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Database: 365,228(8 Aug 2026)
test methods test dimension traditional tensile method micro-electromechanical system technology test methods test system main test indicators tensile property measurement shrinkage introduction interpretation compacting pollution-free food rainbow
GB/T 38446-2020 in English

GB/T 38446-2020 in English

VALID

Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films

  • Issued on:2020-03-06
  • Implemented on:2020-10-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $120.00
$117.00
Standard No: GB/T 38446-2020
Document status: VALID
Title in English: Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films
Title in Chinese: 微机电系统(MEMS)技术 带状薄膜抗拉性能的试验方法
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2020-03-06
Implemented on: 2020-10-01
ICS Classification: 31.200-Integrated circuits. Microelectronics
Chinese Classification: L55-Microcircuit in general
Professional Classification: GB-National Standard
Related Keywords: test methods test dimension traditional tensile method
micro-electromechanical system technology test methods
test system
main test indicators
tensile property measurement
Related Topics: MEMS
Tensile
mems
Ribbon
Thin film experiment
mems technology
Film Tensile Test
Film Tensile Test
mems technology
technical film
Film Tensile Test Method
Tensile performance tester
film pull
mems test system
microsystem technology
GBT38446
GB/T 38446-2020
Strip film
Electromechanical

《GB/T 38446-2020微机电系统(MEMS)技术 带状薄膜抗拉性能的试验方法》由TC336(全国微机电技术标准化技术委员会)归口,主管部门为国家标准化管理委员会。


Introduction

Analysis of the core content of the standard

This standard establishes a systematic mechanical properties evaluation system for key thin film materials in MEMS devices. The main test indicators include:

  • Elastic modulus: reflects the material's ability to resist elastic deformation
  • Yield strength: identifies the critical point where the material begins to undergo plastic deformation
  • Tensile strength: characterizes the material's maximum bearing capacity

Comparative analysis of test methods

Test dimension Traditional tensile method This standard method Advantage comparison
Sample size Millimeter level Micrometer level (length-to-thickness ratio>300) Adapt to MEMS process characteristics
Equipment requirements Universal testing machine Nanoindenter system Resolution up to 0.1%
Environmental control Conventional laboratory Precise temperature and humidity control Reduce the impact of thermal drift

Key technical points

Sample preparation specifications

Appendix A details the preparation process using the Deep Reactive Ion Etching (DRIE) process. Special attention should be paid to the following:

  1. The thickness of the adhesive layer needs to be controlled within the range of 10-20nm
  2. The patterning error should be <5% of the design size
  3. Residual stress release treatment is essential

Error compensation mechanism

According to the requirements of Appendix C, the test system needs to perform double compensation:

  • Thermal drift compensation: Eliminate environmental fluctuations through no-load baseline calibration
  • Spring stiffness compensation: Deduct the error introduced by the deformation of the instrument itself

Implementation suggestions

The following suggestions are made based on the experience of standard implementation:

  1. Preferably use diamond wedge indenter (radius ≈ sample thickness)
  2. The displacement rate should meet the order of L×10-4/s
  3. Three-dimensional laser confocal calibration is required before testing
  4. It is recommended to repeat the test for each group of samples ≥5 times

Sample only — not a preview of GB/T 38446-2020
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