GB/T 34178-2017 in English
VALIDSilica glass substrates for photomask
- Issued on:2017-09-07
- Implemented on:2018-08-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$214.00
《GB/T 34178-2017光掩模石英玻璃基板》由TC447（全国工业玻璃和特种玻璃标准化技术委员会）归口，主管部门为中国建筑材料联合会。
Introduction
1. Background and significance of standard formulation
Photomask quartz glass substrate is an important basic material in the fields of semiconductor integrated circuits, optical communications and micro-electromechanical systems (MEMS). With the rapid development of semiconductor technology, the requirements for photolithography are increasing day by day. GB/T 34178-2017 standard came into being, aiming to standardize the technical indicators and quality requirements of quartz glass substrates and ensure their reliability in high-precision photolithography.
2. Standard framework and technology evolution
| Standard dimensions | Technical requirements | Evolution analysis |
|---|---|---|
| Dimensional accuracy | ±0.20mm to ±0.30mm, depending on the side length | Compared with the previous version standard, the dimensional tolerance requirements are more stringent to meet the needs of higher resolution lithography. |
| Flatness | Optional range: 0.25μm to 10μm | Added grading requirements for different application scenarios, reflecting the flexibility and advancement of the technology. |
| Impurity content | Total impurity mass fraction ≤ 2.0μg/g | Limit the sum of the mass fractions of the three elements Li, Na, and K to ≤ 1.0μg/g to ensure material purity. |
3. Recommendations for standard implementation
3.1 Measurement and control of specifications and dimensions
It is recommended to use high-precision measuring equipment (such as laser thickness gauges and vernier calipers) to conduct a full inspection of the quartz glass substrate to ensure that the dimensional deviation is within the allowable range. For mass production, an automated inspection system can be established to improve efficiency.
3.2 Optimization strategy for flatness
Select appropriate flatness indicators for different application scenarios, and reduce surface deformation by improving the production process (such as improving polishing technology). It is recommended to calibrate the measuring equipment regularly to ensure data accuracy.
3.3 Detection and Control of Impurity Elements
Establish a complete impurity detection system and use advanced analytical instruments (such as ICP-MS) to monitor 13 key impurities. At the same time, optimize the raw material formula and production environment to reduce the introduction of impurities.
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