mems

mems, Total:30 items.

The international standard classification for "mems" includes: Integrated circuits. Microelectronics , Other semiconductor devices .

The Chinese standard classification for "mems" includes: Microcircuit in general .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 26113-2010 Micro-electromechanical system technology—General rules for the assessment of micro-geometrical parameters
GB/T 28274-2012 Silicon-based MEMS fabrication technology—The basic regulation of layout design
GB/T 26112-2010 Micro-electromechanical system technology—General rules for the assessment of micro-mechanical parameters
GB/T 28276-2012 Silicon-based MEMS fabrication technology—Specification for dissolved wafer process
GB/T 38447-2020 Micro-electromechanical system technology—Fatigue testing method of MEMS structure using resonant vibration
GB/T 32817-2016 Semiconductor devices - Micro-electromechanical devices - Generic specification for MEMS
GB/T 28275-2012 Silicon-based MEMS fabrication technology—Specification for KOH etch process
GB/T 38446-2020 Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films
GB/T 32814-2016 Fabrication Technology of Silicon Based MEMS Process Specification Based on SOI Silicon
GB/T 26111-2010 Micro-electromechanical system technology—Terms

GB/T 33929-2017 Test methods of the performance for MEMS high g accelerometer
GB/T 34900-2017 Micro-electromechanical system technology-Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer
GB/T 34894-2017 Micro-electromechanical system technology-Measuring method for strain gradient measurements of MEMS microstructures using an optical interferometer

T/NLIA 002-2021 Simulation Specification for Potting Process of Automotive MEMS Pressure Sensor
T/AHEMA 23-2022 Technical Requirements of MEMS VOC Gas Sensor

SILI WAFER BOND TECH VLSI MEMS APPL-2002 Silicon Wafer Bonding Technology for VLSI and MEMS Applications

UNE-EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (Endorsed by AENOR in February of 2011.)

BS EN 62047-5:2011(2012) Semiconductor devices — Micro - electromechanical devices Part 5 : RF MEMS switches
BS IEC 62047-33:2019 Semiconductor devices. Micro-electromechanical devices - MEMS piezoresistive pressure-sensitive device
BS IEC 62047-30:2017 Semiconductor devices. Micro-electromechanical devices - Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
BS IEC 62047-32:2019 Semiconductor devices. Micro-electromechanical devices - Test method for the nonlinear vibration of MEMS resonators
BS EN 62047-9:2011(2012) Semiconductor devices — Micro - electromechanical devices Part 9 : Wafer to wafer bonding strength measurement for MEMS

IEC 62047-41:2021 Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
IEC 62047-4:2008 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specifications for MEMS
IEC 60050-523:2018/AMD1:2019 Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 523: Micro-electromechanical systems (MEMS)

DIN EN 62047-4:2011-03 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010

KS C IEC 62047-5:2015 Semiconductor devices - MEMS devices - Part 5: RF MEMS switches
KS C IEC 62047-5-2020 Semiconductor devices - MEMS devices - Part 5: RF MEMS switches