GB/T 14029-1992 in English

VALID

principles of measuring methods of analogue multiplier for semiconductor integrated circuits

Issued on:1992-01-02
Implemented on:1993-08-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $240.00
$233.00

Standard No:	GB/T 14029-1992
Document status:	VALID
Title in English:	principles of measuring methods of analogue multiplier for semiconductor integrated circuits
Title in Chinese:	半导体集成电路模拟乘法器测试方法的基本原理
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	1992-01-02
Implemented on:	1993-08-01
ICS Classification:	31.200-Integrated circuits. Microelectronics
Chinese Classification:	L55-Microcircuit in general
Professional Classification:	GB-National Standard
Related Keywords:	test methods basic principles analogue multiplier circuits scopethis standard methods
Related Topics:	Fundamental semi-dry principle test mock test semiconductor integrated circuit Test method and principle atomic simulation semi-preparation principle Principle of gas composition basic principles Basic Principles of Indirect Method Fundamentals of the indirect method The principle of semi-preparation Two Basic Principles of Spectroscopy Fundamentals of Spectroscopy Integrated Circuit Testing Principles and Methods Test Principle or Methodology Principles of Semiconductor Testing Rationale for Testing Working principle of gas collector Semiconductor Kelvin Test Principle Principle of side voltage test Collector principle multiplication Basic Principles of Photometry Semiconductor Kelvin Test Principle GBT14029 GB/T 14029-1992 The principle of semi-solid Semiconductor integrated circuit driving test method Test method for semiconductor integrated circuit driver Working principle of semiconductor brushing machine How battery simulator works ECV testing principle HPLC conductivity detector principle Hipot measuring cell short circuit principle Basic principles of conductometric concentration determination Battery cell HIPOT test principle Loop tester principle Principle and formula of magnetic permeability testing method Protoplast fusion method and principle Battery simulator test Basic principles of cross-linking modification methods Total carbon testing method headspace method principle Ferroelectric instrument testing principles and methods Principle of Chinese Fayan Open circuit potential test principles and methods Measurement methods and principles of conductivity Principle of protoplast fusion method How to connect hapten to carrier Methods and principles of protoplast fusion Basic methods and principles of turbidity measurement Basic principles and determination methods of colorimetry Text Simulator

《GB/T 14029-1992半导体集成电路模拟乘法器测试方法的基本原理》由TC78（全国半导体器件标准化技术委员会）归口，主管部门为工业和信息化部（电子）。
本标准规定了半导体集成电路模拟乘法器测试方法的基本原理。乘法器与运算放大器相同的静态与动态参数测试，可参照GB3442《半导体集成电路运算(电压)放大器测试方法的基本原理》。

Scope

This standard specifies the basic principles of the test methods for semiconductor integrated circuit analog multipliers (hereinafter referred to as devices or multipliers).

More samples: DL/T 368-2010 JC/T 2453-2018 QC/T 942-2021

Sample only — not a preview of GB/T 14029-1992

Loading PDF document...

Error loading PDF. Please make sure the file is valid and try again.

We also recommend

GB/T 26112-2010 in English

Micro-electromechanical system technology—General rules for the assessment of micro-mechanical parameters
2011-01-10
GB/T 43931-2024 in English

General specification for microwave integrated circuit chip for aerospace
2024-06-29
GB/T 28274-2012 in English

Silicon-based MEMS fabrication technology—The basic regulation of layout design
2012-05-11
GB/T 8976-1996 in English

Generic specification for film integrated circuits and hybrid film integrated circuits
1996-07-09
GB/T 7092-2021 in English

Outline dimensions of semiconductor integrated circuits
2021-03-09
GB/T 12842-1991 in English

Terminology for film integrated circuits and hybrid film integrated circuits
1991-04-28
GB/T 33922-2017 in English

Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances
2017-07-12
GB/T 14862-1993 in English

Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
1993-01-02
GB/T 46280.1-2025 in English

Specification for chiplet interconnection interface—Part 1: General principles
2025-08-19