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Database: 365,228(8 Aug 2026)
high purity copper alloy target standards indicator category cual alloy cumn alloy purity requirement material property comparison cual alloy target alloy integrated circuit introduction core technical requirements online monitoring system sensor calibration straightedge basic management scopethis part
GB/T 39159-2020 in English

GB/T 39159-2020 in English

VALID

High purity copper alloy target for integrated circuit

  • Issued on:2020-11-19
  • Implemented on:2021-10-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $190.00
$185.00
Standard No: GB/T 39159-2020
Document status: VALID
Title in English: High purity copper alloy target for integrated circuit
Title in Chinese: 集成电路用高纯铜合金靶材
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2020-11-19
Implemented on: 2021-10-01
ICS Classification: 77.150.30-Copper products
Chinese Classification: H62-Heavy metals and their alloys
Professional Classification: GB-National Standard
Related Keywords: high purity copper alloy target
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《GB/T 39159-2020集成电路用高纯铜合金靶材》由TC243(全国有色金属标准化技术委员会)归口,TC243SC2(全国有色金属标准化技术委员会重金属分会)执行,主管部门为中国有色金属工业协会。


Introduction

Core Technical Requirements of Standards

Indicator Category CuAl alloy CuMn alloy
Purity requirement ≥99.9999%(Cu+Al) ≥99.9999%(Cu+Mn)
Key impurity control Ag≤0.3ppm, Fe≤0.2ppm Ag≤0.3ppm, Fe≤0.2ppm
Grain size(μm) Average value <50, maximum value <100 Ultrafine grain ≤5 (special process required)

Material property comparison

CuAl alloy target has better conductivity and thermal stability, and is suitable for process nodes below 90nm; while CuMn alloy target can improve film stress by adding manganese, and performs well in 3D NAND memory devices.


Key points for implementation

  1. Welding process control: Diffusion welding bonding rate must be ≥99%, and unwelded area ≤0.5%
  2. Grain detection: Use EBSD method (GB/T 36165) to detect ultrafine grain structure
  3. Surface treatment: Mirror processing requirement of Ra≤0.8μm

Technology evolution

This standard incorporates glow discharge mass spectrometry (YS/T 922) into the impurity detection method for the first time, and the detection limit reaches 10-7, which is two orders of magnitude higher than traditional ICP-MS.

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