GB/T 28276-2012 in English
VALIDSilicon-based MEMS fabrication technology—Specification for dissolved wafer process
- Issued on:2012-05-11
- Implemented on:2012-12-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$204.00
《GB/T 28276-2012硅基MEMS制造技术 体硅溶片工艺规范》由TC336(全国微机电技术标准化技术委员会)归口,主管部门为国家标准化管理委员会。
Scope
This standard specifies the process requirements and process evaluation specifications that should be followed when processing MEMS devices using bulk silicon soluble wafer processing technology. This standard applies to the processing and quality inspection of the bulk silicon dissolution process.

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