GB/T 28275-2012 in English

VALID

Silicon-based MEMS fabrication technology—Specification for KOH etch process

Issued on:2012-05-11
Implemented on:2012-12-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $180.00
$175.00

Standard No:	GB/T 28275-2012
Document status:	VALID
Title in English:	Silicon-based MEMS fabrication technology—Specification for KOH etch process
Title in Chinese:	硅基MEMS制造技术氢氧化钾腐蚀工艺规范
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2012-05-11
Implemented on:	2012-12-01
ICS Classification:	31.200-Integrated circuits. Microelectronics
Chinese Classification:	L55-Microcircuit in general
Professional Classification:	GB-National Standard
Related Keywords:	koh etch process scopethis standard hydroxide corrosion process process requirements silicon-based mems fabrication technology specification process
Related Topics:	potassium oxide Silicon base mems Potassium hydroxide Potassium hydroxide preparation Potassium hydroxide mass Preparation of Potassium Hydroxide Silica Potassium Hydroxide Potassium hydroxide mass Manufacturing Technology Silicon base silicon-based technology silicon-based technology Manufacturing Technology Potassium Hydroxide Silicon Potassium hydroxide+ GBT28275 Potassium Hydroxide Standard Hydrogen generator technology Chemical fiber manufacturing process Deaerator Manufacturing Specifications Silicon oxide technology Potassium hydroxide preparation method Sodium hydroxide corrosive liquid Potassium hydrofluoride process requirements

《GB/T 28275-2012硅基MEMS制造技术氢氧化钾腐蚀工艺规范》由TC336（全国微机电技术标准化技术委员会）归口，主管部门为国家标准化管理委员会。

Scope

This standard specifies the process requirements that should be followed when using potassium hydroxide corrosion process to process MEMS devices. This standard applies to potassium hydroxide corrosion process and management.

More samples: GB 18306-2015 QC/T 942-2021 JJG 21-2008

Sample only — not a preview of GB/T 28275-2012

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