GB/T 39159-2020 in English
VALIDHigh purity copper alloy target for integrated circuit
- Issued on:2020-11-19
- Implemented on:2021-10-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$185.00
《GB/T 39159-2020集成电路用高纯铜合金靶材》由TC243(全国有色金属标准化技术委员会)归口,TC243SC2(全国有色金属标准化技术委员会重金属分会)执行,主管部门为中国有色金属工业协会。
Introduction
Core Technical Requirements of Standards
| Indicator Category | CuAl alloy | CuMn alloy |
|---|---|---|
| Purity requirement | ≥99.9999%(Cu+Al) | ≥99.9999%(Cu+Mn) |
| Key impurity control | Ag≤0.3ppm, Fe≤0.2ppm | Ag≤0.3ppm, Fe≤0.2ppm |
| Grain size(μm) | Average value <50, maximum value <100 | Ultrafine grain ≤5 (special process required) |
Material property comparison
CuAl alloy target has better conductivity and thermal stability, and is suitable for process nodes below 90nm; while CuMn alloy target can improve film stress by adding manganese, and performs well in 3D NAND memory devices.
Key points for implementation
- Welding process control: Diffusion welding bonding rate must be ≥99%, and unwelded area ≤0.5%
- Grain detection: Use EBSD method (GB/T 36165) to detect ultrafine grain structure
- Surface treatment: Mirror processing requirement of Ra≤0.8μm
Technology evolution
This standard incorporates glow discharge mass spectrometry (YS/T 922) into the impurity detection method for the first time, and the detection limit reaches 10-7, which is two orders of magnitude higher than traditional ICP-MS.

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