GB/T 14620-2013 in English
VALIDAlumina Ceramic Substrates for Thin Film Integrated Circuits
- Issued on:2013-11-12
- Implemented on:2014-04-15
- File Format:PDF
- Delivery:Via email within 1~3 business days
$204.00
《GB/T 14620-2013薄膜集成电路用氧化铝陶瓷基片》由339-1(工业和信息化部(电子))归口,主管部门为工业和信息化部(电子)。
本标准规定了薄膜集成电路用氧化铝陶瓷基片的要求、测试方法、检验规则、标志、包装、运输和贮存。
本标准适用于薄膜集成电路用氧化铝陶瓷基片(以下简称“基片”)的生产和采购,采用薄膜工艺的片式元件用氧化铝陶瓷基片也可参照使用。
Scope
This standard specifies the requirements, test methods, inspection rules, marking, packaging, transportation and storage of alumina ceramic substrates for thin film integrated circuits. This standard applies to the production and procurement of alumina ceramic substrates for thin film integrated circuits (hereinafter referred to as "substrates"), and alumina ceramic substrates for chip components using thin film technology can also be used as a reference.

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