integrated circuit

integrated circuit, Total:360 items.

The international standard classification for "integrated circuit" includes: Integrated circuits. Microelectronics , Electromechanical components for electronic and telecommunications equipment , Copper products , Identification cards and related devices , Optoelectronics. Laser equipment , Components for aerospace construction , Electrical engineering (Vocabularies) , IT applications in industry , Semiconductor devices in general , Space systems and operations , Plugs, socket-outlets, couplers , Information technology (IT) in general , Aerospace electric equipment and systems , IT applications in transport and trade , Nickel and chromium products , Energy and heat transfer engineering in general , Electricity. Magnetism. Electrical and magnetic measurements , Flat steel products and semi-products , IT applications in banking .

The Chinese standard classification for "integrated circuit" includes: Microcircuit in general , Semiconductor integrated circuit , Heavy metals and their alloys , Electronic industry production equipment in general , Film integrated circuit , Data medium , Dedicated processing equipment , Aerospace hydraulic elements and accessories , Special electronic technology material , Information processing technology in general , Basic standards and general methods , Computer application , Electronic components , Computer application , Technical management , Technical management , Technical Management , Technical management , Technical management , Hybrid integrated circuit , Technical management , Marking, packaging, transport and storage , Electrical system and equipment , Computer application , Technical management , Radio Measurement , Steel sheet and strip , Finance and Insurance .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 42973-2023 Semiconductor integrated circuits—Digital-analog（DA）converter
GB/T 43041-2023 Hybrid integrated circuits—DC/DC converter
GB/T 31441-2015 Electronic toll collection―Technical specification of IC card reader
GB/T 15138-1994 Case outlines for film integrated circuits and hybrid integrated circuits
GB/T 14620-1993 ceramic substrates for thin film integrated circuits
GB/T 39842-2021 Itegrated circuit (IC)card packaging framework
GB 35007-2018 Semiconductor integrated circuit low voltage differential signal circuit testing method
GB/T 17553.1-1998 Identification cards--Contactless integrated circuit(s) cards--Part 1:Physical characteristics
GB/T 17574.10-2003 Semiconductor devices—Integrated circuits—Part 2-10:Digital integrated circuits—Blank detail specification of integrated circuit dynamic read/write memories
GB/T 39159-2020 High purity copper alloy target for integrated circuit
GB/T 14620-2013 Alumina Ceramic Substrates for Thin Film Integrated Circuits
GB/T 43061-2023 Semiconductor integrated circuits—Test methods of PWM controller
GB/T 35005-2018 Test methods for flip chip integrated circuits
GB/T 18500.2-2001 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue - To - Digital converters(ADC)
GB/T 5965-2000 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section one - Blank detail specification for bipolar monolithic digital integrated circuit gates (exc
GB/T 42975-2023 Semiconductor integrated circuits—Test method of driver device
GB/T 12750-2006 Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
GB/T 17574.9-2006 Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-onl
GB/T 36479-2018 Integrated circuits—Test methods for column grid array
GB/T 15878-2015 Semiconductor integrated circuits―Specification of leadframes for small outline package
GB/T 14030-1992 principles of measuring methods of timer circuits for semiconductor integrated circuits
GB/T 40577-2021 Terminology for integrated circuit(IC) manufacturing equipment
GB/T 43796-2024 Remote operation and maintenance of integrated circuit packaging equipment—Data acquisition
GB/T 33140-2016 Phosphorized copper anode used for integrated circuit
GB/T 43538-2023 Quality and technical requirements for metal packages used for integrated circuits
GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier
GB/T 4376-1994 Series and products of voltage regulators for semiconductor integrated circuits
GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
GB/T 42836-2023 Microwave semiconductor integrated circuits—Frequency mixer
GB/T 17572-1998 Semiconductor devices--Integrated circuits Part 2:Digital integrated circuits Section four--Family specification for complementary MOS digital integrated circuits,series 4 000B and 4 000UB
GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC)
GB/T 7092-1993 Outline dimensions of semiconductor integrated circuits
GB/T 13062-1991 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T 2900.66-2004 Electrotechnical terminology - Semiconductor devices and integrated circuits
GB/T 20870.4-2024 Semiconductor devices—Part 16-4：Microwave intergrated circuits—Switches
GB/T 17024-1997 Semiconductor devices Integrated circuits Part2:Digital integrated circuits Section three—Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU
GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part 11:Section 1:Internal visual examination for semiconductor integrated circuits (excluding hybrid circuits)
GB/T 14619-1993 ceramic substrates for thick film integrated circuits
GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
GB/T 8976-1996 Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T 30962-2014 Identification cards—Integrated circuit cards—High capacity cards
GB/T 11498-1989 Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T 42970-2023 Semiconductor integrated circuits—Measuring methods of video encoder and decoder circuits
GB/T 16465-1996 Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T 41213-2021 Integrated circuit full automatic die bonder
GB/T 42838-2023 Semiconductor integrated circuits—Measuring method of Holzer circuit
GB/T 9178-1988 Terminology for integrated circuits
GB/T 43228-2023 Design requirements for space radiation-hardened integrated circuit standard cell library
GB/T 14028-2018 Semiconductor integrated circuits—Measuring method of analogue switch
GB/T 20296-2006 Mnemonics and symbols for integrated circuits
GB/T 36477-2018 Semiconductor integrated circuit—Measuring methods for flash memory
GB/T 17574.11-2006 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory
GB/T 18500.1-2001 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Bland detail specification for linear digital - To-analogue converters (DAC)
GB/T 36614-2018 Integrated circuits—Memory devices pin configuration
GB/T 36636-2018 Identification cards—Specification for dual-interface integrated circuit card module
GB/T 41033-2021 Design requirements of radiation hardening for CMOS IC
GB/T 12750-1991 Sectional specification for semiconductor integrated circuits, excluding hybrid circuits
GB/T 17023-1997 Semiconductor devices Integrated circuits - Part 2: Digital integrated circuits Section two - Family specification for HCMOS digital integrated circuits series 54/74HC, 54/74HCT, 54/74
GB/T 3430-1989 The rule of type designation for semiconductor integrated circuits
GB/T 17940-2000 Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits
GB/T 9424-1998 Semiconductor devices --Integrated circuits --Part 2:Digital integrated circuits --Section five --Blank detail specification for complementary MOS digital integrated circuits，series 4 0
GB/T 43040-2023 Semiconductor integrated circuits—Test method of AC/DC converters
GB/T 44798-2024 Design assurance guidelines for complex integrated circuits
GB/T 14113-1993 of packages for semiconductor integrated circuits
GB/T 14619-2013 Alumina Ceramic Substrates for Thick Film Integrated Circuits
GB/T 4377-2018 Semiconductor integrated circuits—Measuring method of voltage regulators
GB/T 12842-1991 Terminology for film integrated circuits and hybrid film integrated circuits
GB/T 20296-2012 Mnemonics and symbols for integrated circuits
GB/T 43931-2024 General specification for microwave integrated circuit chip for aerospace
GB/T 20515-2006 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
GB/T 43972-2024 Remote operation and maintenance of integrated circuit packaging equipment—Status monitoring
GB/T 17574-1998 Semiconductor devices --Integrated circuits Part 2:Digital integrated circuits
GB/T 16464-1996 Semiconductor devices Integrated circuits Part 1: General
GB/T 42839-2023 Semiconductor integrated circuits—Analog digital (AD) converter
GB/T 17574.20-2006 Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
GB/T 43454-2023 Design requirements of integrated circuit intellectual property (IP) core
GB/T 42974-2023 Semiconductor integrated circuits—Flash memory(FLASH)
GB/T 16466-1996 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T 44797-2025 Microwave hybrid integrated circuits—Synthesized frequency sources
GB/T 37959-2019 Information model for containing process chamber IC equipment design
GB/T 38345-2019 General design requirements of semiconductor integrate circuit for space application

Professional Standard - Electron

SJ/Z 2926-1988 Test methods for properties of mask-making equipment for manufacturing of ICs
SJ/T 11166-1998 Generic specification for sockets for integrated circuit (s ) card (IC card )
SJ 52440/1-1996 Detail specification of type M metal DIP for hybrid integrated circuits
SJ 52438/10-2001 Hybrid integrated circuits detail specification for type HMSF - 600 power filters
SJ/Z 11353-2006 Integrated circuit IP core transfer specification
SJ/T 11220-2000 General specification for Integrated Cards.Part 1:Basic specification for Cards
SJ 52438/4-1997 Hybrid integrated circuits - Detail specification for Type B - DTV3 temperature-voltage convertor
SJ 20295-1993 Detail specification for Type JT4344 phase-frequency detector of semiconductor integrated circuits
SJ 52438/1-1997 Hybrid integrated circuit-Detail specification for Type HDC28D15/1000 DC/DC converter
SJ 2521-1984 Sockets for dual in-line integrated circuits, Type CJZ
SJ/Z 11360-2006 Integrated circuit IP core signal integrity specification
SJ/T 10456-1993 Porcelain enameled steel substrate for hybrid integrated circuits
SJ 50597/23-1994 Semiconductor integrated circuits-Detail specification for type JJ710 voltage comparator
SJ 51420/3-2003 Detail specification of ceramic PGA for semiconductor integrated circuits
SJ/T 9534-1993 Grading standard of quality for semiconductor integrated circuits
SJ 52438/3-1997 Hybrid integrated circuits - Detail specification for Type B-LB18 low pass active filter
SJ/T 10334-1993 Series and products of audio circuits of semiconductor integrated circuits
SJ 20163-1992 Detail specification of Ju8086 microprocessor for semiconductor integrated circuits
SJ/T 10111-1991 Automatic measuring instruments for integrated circuits for Type GH3123
SJ/Z 11361-2006 Integrated circuit intellectual property core protection:schemes alternatives and discussion
SJ 51420/1-1996 Detail specification of type D ceramic DIP for semiconductor integrated circuits
SJ/T 10455-1993 Copper conductor paste for thick film hybrid integrated circuits
SJ 50597/36-1995 Semiconductor integrated circuits - Detail specification for Type JC54HC08, JC54HC11, JC54HC32, JC54HC86 HCMOS gates
SJ/T 10147-1991 Package tubes against static for integrated circuits
SJ 52438/8-2001 Hybrid integrated circuits Detail specification for type HCA2 charge amplifiers
SJ 50597/56-2002 Semiconductor integrated circuits - Detail specification for type JW920 PIN driver
SJ/T 10805-2018 Semiconductor integrated circuits Measuring methods for voltage comparators
SJ/Z 11359-2006 Taxonomy of functional verification for integrated circuit IP core development and integration
SJ 50597/49-1997 Hybrid integrated circuits-Detail specification for Type HCHF01 frequency differencing and channel seperation
SJ/T 10741-1996 Semiconductor integrated circuits--General principles of measuring methods for CMOS circuits
SJ 20298-1993 Detail specification for Types JB555 and JB556 precision timers of semiconductor integrated circuits
SJ/T 10152-1991 Terms relating to main equipment for integrated circuit technologies
SJ 20874-2003 General specification for sockets for test for surface mounting integrated circuits
SJ 20802-2001 Visual inspection criteria for integrated circuits metal packages
SJ 50597.11-1994 Detail specification for type Jμ82289 bus arbiter of semiconductor integrated circuits
SJ 51420/2-1998 Detail specification of Type F ceramic FP for semiconductor integrated circuits
SJ 3181-1989 Graphic base of electronic elements - IC Graphic
SJ 20157-1992 Detail specification for types JT54LS32 and JT54LS86 OR GATES of LS-TTL semiconductor integrated circuits
SJ/T 10831-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CD7193CP chrominance processing circuits
SJ/T 10308-1992 Detail specification of ceramic flat package for semiconductor integrated circuits
SJ 50597/34-1995 Semiconductor integrated circuits - Detail specification for Types JC4085, JC4086, JC4070, JC4077 CMOS gates
SJ 52438/6-2000 Hybrid integrated circuits - Detail specification for type HDCD2815S15 DC/DC converter
SJ/T 11512-2015 Test methods of electronic pastes for integrated circuit performent
SJ 20142-1992 Microcrystalline glass substrate for military integrated circuit
SJ 2522-1984 Sockets for integrated circuits, Type LJZ
SJ 20237-1993 Verification regulation of model GH3123 IC automatic tester
SJ 2231-1982 Series and types of direct current voltage regulators for thick-film and thin-film integrated circuits
SJ/T 11702-2018 Semiconductor integrated circuit serial peripheral interface test method
SJ 2905-1988 Detail specification for electronic components--Voltage established circuits for type CHM9102 of hybrid thick-film integrated circuits
SJ 52438/9-2001 Hybrid integrated circuits detail specification for type HDCD2812D15 DC/DC converters
SJ 50597/48-1997 Hybrid integrated circuits-Detail specification for Type HMF01 double channel pulse signal isolation and amplification
SJ/T 10607-1994 Gate array design generals for semiconductor integrated circuits
SJ 2232-1982 Specification for metal packages of thick-film and thin-film integrated circuits
SJ/T 10741-2000 Semiconductor integrated circuits General principles of measuring methods for CMOS circuits
SJ/Z 11354-2006 Integrated circuit analog/mixed-signal IP core specification
SJ/T 10734-1996 Letter symbols for semiconductor integrated circuits - Letter symbols for electrical parameters
SJ/Z 11358-2006 Integrated circuit IP core model taxonomy
SJ/Z 11355-2006 Specification for integrated circuit IP/SoC functional verification
SJ 20646-1997 The measuring methods of DC/DC converters for hybrid integrated circuits
SJ 2520-1984 General specification for sockets for integrated circuits
SJ 20954-2006 Integrated circuits latch-up test
SJ 52438/14-2004 Hybrid integrated circuits detail specification for type HPA501J power amplifiers
SJ/T 11232-2001 General specification for integrated circuit cards Part 6:Security specification
SJ 52438/7-2000 Hybrid integrated circuits - Detail specification for Type HRV013 voltage reference, multichannel
SJ 50597.2-1994 Detail specification for types JH2014 HTL flip-flop of semiconductor integrated circuits
SJ/Z 2927-1988 Terminology for mask-making equipment for integrated circuits manufacturing
SJ/T 10176-1991 Detail specification of metal rhomb package for semiconductor integrated circuits
SJ 20875-2003 General specification for sockets for flat package integrated circuits
SJ/T 11508-2015 Positive Photoresist developer for Integrated Circuit
SJ 20758-1999 Semiconductor integrated circuits - Specification for CMOS gate array devices
SJ 50597/46-1997 Hybrid integrated circuits - Detail specification for Type HFB01 transformation circuit of amplitude modulation to phase modulation
SJ 2154-1982 Miorocrystal glass substrates for use in thick film integrated circuits
SJ/T 10335-1993 Series and products of semiconductor integrated circuits for use in TV
SJ/T 10745-1996 Mechanical and climatic test methods for semiconductor integrated circuits
SJ 50597/47-1997 Hybrid integrated circuits-Detail specification for Type HSXB01 phase locked loop with frequency doubler

Professional Standard - Aerospace

QJ 1528-1988 Semiconductor integrated circuit time base test method
QJ 3211-2005 Detail specification for hybrid integrated circuits type HB2824S12、HB2815D45 DC/DC converters
QJ 3067-1998 Detail Specification for JHB114 High Precision Temperature Control Circuit of Hybrid Integrated Circuit
QJ 1995A-1998 Specification for Acceptance of Integrated Circuit
QJ 3092-1999 Detailed Specifications for Semiconductor Integrated Circuit HCT or Gate or Not Gate
QJ 1971-1990 Graphical Symbols for Complex Function Integrated Circuits
QJ 2775-1995 Code for Package of Integrated Circuit
QJ 3066-1998 Detail Specification for JHB076 High-Power Bridge H Circuit of Hybrid Integrated Circuit
QJ 2922-1997 Detail Specification for JHB029 Low-pass Filter of Hybrid Integrated Circuit
QJ 2875-1997 Detailed Specification for CMOS Digital Gate Array of Semiconductor Integrated Circuit
QJ 786-1983 Semiconductor Integrated Circuits - Specifications for Screening
QJ 10006-2008 General Specification for Semiconductor Integrated Circuits for Aerospace
QJ 1995-1990 Specification for Acceptance of Integrated Circuits
QJ/Z 153-1985 Specification for MOS Integrated Circuit Mounting Process
QJ 2494-1993 Detailed specification for semiconductor integrated circuit drivers QZ2501, QZ2502 and QZ2503
QJ 1460-1988 Measuring Methods for Broadband Amplifiers of Semiconductor Integrated Circuits

Military Standard of the People's Republic of China-General Armament Department

GJB 9147-2017 Semiconductor integrated circuit operational amplifier test methods
GJB 2438/18-2011 Hybrid integrated circuits .Detail specification for type HMM201 voltage modulator
GJB 3233-1998 Semiconductor integrated circuit failure analysis procedures and methods
GJB 7715-2012 General requirements for military integrated circuit IP core
GJB 2438B-2017 General Specification for Hybrid Integrated Circuits
GJB 2438/15-2011 Hybrid integrated circuits .Detail specification for type HHJ28T515 DC/DC converter
GJB 2438/3-2011 Hybrid integrated circuits.Detail specification for B-DTV3 temperature-voltage converter
GJB 2438/14-2011 Hybrid integrated circuits .Detail specification for type HSR28S5F DC/DC converter
GJB 2438/16-2011 Hybrid integrated circuits .Detail specification for type HTC202 terminal control circuit
GJB 2438-1995 General Specification for Hybrid Integrated Circuits
GJB 1420B-2011 General specification for packages of semiconductor integrated circuits
GJB 2438/19-2011 Hybrid integrated circuits .Detail specification for type ZF2B20 V/I converter
GJB 2438/5-2011 Hybrid integrated circuits.Detail specification for type LB8061A moment current generator
GJB 2438/12-2011 Hybrid integrated circuits .Detail specification for type HDA502J DC/AC converter
GJB 2440A-2006 General specification for packages of hybrid integrated circuits
GJB/Z 42.2-1993 Military microcircuit series type spectrum semiconductor integrated circuit digital integrated circuit
GJB 1420-1992 General specification for packages of semiconductor integrated circuits
GJB 597B-2012 General specification for semiconductor integrated circuits
GJB/Z 42.4-1993 Military Microcircuit Series Spectrum Semiconductor Integrated Circuit Interfacer Integrated Circuit
GJB 2438/17-2011 Hybrid integrated circuits .Detail specification for type HFM203 current modulator
GJB 2438/9-2011 Hybrid integrated circuits.Detail specification for type HCA2 charge amplifier
GJB 2438/7-2011 Hybrid integrated circuits.Detail specification for STS-1(TH07)transverter of rotating speed
GJB/Z 42.1-1993 Military microcircuit series type spectrum semiconductor integrated circuit analog integrated circuit
GJB 10163-2021 Test method for moisture sensitivity classification of plastic packaged integrated circuits
GJB 2438/2-2011 Hybrid integrated circuits.Detail specifications for type YH112 of frequency converter
GJB 2438/4-2011 Hybrid integrated circuits Detail specification for type LB8338 outer synchronizing temperature controller
GJB 9389-2018 Integrated circuit lock test method
GJB 2438/11-2011 Hybrid integrated circuits.Detail specification for type HDA501J DC/AC converter

Professional Standard - Energy

DL/T 2813-2024 Evaluation Methods for Electromagnetic Compatibility of Power Integrated Circuits

Group Standards of the People's Republic of China

T/ZZB 2085-2021 Gravity integrated circuit handlers
T/ICMTIA pc008-2021 Nitric acid for integrated circuits
T/SICA 001-2020 Waste sulfuric acid in titanium dioxide manufacturing industry
T/QGCML 256-2022 Integrated circuit design engineering experiment box
T/ICMTIA BS0029-2022 Classification and definition of IC material product maturity level
T/ICMTIA BS0030-2022 IC material product classification

Beijing Provincial Standard of the People's Republic of China

DB11/T 1544-2018 Cleaner Production Evaluation Index System Integrated Circuit Manufacturing Industry
DB11/T 1764.8-2021 Water Ratings Part 8: Integrated Circuits

Ministry of Housing and Urban-Rural Development of the People's Replublic of China

GB 50809-2012 Code for design of silicon integrated circuits wafer fab
GB 51122-2015 Code for design of integrated circuit assembly and test factory

Professional Standard - Aviation

HB 5834-1983 Technical Specifications of TTL Integrated Circuit Screening for Aviation

National Metrological Verification Regulations of the People's Republic of China

JJG(电子) 04033-1989 BJ3123 type bipolar logic integrated circuit tester verification regulations
JJG(电子) 04035-1989 GR1732M digital integrated circuit test system verification regulations
JJG(电子) 04032-1989 BJ3122 (QL11) logic integrated circuit tester verification regulations
JJG(电子) 04031-1989 9200 Large-Scale Integrated Circuit Test System Verification Regulations
JJG(电子) 04021-1989 Specification for verification of BJ3110 model MOS integrated circuit testers
JJG(电子) 04034-1989 GR1731M type analog integrated circuit test system verification regulations
JJG(电子) 04039-1991 GH3112 Integrated Circuit Dynamic Logic Function Detector Verification Regulations

Professional Standard - Urban Construction

CJ/T 243-2007 Test methods for construction cause IC card
CJ/T 166-2014 Integrated circuit card application technology of construction cause
CJ/T 334-2010 Integrated circuit(IC) card gas flow-meter

Professional Standard - Non-ferrous Metal

YS/T 936-2013 Sputtering nickel vanadium alloy target used in integrated circuit device

Sichuan Provincial Standard of the People's Republic of China

DB51/T 3207-2024 Microwave Probes Application Specifications for Integrated Circuit Testing

Shanghai Provincial Standard of the People's Republic of China

DB31/ 506-2020 The norm of energy consumption per unit product of wafer fabrication in integrated circuits
DB31/ 738-2020 The norm of energy consumption per unit product of integrated circuit packaging

National Metrological Technical Specifications of the People's Republic of China

JJF 1179-2007 Calibration Specification of High Temperature Dynamic IC Burn-in System
JJF 1269-2010 Calibration Specification for IEPE Amplifiers

Professional Standard - Ferrous Metallurgy

YB/T 100-1997 Cold-rolled strips alloy 4J42K for IC leadframes

Professional Standard - Finance

JR/T 0045.1-2008 China Financial Integrated Circuit Card Test Specifications-Part 1
JR/T 0045.2-2008 China Financial Integrated Circuit Card Test Specifications-Part 2
JR/T 0025.1-2018 China financial integrated circuit card specifications - Part 1 : General principles

British Standards Institution (BSI)

BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits - Terminology
BS IEC 60748-2-20:2008 Semiconductor devices - Integrated circuits - Digital integrated circuits - Family specification - Low voltage integrated circuits
BS IEC 60748-2-20:2000 Semiconductor devices. Integrated circuits. Digital integrated circuits-Family specification. Low voltage integrated circuits
BS IEC 60748-4:1997 Semiconductor devices. Integrated circuits. Interface integrated circuits
BS IEC 60748-2:1998 Semiconductor devices. Integrated circuits. Digital integrated circuits
BS IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Digital integrated circuits
BS 6493-2-2.4:1989 Semiconductor devices. Integrated circuits-Recommendations for interface integrated circuits
BS 6493-2.3:1987 Semiconductor devices. Integrated circuits. Recommendations for analogue integrated circuits
BS 6493-2-2.2:1986 Semiconductor devices. Integrated circuits-Recommendations for digital integrated circuits
BS IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory - Blank detail specification for single supply integrated
BS IEC 63011-3:2018 Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon via
06/30153491 DC EN 60748-2-20. Semiconductor devices. Integrated circuits. Part 2-20. Digital integrated circuits. Family specification. Low voltage integrated circuits
BS EN 165000-5:1998 Film and hybrid integrated circuits - Procedure for qualification approval
BS IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Semicustom integrated circuits
BS EN 60747-16-3:2002 Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Frequency converters
BS EN 60747-16-1:2002 Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Amplifiers

Bureau of Indian Standards

IS/QC 760000-1994 Semiconductor Devices - Integrated Circuits - Generic Film Integrated Circuits and Hybrid Film Integrated Circuits
IS 12970-2-2021 Semiconductor Devices -Integrated Circuits - Part 2 Digital Integrated Circuits
IS/QC 760200-1995 Semiconductor Devices - Integrated Circuits - Sectional Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures
IS/QC 760101-1995 Semiconductor Devices - Integrated Circuits - Blank Detail Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of Qualification Approval Procedure
IS/QC 790131-1995 Semiconductor Devices - Integrated Circuits - Digital Integrated Circuits - Blank Detail Complementary MOS Digital Integrated Circuits (Series 4000 Band 4000 UB)
IS/QC 760201-1995 Semiconductor Devices - Integrated Circuits - Blank Detail Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures
IS/QC 760100-1995 Semiconductor Devices-Integrated Circuits Sectional Specification for film interated Circuits and Hybrid Film Interated Circuits on The Bassis Of Qualificationapproval Procedure
IS 5001 Pt.2-1973 Semiconductor Device and Integrated Circuit Drawing Guide Part II Integrated Circuits
IS/QC 790130-1995 Semiconductor Devices - Integrated Circuits - Digital Integrated Circuits - Blank Detail HCMOS Digital Integrated Circuits (Series 54/74 HC, 54/74 HCT, 54/74 HCU)

European Standard for Electrical and Electronic Components

EN 163100:1991 Sectional specification: film and hybrid integrated circuits
EN 163101:1991 Blank detail specification: film and hybrid integrated circuits

International Electrotechnical Commission (IEC)

IEC 63011-1:2018 Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
IEC 60748-2-20:2000 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits; Family specifications: Low voltage integrated circuits
IEC 60748-20:1988 Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
IEC 60748-2-20:2008 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
IEC 60748-4:1997 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
IEC 60748-3:1986 Semiconductor devices. Integrated circuits.. Part 3 : Analogue integrated circuits
IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
IEC 60748-4:1987 Semiconductor devices - Intergrated circuits.. Part 4: Interface integrated circuits.
IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
IEC 60748-2:1985 Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits (Amendment 1-1991) (Amendment 2-1993) (Edition 1.0)
IEC 60748-20:1988/AMD1:1995 Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
IEC 60748-2-6:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section six: blank detail specification for microprocessor integrated circuits
IEC 60748-3:1986/AMD2:1994 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 2
IEC 60748-3:1986/AMD1:1991 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 1
IEC 60748-2-4:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section four: family specification for complementary MOS digital integrated circuits; series 4000 B and 4000 UB

Korean Agency for Technology and Standards (KATS)

KS C IEC 63011-1:2022 Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology
KS C IEC 63011-1-2022 Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology
KS C IEC 60748-2-20:2002 Semiconductor devices － Integrated circuits － Part 2 － 20: Digital integrated circuits － Family specification － Low voltage integrated circuits
KS C IEC 60748-2-20-2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits
KS C IEC 60748-2-20:2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits
KS C IEC 60748-20:2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-1:2003 Semiconductor devices － Integrated circuits － Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits － Section 1: Requirements for internal visual examination
KS C IEC 60748-4-2004(2020) Semiconductor devices－Integrated circuits－Part 4：Interface integrated circuits
KS C IEC 60748-2-2001(2021) Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
KS C IEC 60748-4-2020 Semiconductor devices－Integrated circuits－Part 4：Interface integrated circuits
KS C IEC 60748-2-2001(2016) Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
KS C IEC 60748-3:2002 Semiconductor devices － Integrated circuits Part 3: Analogue integrated circuits
KS C IEC 60748-2:2001 Semiconductor devices － integrated circuits － Part 2: Digital integrated circuits
KS C IEC 60748-20:2003 Semiconductor devices － Integrated circuits － Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-2021 Semiconductor devices － integrated circuits － Part 2: Digital integrated circuits
KS C IEC 60748-3-2022 Semiconductor devices－Integrated circuits Part 3：Analogue integrated circuits
KS C IEC 60748-3-2002(2022) Semiconductor devices － Integrated circuits Part 3: Analogue integrated circuits
KS C IEC 60748-4:2004 Semiconductor devices － Integrated circuits － Part 4: Interface integrated circuits
KS C IEC 60748-3-2002(2017) Semiconductor devices － Integrated circuits Part 3: Analogue integrated circuits
KS C 6063-1978(2001) GLOSSARY OF TERMS USED IN INTEGRATED CIRCUIT
KS C IEC 60748-2-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-3-1:2002 Semiconductor devices － Integrated circuits － Part 3: Analogue integrated circuits － Section 1: Blank detail specification for monolithic integrated operational amplifiers
KS C IEC 60748-2-8:2002 Semiconductor devices － Integrated circuits － Part 2: Digital integrated circuits － Section 8: Blank detail specification for integrated circuits static read/write memories
KS C IEC 60748-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-5-2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-5:2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-5-2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-5:2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-2-3-2002(2022) Semiconductor devices － Integrated circuits － Part 2: Digital integrated circuits － Section 3: Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
KS C IEC 60748-5:2003 Semiconductor devices － Integrated circuits － Part 5: Semicustom integrated circuits
KS C IEC 60748-2-6-2002(2022) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits Section 6：Blank detail specification for microprocessor integrated circuits
KS C IEC 60748-2-6-2022 Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits Section 6：Blank detail specification for microprocessor integrated circuits
KS C IEC 60748-2-6-2002(2017) Semiconductor devices － Integrated circuits － Part 2: Digital integrated circuits Section 6: Blank detail specification for microprocessor integrated circuits

GCC Standardization Organization

GSO IEC 60748-2-20:2014 Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
GSO IEC 60748-4:2013 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
GSO IEC 60748-20:2014 Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
GSO IEC 60748-3:2014 Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
GSO IEC 60748-2:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
GSO IEC 60748-5:2015 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
GSO IEC 60748-2-4:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 4: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB

The Directorate General of Specifications and Metrology (DGSM)

OS GSO IEC 60748-2-20:2014 Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
OS GSO IEC 60748-4:2013 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
OS GSO IEC 60748-2:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
OS GSO IEC 60748-3:2014 Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
OS GSO IEC 60748-20:2014 Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
OS GSO IEC 60748-2-6:2014 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section 6: Blank detail specification for microprocessor integrated circuits

Danish Standards Foundation

DS/IEC 748-20:1990 Semiconductor devices. Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
DS/IEC 748-4:1993 Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits
DANSK DS/IEC 748-20:1989 Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
DS/IEC 748-3+Amd.1:1993 Semiconductor devices - Integrated circuits - Part 3: analogue integrated circuits
DS/IEC 748-2:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
DS/IEC 748-3:1993 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
DS/IEC 748-4+Amd.1:1993 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
DANSK DS/IEC 748-2-6:1993 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section six: Blank detail specification for microprocessor integrated circuits
DS/IEC 748-2-6:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Section six: Blank detail specification for microprocessor integrated circuits

Association Francaise de Normalisation

NF C96-042:1989 Semiconductor Devices Integrated circuits Part 2:Digital integrated circuits

German Institute for Standardization

DIN IEC 748-2:1990 Semiconductor devices integrated circuits Part 2: Digital integrated circuits
DIN IEC 47 A Sec 356 E:1995-02 Semiconductor Devices, Integrated Circuits — Part 5: Semicustom Integrated Circuits

Czech Standards Institute (UNMZ)

CSN IEC 748-3:1994 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
CSN IEC 748-2:1994 Semiconductor devices.Integrated circuits.Part 2:Digital integrated circuits
CSN IEC 748-4:1994 Semiconductor devices.Integrated circuits.Part 4:Interface integrated circuits
CSN 35 8720 Cast.2-1988 Integrated circuits. Dimensions
CSN IEC 748-20:1993 Semiductors devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Kingdom of Bahrain Testing and Metrology Directorate

BH GSO IEC 60748-2:2016 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
BH GSO IEC 60748-20:2016 Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
BH GSO IEC 60748-3:2016 Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
BH GSO IEC 60748-2-6:2016 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section 6: Blank detail specification for microprocessor integrated circuits

Polski Komitet Normalizacyjny (PKN)

PN T01303-03-1991 Semicondutor devices. Integrated circuits. Analogue integrated circuits. Measuring methods
PN T01610-1972 Information Processing Project Management Software Requirements
PN T01303-03-A1-1991 Semiconductor devices Integrated circuits Analogue integrated circuits Measuring methods Amendment 1

National Standardisation Body (ASRO)

SR CEI 748-3+A1-1991 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
STAS SR CEI 748-2/A1-1994 DISPOZITIVE CU SEMICONDUCTOARE Circuite integrate. Partea 2: Circuite integrate digitale

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC TA-721 EPIC Epic

Standard Association of Australia （SAA）

AS 2547.2.3:1987 Semiconductor devices Part 2-3: Integrated circuits Analog integrated circuits

Gosstandart of Russia

GOST 29107-1991 Semiconductor devices. Integrated circuits. Part 2. Digital integrated circuits
GOST 29109-1991 Semiconductor devices. Integrated circuits. Part 4. Interface integrated circuits
GOST 29108-1991 Semiconductor devices. Integrated circuits. Part 3. Analog integrated circuits

European Committee for Electrotechnical Standardization（CENELEC）

EN 165000-3:1996 Film and Hybrid Integrated Circuits Part 3: Self-Audit Checklist and Report for Film and Hybrid Integrated Circuit Manufacturers
EN 165000-5:1997 Film and Hybrid Integrated Circuits Part 5: Procedure for Qualification Approval

Japanese Industrial Standards Committee (JISC)

JIS X 6319-1:2023 Specification of implementation for integrated circuit cards -- Part 1: Integrated circuit cards with contacts
JIS X 6319-1:2005 Specification of implementation for integrated circuit(s) cards -- Part 1: Integrated circuit(s) cards with contacts
JIS X 6319-1:2010 Specification of implementation for integrated circuit cards -- Part 1: Integrated circuit cards with contacts