GB/T 3131-2020 in English
VALIDTin-lead solder
- Issued on:2020-09-29
- Implemented on:2021-08-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$243.00
《GB/T 3131-2020锡铅钎料》由TC243（全国有色金属标准化技术委员会）归口，TC243SC2（全国有色金属标准化技术委员会重金属分会）执行，主管部门为中国有色金属工业协会。
Introduction
Core changes in the standard revision
| Revision dimensions | 2001 version | 2020 version | Technical impact |
|---|---|---|---|
| AA-level impurity content | Sb≤0.05% | Sb≤0.03% | Improve high-precision welding reliability |
| Silver content adjustment | Sn5PbAg(1.0-2.0%) | 2.3-2.7% | Enhance high-temperature welding performance |
| New grades | - | S-Sn43PbBiAA, etc. | Meet the needs of low-temperature welding |
Analysis of key technical indicators
1. Chemical composition optimization
AA-grade solder has stricter impurity control: Fe content is reduced from 0.02% to 0.01%, and As content is reduced from 0.015% to 0.01%, effectively reducing the risk of electron migration.
2. Upgrade of flux characteristics
- Delete the mandatory requirement of rosin and change to resin-based flux classification (R/RA/RMA)
- The expansion rate requirement is increased to ≥85% (RA type)
- Copper mirror corrosion test is included in the mandatory inspection
Typical application cases
5G communication equipment welding: It is recommended to use S-Sn63PbAgAA (Ag 1.8-2.2%), whose 183℃ eutectic properties can meet the precision welding requirements of high-frequency PCBs.
Welding of temperature-sensitive components: The newly added S-Sn43PbBiAA (melting point 135-165℃) is suitable for secondary welding scenarios such as thermistors.
Implementation suggestions
- The electronics industry gives priority to AA-grade solder, especially the silver-containing series
- For welding wires with a diameter of ≤0.3mm, pay attention to the new tolerance requirement of ±0.02mm
- For flux selection, refer to the supporting standard of GB/T 15829
Loading PDF document...
Error loading PDF. Please make sure the file is valid and try again.
We also recommend
-
GB/T 20510-2024 in English
Indium-tin oxide target
2024-09-29 -
GB/T 3610-2010 in English
Zinc wafer for dry cell
2011-01-10 -
GB/T 8012-2013 in English
Casting tin-lead solders
2013-12-17 -
GB/T 26045-2025 in English
Lead alloys ingot for accumulator cell slab lattice
2025-10-31 -
GB/T 469-2023 in English
Lead ingots
2023-08-06 -
GB/T 6890-2012 in English
Zinc powder
2012-12-31
