Integrated circuit chip general

Integrated circuit chip general, Total:98 items.

The international standard classification for "Integrated circuit chip general" includes: Integrated circuits. Microelectronics , Electromechanical components for electronic and telecommunications equipment .

The Chinese standard classification for "Integrated circuit chip general" includes: Microcircuit in general , Electronic industry production equipment in general , Special electronic technology material , Semiconductor integrated circuit , Technical Management .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 41213-2021 Integrated circuit full automatic die bonder
GB/T 44775-2024 Integrated circuit 3D packaging— Requirement for die stack process and evaluation
GB/T 14620-1993 ceramic substrates for thin film integrated circuits
GB/T 14619-1993 ceramic substrates for thick film integrated circuits
GB/T 43931-2024 General specification for microwave integrated circuit chip for aerospace
GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC)
GB/T 43536.2-2023 Three dimensional integrated circuits—Part 2：Alignment of stacked dies having fine pitch interconnect
GB/T 14620-2013 Alumina Ceramic Substrates for Thin Film Integrated Circuits
GB/T 14619-2013 Alumina Ceramic Substrates for Thick Film Integrated Circuits

Ministry of Housing and Urban-Rural Development of the People's Replublic of China

GB 50809-2012 Code for design of silicon integrated circuits wafer fab

Group Standards of the People's Republic of China

T/CIE 071-2020 Evaluation of industrial high-reliability integrated circuits―Part 6:Bluetooth IC
T/ZSA 301-2025 Monolithic integrated coherent optical receiver chip
T/SLEIA 0004-2024 Technical specifications for long-term storage of integrated circuit chips

Military Standard of the People's Republic of China-General Armament Department

GJB 7715-2012 General requirements for military integrated circuit IP core
GJB 2438A-2002 General Specification for Hybrid Integrated Circuits
GJB 597B-2012 General specification for semiconductor integrated circuits
GJB 2438B-2017 General Specification for Hybrid Integrated Circuits

Fujian Provincial Standard of the People's Republic of China

DB35/T 1403-2013 Multi-chip integrated package LED downlight for lighting

Professional Standard - Electron

SJ/T 10456-1993 Porcelain enameled steel substrate for hybrid integrated circuits
SJ 20142-1992 Microcrystalline glass substrate for military integrated circuit
SJ/T 10243-1991 Microwave ceramic dielectric materials-Alumina ceramic substrates for microwave integrated circuits
SJ 2154-1982 Miorocrystal glass substrates for use in thick film integrated circuits
SJ/T 11220-2000 General specification for Integrated Cards.Part 1:Basic specification for Cards

Jiangsu Provincial Standard of the People's Republic of China

DB3202/T 1033-2022 Technical specifications for the prevention and control of occupational hazards in silicon integrated circuit chip manufacturing enterprises

Danish Standards Foundation

DS/EN 190000:1997 Generic Specification: Monolithic integrated circuits
DANSK DS/EN 190000:1997 Generic Specification: Monolithic integrated circuits
DANSK DS/EN 16602-60-12:2015 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)
DANSK DS/IEC 748-20:1989 Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
DANSK DS/EN 190100:2016 Sectional Specification: Digital monolithic integrated circuits

European Committee for Electrotechnical Standardization（CENELEC）

EN 190000:1995 Generic Specification Monolithic Integrated Circuits
DD ENV 190000-6-1993 Generic Specification: Monolithic Integrated Circuits Procedure for Approval and Quality Management
EN 190100:1993 Sectional Specification: Digital Monolithic Integrated Circuits

Swedish Institute for Standards

SIS SS-CECC 90000-1991 Generic specification: Monolithic integrated circuits
SIS SS CECC 90300-1988 Sectional specification: Interface monolithic integrated circuits
SIS SS CECC 90200-1988 Sectional specification: Analogue monolithic integrated circuits
SIS SS CECC 90100-1987 Sectional specification: Digital monolithic integrated circuits
SS-CECC 90200:1988 Sectional specification: Analogue monolithic integrated circuits

German Institute for Standardization

DIN EN 190000:1996-05 Generic specification: Monolithic integrated circuits; German version EN 190000:1995
DIN EN 16602-60-12:2014-12 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs); English version EN 16602-60-12:2014
DIN 58002:2001 Integrated optics - Near-field-measurement for single-mode optical chip components
DIN EN 190000:1996 Generic specification: Monolithic integrated circuits; German version EN 190000:1995
DIN EN 16602-60-12 E:2013 Draft Document - Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs); English version FprEN 16602-60-12:2013
DIN EN 16602-60-12 E:2013-12 Draft Document - Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs); English version FprEN 16602-60-12:2013
DIN 44476-2:1982 General term for semiconductor devices and integrated circuits and memory circuits
DIN EN 190100:1995-02 Sectional specification: Digital monolithic integrated circuits; German version EN 190100:1993
DIN 41850-1:1986 Integrated film circuits; substrates

Lithuanian Standards Office

LST EN 190000-2001 Generic specification. Monolithic integrated circuits
LST EN 190100-2001 Sectional specification. Digital monolithic integrated circuits

Association Francaise de Normalisation

NF EN 190000:2013 Generic Specification: Monolithic Integrated Circuits
NF C86-020*NF EN 190000:2013 Generic Specification : monolithic integrated circuits
NF C96-024:1990 Microcircuits Thermal modelisation of monolithic integrated circuits
NF C86-200*NF EN 190100:2013 Sectional specification : digital monolithic integrated circuits
NF L90-200-60-12*NF EN 16602-60-12:2016 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)
NF EN 190100:2013 Intermediate specification: monolithic digital integrated circuits

Spanish Association for Standardization (UNE)

UNE-EN 190000:1992 GENERIC SPECIFICATION: MONOLITHIC INTEGRATED CIRCUITS. (Endorsed by AENOR in January of 1996.)
UNE-EN 16602-60-12:2014 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs) (Endorsed by AENOR in November of 2014.)
UNE-EN 190100:1993 SS: DIGITAL MONOLITHIC INTEGRATED CIRCUITS. (Endorsed by AENOR in December of 1996.)

GCC Standardization Organization

GSO IEC 60748-23-1:2015 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
GSO IEC 60748-20:2014 Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

British Standards Institution (BSI)

BS IEC 63011-2:2018 Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect
BS IEC 62528:2007 Standard testability method for embedded core-based integrated circuits
DD ENV 190000-6:1994 Generic specification: monolithic integrated circuits. Procedure for approval and quality management
DD ENV 190000-6-1994 Generic specification: monolithic integrated circuits. Procedure for approval and quality management
BS CECC 90000:1985 Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits
BS EN 165000-1:1996 Film and hybrid integrated circuits. Generic specification. Capability approval procedure
BS IEC 63011-3:2018 Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon via

Gosstandart of Russia

GOST R 70969-2023 Integrated circuits based on master chips. Terms and definitions
GOST R 59749-2021 Monolithic microwave integrated circuits. Parameter system
GOST R 71376-2024 Integrated microcircuits. Filters. Method for measuring the noise voltage reduced to the input, the level of psophometric noise
GOST R 59702-2021 Monolithic microwave integrated circuits. Terms and definitions

International Electrotechnical Commission (IEC)

IEC 62528:2007 Standard testability method for embedded core-based integrated circuits
IEC 60748-3-1:1991 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; section 1: blank detail specification for monolithic integrated operational amplifiers

Institute of Electrical and Electronics Engineers (IEEE)

IEEE 1500-2005 Standard Testability Method for Embedded Core-based Integrated Circuits IEEE Computer Society document

Defense Logistics Agency

DLA SMD-5962-94667-1995 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 1750 CHIP SET, MULTICHIP MICROCIRCUIT, SILICON
DLA QML-38535-QPD-2011 Integrated Circuits (Microcircuits) Manufacturing, General Specification For
DLA MIL-PRF-38535 K-2013 INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
DLA QML-38535-2012 Integrated Circuits (Microcircuits) Manufacturing, General Specification For
DLA MIL-PRF-38535 J (1)-2012 INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
DLA QML-38535-2013 Integrated Circuits (Microcircuits) Manufacturing, General Specification for
DLA MIL-PRF-38535 J-2010 INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
DLA DSCC-VID-V62/07619-2013 MICROCIRCUIT, LINEAR, HEX INVERTERS, MONOLITHIC IC SILICON

Standards Norway

NS-EN 16602-60-12:2014 Space product assurance — Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)

Bureau of Indian Standards

IS/QC 760000-1994 Semiconductor Devices - Integrated Circuits - Generic Film Integrated Circuits and Hybrid Film Integrated Circuits
IS/QC 790202-1993 Semiconductor Devices - Integrated Circuits - Analogue Integrated Circuits - Blank Detail Monolithic Integrated Operational Amplifiers

American National Standards Institute （ANSI)

ANSI/IEEE 1500:2005 Standard Testability Method for Embedded Core-Based Integrated Circuits C/TT

Electrostatic Discharge Association (ESDA)

ESD EP110-2002 ON-CHIP ESD PROTECTION FOR INTEGRATED CIRCUITS

Military Standards (MIL-STD)

MIL MIL-PRF-38535K-2013 Integrated Circuits (Microcircuits) Manufacturing, General Specification for
MIL MIL-PRF-38535J-2010 Integrated Circuits (Microcircuits) Manufacturing, General Specification for
MIL MIL-PRF-38535L-2018 Integrated Circuits (Microcircuits) Manufacturing, General Specification for

The Directorate General of Specifications and Metrology (DGSM)

OS GSO IEC 60748-20:2014 Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Kingdom of Bahrain Testing and Metrology Directorate

BH GSO IEC 60748-20:2016 Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Korean Agency for Technology and Standards (KATS)

KS C IEC 60748-2-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 63011-2:2022 Integrated circuits — Three dimensional integrated circuits —Part 2: Alignment of stacked dies having fine pitch interconnect
KS C IEC 63011-2-2022 Integrated circuits — Three dimensional integrated circuits —Part 2: Alignment of stacked dies having fine pitch interconnect

Magyar Szabványügyi Testület

MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

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