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silver alloy wire gold-plated silver alloy wire silver alloy bonding wires silver alloy wire case as6-type gold-plated silver alloy wire grid construction project ecological benefit dual system com+java+js core interface function analysis cryptographic operation service chain
GB/T 34502-2017 in English

GB/T 34502-2017 in English

VALID

Gold-coated silver and silver alloy bonding wires forsemiconductor package

  • Issued on:2017-09-29
  • Implemented on:2018-04-01
  • File Format:PDF
  • Delivery:Via email within 5 business days
Price(USD): $310.00
$301.00

《GB/T 34502-2017封装键合用镀金银及银合金丝》由TC243(全国有色金属标准化技术委员会)归口,TC243SC5(全国有色金属标准化技术委员会贵金属分会)执行,主管部门为中国有色金属工业协会。


Introduction

GB/T 34502—2017 Standard Overview

GB/T 34502—2017 "Gold-plated silver and silver alloy wire for package bonding" is an important standard in China's semiconductor packaging field, which stipulates the requirements, test methods, inspection rules, etc. for the use of gold-plated silver and silver alloy wire in semiconductor packaging. This standard is applicable to the fields of discrete devices, integrated circuits and LED packaging, and is a key reference for quality control in the semiconductor industry.

Comparison of standard frames

Standard dimensions Gold-plated silver wire (HSG) Gold-plated silver alloy wire (AS3, AS6, AS8, AS13)
Chemical composition Silver content: balance, gold content: ≤5.0% Silver content: balance, gold content: AS3 (≤9.0%), AS6/AS8 (≤6.0%), AS13 (≤12.0%)
Mechanical properties Minimum breaking force: depending on the diameter, ranging from 1.0 to 24.0 ×10⁻²N Minimum breaking force: AS3 (5.0~16.0 ×10⁻²N), AS6/AS8 (4.0~15.0 ×10⁻²N), AS13 (4.5~16.0 ×10⁻²N)
Diameter range 0.013mm~0.050mm 0.018mm, 0.020mm, 0.023mm, 0.025mm, 0.030mm, 0.038mm

Comparison of actual applications of gold-plated silver wire and silver alloy wire

Case 1: Application of gold-plated silver wire in LED packaging

In high-density LED packaging, when gold-plated silver wire is selected as the bonding material, its main advantage lies in its excellent conductivity and stability. For example, in the case of 0.025mm diameter, the minimum tensile force of HSG-type gold-plated silver wire is 8.0×10⁻²N, and the elongation is 2.0~19.0%, which can meet the needs of high-density packaging.

Case 2: Application of silver alloy wire in integrated circuits

For AS6-type gold-plated silver alloy wire, at a diameter of 0.030mm, its minimum tensile force is 12.0×10⁻²N, and the elongation is 2.0~20.0%. This material is particularly suitable for complex integrated circuit packaging that requires higher mechanical strength and corrosion resistance.

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