 Resin based reactive compounds used for electrical insulation - Part 1: Definitions and general requirements
Superseded on:	2009-12-01
Title in English:	Definitions and general requirements for solventless polymerisable resinous compounds used for electrical insulation
Title in Chinese:	电气绝缘无溶剂可聚合树脂复合物定义和一般要求
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	1994-04-12
Implemented on:	1994-12-01
ICS Classification:	29.040.20-Insulating gases
Chinese Classification:	K15-Electrical insulating material and its products
Professional Classification:	GB-National Standard
Related Keywords:	polymerisable resinous compounds solvent-free polymerizable resin compounds general requirements electrical insulation scopethis standard compounds
Related Topics:	Complex reconstitution, request Reconstitution Definition Reconstitution Definition Reconstitution and Reconstitution gb15022 Resin resolubility General solvent in gas phase GBT15022 GBT15022~15023 GB/T 15022-1994 electrical insulation Polymer Resin Stability Electrical insulating polymer resin gb/t 15022

《GB/T 15022-1994电气绝缘无溶剂可聚合树脂复合物定义和一般要求》由TC51（全国绝缘材料标准化技术委员会）归口，主管部门为中国电器工业协会。
本标准规定了电气绝缘无溶剂可聚合树脂复合物（以下简称复合物）的代号、定义和一般要求。本标准适用于由一种或几种化学活性成份组成都的树脂或弹性体复合物。通常必于这类复合物的有浇铸树脂、浸渍树脂、灌注胶、埋封胶、包封胶、胶泥和涂敷粉末。它们可在不施加压力下，通过加热或不加热固化成产品，固化时无惰性挥发物逸出。

Scope

This standard specifies the codes, definitions and general requirements for electrical insulating solvent-free polymerizable resin compounds (hereinafter referred to as compounds). This standard applies to resin or elastomer compounds composed of one or more chemically active ingredients. Commonly included in this category of compounds are casting resins, impregnating resins, potting compounds, embedding compounds, encapsulating compounds, mastics and coating powders. They can be cured into products without the application of pressure, with or without heat, and without the evolution of inert volatiles during curing.

More samples: YD/T 3934-2021 GB 50021-2001(2009) JGJ 94-2008

Sample only — not a preview of GB/T 15022-1994