Working principle of semiconductor brushing machine
Working principle of semiconductor brushing machine, Total:89 items.
The international standard classification for "Working principle of semiconductor brushing machine" includes: Electronic tubes , Integrated circuits. Microelectronics , Semiconductor devices in general .
The Chinese standard classification for "Working principle of semiconductor brushing machine" includes: Technical management , Microcircuit in general , Electrical insulating material and its products , Semiconductor discrete devices in general , Semiconductor integrated circuit .
Group Standards of the People's Republic of China
- T/QGCML 4122-2024 Semiconductor chip sorting machine
- T/ZAQ 10113-2022 Intermittent working life test equipment for semiconductor devices
- T/ZZB Q063-2022 Intermittent working life test equipment for semiconductor devices
National Metrological Verification Regulations of the People's Republic of China
- JJG(核工) 4-1991 Verification Regulations for Semiconductor Telescopes (Working Class)
Professional Standard - Electron
- SJ/T 10737-1996 Semiconductor integrated circuits - General principles of measuring methods for ECL circuits
- SJ/T 10882-1996 Semiconductor integrated circuits - General principles of measuring methods for linear amplifiers
- SJ/T 10741-2000 Semiconductor integrated circuits General principles of measuring methods for CMOS circuits
- SJ/T 10736-1996 Semiconductor integrated circuits - General principles of measuring methods for HTL circuits
- SJ/T 10805-2000 Semiconductor integrated circuits - General principles of measuring methods for voltage comparators
- SJ/T 10735-1996 Semiconductor integrated circuits General principles of measuring methods for TTL circuits
- SJ/T 10740-1996 Semiconductor integrated circuits - General principles of measuring methods for bipolar random access memories
- SJ/T 10880-1996 Semiconductor integrated audio circuits - General principles of measuring methods for stereo decoders
- SJ/T 10803-1996 Semiconductor integrated circuits used as interface circuits - General principles of measuring methods for line circuits
- SJ/T 10804-2000 Semiconductor integrated circuits.General principles of measuring methods for level translator
- SJ/T 10739-1996 Semiconductor integrated circuits - General principles of measuring methods for MOS random access memories
- SJ/T 10741-1996 Semiconductor integrated circuits--General principles of measuring methods for CMOS circuits
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会
- GB/T 35010.3-2018 Semiconductor die products—Part 3: Guide for handling, packing and storage
Professional Standard - Machinery
- JB/T 7622-1994 Organosilicone Lacquer Intended to Be Used in Power Semiconductor Device Production Process
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB 14031-1992 Basic principles of semiconductor integrated circuit analog phase-locked loop testing methods
- GB 14030-1992 Basic principles of semiconductor integrated circuit time-based circuit testing methods
- GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
- GB/T 14031-1992 principles of measruing methods of analogue phase - Loop for semiconductor integrated circuits
- GB/T 14030-1992 principles of measuring methods of timer circuits for semiconductor integrated circuits
- GB/T 14032-1992 principles of measuring methods of digital phase - Locked loop for semiconductor integrated circuits
- GB/T 6798-1996 Semiconductor integrated circuits-General principles of measuring methods of voltage comparators
- GB/T 14029-1992 principles of measuring methods of analogue multiplier for semiconductor integrated circuits
- GB/T 14028-1992 principles of measuring methods of analogue switches for semiconductor integrated circuits
- GB 14029-1992 Basic principles of semiconductor integrated circuit analog multiplier testing methods
- GB 14028-2018 Basic principles of semiconductor integrated circuit analog switch test methods
- GB/T 4377-1996 Semiconductor integrated circuits-General principles of measuring methods of voltage regulator
- GB 14032-1992 Basic principles of digital phase-locked loop testing methods for semiconductor integrated circuits
Taiwan Provincial Standard of the People's Republic of China
- CNS 13802-5-1997 Graphical Symbols for Diagrams (Semiconductors and Electron Tubes)
- CNS 13802.5-1997 Graphical Symbols for Diagrams (Semiconductors and Electron Tubes)
SE-SIS
- SIS SEN 01 26 51-1969 Symbols for electrical diagrams Semi-conductors
- SIS SS IEC 617-5:1987 Graphical symbols for diagrams - Semiconductors and electron tubes
- SIS SS 01 82 10-1983 Ergonomic principles in the design of work systems
British Standards Institution (BSI)
- 23/30450091 DC BS IEC 62899-203-2 Printed electronics. Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
- BS EN ISO 6385:2016 Ergonomics principles in the design of work systems
AT-ON
- ONORM E 1005-1987 Graphical symbols for diagrams; symbols for semiconductors and electron tubes
Defense Logistics Agency
- DLA SMD-5962-06208-2006 MICROCIRCUIT, DIGITAL, CMOS, DIGITAL SIGNAL PROCESSOR, MONOLITHIC SILICON
- DLA SMD-5962-83013 REV D-1995 MICROCIRCUIT, DIGITAL, CMOS, 8-BIT MICROPROCESSOR, CPU, MONOLITHIC SILICON
- DLA SMD-5962-94533-1994 MICROCIRCUIT, DIGITAL, CMOS, 32-BIT MICROPROCESSOR, MONOLITHIC SILICON
- DLA SMD-5962-89517 REV A-1994 MICROCIRCUIT, DIGITAL, CMOS, 16-BIT SLICE MICROPROCESSOR, MONOLITHIC SILICON
German Institute for Standardization
- DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
- DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
- DIN 50442-1:1981 Testing of semi-conductive inorganic materials; determination of the surface structure of circular monocrystalline semi-conductive slices; as-cut and lapped slices
- DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
- DIN 50441-4:1999 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 4: Slice diameter, diamter variation, flat diameter, flat length, flat depth
- DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
- DIN EN ISO 6385:2016-12 Ergonomics principles in the design of work systems (ISO 6385:2016); German version EN ISO 6385:2016
- DIN EN 60749-23:2011-07 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011 / Note: DIN EN 60749-23 (2004-10) remains valid alongside this standard unt...
SCC
- CEI EN 62779-3:2017 Semiconductor devices - Semiconductor interface for human body communication Part 3: Functional type and its operational conditions
- BS PD ES 59008-4-2:2001 Data requirements for semiconductor die. Specific requirements and recommendations-Handling and storage
- BS DD 202:1991 Ergonomic principles in the design of work systems
- DANSK DS/EN ISO 6385:2016 Ergonomics principles in the design of work systems
- CEI EN 60749-23/A1:2006 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- DANSK DS/EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- BS PD ES 59008-3:1999 Data requirements for semiconductor die-Mechanical, material and connectivity requirements
- DANSK DS/EN 60749-23/A1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- CEI EN 60749-23:2006 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- BS PD IEC TR 62240-2:2018 Process management for avionics. Electronic components capability in operation-Semiconductor microcircuit lifetime
CZ-CSN
- CSN IEC 617-5:1993 Graphical symbols for diagrams. Part 5: Semiconductors and electron tubes
- CSN 35 8733-1975 Semiconductor devices. Diodes. Measurement of reverse voltago (working voltago)
GSO
- GSO IEC 60749-19:2014 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
- GSO ISO 6385:2016 Ergonomic principles in the design of work systems
- OS GSO ISO 6385:2016 Ergonomic principles in the design of work systems
- BH GSO IEC 60749-23:2016 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- BH GSO ISO 6385:2017 Ergonomic principles in the design of work systems
- OS GSO IEC 60749-23:2014 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- GSO IEC 60749-23:2014 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
Association Francaise de Normalisation
- NF EN ISO 6385:2016 Ergonomic principles of work system design
- NF C96-022-23/A1*NF EN 60749-23/A1:2012 Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life.
- NF X35-001*NF EN ISO 6385:2016 Ergonomics principles in the design of work systems
RU-GOST R
- GOST 29106-1991 Semiconductor devices. Integrated circuits. Part 1. General
CO-ICONTEC
- ICONTEC 1819-1982 Ergonomic principles for work system design
Danish Standards Foundation
- DS/EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- DS/EN 60749-23/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
KR-KS
- KS A ISO 6385-2017 Ergonomic principles in the design of work systems
- KS C IEC 60749-23-2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
Korean Agency for Technology and Standards (KATS)
- KS A ISO 6385-2022 Ergonomic principles in the design of work systems
- KS C IEC 60749-23-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 23：High temperature operating life
- KS C IEC 60749-23:2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
- KS A ISO 6385-2017(2022) Ergonomic principles in the design of work systems
International Electrotechnical Commission (IEC)
- IEC 60749-23:2004/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- IEC 60749-23:2004+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
AENOR
- UNE-EN 60749-23:2005/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
- UNE-EN 60749-23:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
IEC - International Electrotechnical Commission
- IEC 60617-5:1996 Graphical Symbols for Diagrams Part 5: Semiconductors and Electron Tubes (Edition 2.0)
CU-NC
- NC 09-02-18-1986 Unified Elements System of Molds Dies, Stampers and Machine Devices. Dies. Guide Plate with Circular and Rectangular Working Surface. Design Specifications
