GB/T 3131-2001 in English

Tin-lead solder

1 Scope

This standard specifies the requirements, test methods, inspection rules as well as marking, packaging, transportation and storage of tin-lead solder.

It is applicable to tin-lead solder for manufacturing and welding telecommunication equipment, electrical appliances, power instruments, meters and other machinery manufactured by pressure processing method.

2 Normative references

The following standards contain provisions which, through reference in this standard, constitute provisions of this standard. At the time of publication, all the editions listed are valid. All standards are subject to revision, and all parties using this standard are encouraged to investigate the possibility of applying the latest editions of the following standards.

GB/T 6208-1995 Filler metal for soft soldering and brazing - Designation
GB/T 8145-1985 Gum rosin
GB/T 10574-1989 Methods for chemical analysis of tin-lead solders
GB/T 14020-1992 Hydrogenated rosin
GB/T 15829.2-1995 Soldering fluxes - Resin basis fluxes

3 Requirements

3.1 Product classification

Forward i
1 Scope
2 Normative references
3 Requirements
4 Test method
5 Inspection rules
6 Marking, packaging, transportation and storage
7 Contents of order (contract)
Annex A (Normative) Determination method of flux content
Annex B (Informative) Physical properties of tin-lead solder