GB/T 20296-2012 in English
VALIDMnemonics and symbols for integrated circuits
- Issued on:2012-12-31
- Implemented on:2013-07-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$437.00
《GB/T 20296-2012集成电路记忆法与符号》由TC27(全国电气信息结构、文件编制和图形符号标准化技术委员会)归口,主管部门为国家标准化管理委员会。
Scope
This standard stipulates that the symbols and memory methods used for devices should be consistent with the limited symbols, and it is expected to achieve two purposes, namely: -- for the white box symbols, to give the standard name; -- for the gray box symbols, it is desirable to limit the scope of possible changes, White box symbol: A symbol whose functional behavior of the components in the symbol is fully described by a standardized method. The relevant rules and explanations can be found in Binary Logic Component Symbols and Application Notes, Analog Component Symbols, Application Notes, Gray Box Symbols: Symbols of Components in Symbols Functional behavior, often due to its complexity, some methods used by non-white-box symbols, especially symbols described by referenced supporting documents; relevant rules and explanations can be found in the symbols and application notes, this standard proposes white-box The concept of symbols and gray box symbols is convenient for designers to apply. This standard is applicable to the design of integrated circuits. In Chapter 3, the letter in the second column is W, indicating that the relevant symbols can be used in white box symbols and gray box symbols. The second column is the letter G, which means that the relevant mark can only be used in the gray box symbol, or can only be used in the white box symbol between the boxes (for example, as additional information of "power off"). In the place of m, m shall be replaced by the relevant value, identification number, cycle length, number of digits or sequence number according to the requirements of each case. Where m1×m2 appears, m1 shall be replaced by the number of words, and m2 shall be replaced by the number of digits per word. see symbol,

Loading PDF document...
Error loading PDF. Please make sure the file is valid and try again.
We also recommend
-

GB/T 14862-1993 in English
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
1993-01-02 -

GB/T 43931-2024 in English
General specification for microwave integrated circuit chip for aerospace
2024-06-29 -

GB/T 38446-2020 in English
Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films
2020-03-06 -

GB/T 19248-2003 in English
Test method for measuring the resistance of package leads
2003-07-02 -

GB/Z 43510-2023 in English
Integrated circuit TSV 3D package reliability test methods guideline
2023-12-28 -

GB/T 17023-1997 in English
Semiconductor devices Integrated circuits - Part 2: Digital integrated circuits Section two - Family specification for HCMOS digital integrated circuits series 54/74HC, 54/74HCT, 54/74
1997-10-07 -

GB/T 26112-2010 in English
Micro-electromechanical system technology—General rules for the assessment of micro-mechanical parameters
2011-01-10 -

GB/T 8976-1996 in English
Generic specification for film integrated circuits and hybrid film integrated circuits
1996-07-09 -

GB/T 32814-2016 in English
Fabrication Technology of Silicon Based MEMS Process Specification Based on SOI Silicon
2016-08-29