GB/T 14619-1993 in English

SUPERSEDED

ceramic substrates for thick film integrated circuits

Issued on:1993-09-03
Implemented on:1993-01-02
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $100.00
$97.00

Standard No:	GB/T 14619-1993
Document status:	SUPERSEDED
Superseded by:	GB/T 14619-2013 Alumina Ceramic Substrates for Thick Film Integrated Circuits
Superseded on:	2014-04-15
Title in English:	ceramic substrates for thick film integrated circuits
Title in Chinese:	厚膜集成电路用氧化铝陶瓷基片
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	1993-09-03
Implemented on:	1993-01-02
Professional Classification:	GB-National Standard
Related Keywords:	ceramic substrates alumina ceramic substrates thick film circuits scopethis standard substrates
Related Topics:	Aluminum oxide Alumina Standard Substrate Alumina+ Film thickness standard sheet Gadolinium Oxide Ceramics Lithium Oxide Ceramics ceramic alumina Alumina Ceramics Inorganic aluminum oxide film GB/T 14619 Alumina ceramic substrate Alumina Ceramic Substrates for Thick Film Integrated Circuits GB/T 14619-2013 Film thickness standard sheet+ Alumina Ceramics Tantalum oxide film thickness thick film GBT14619 GB/T 14619-1993 GB/T 14619-2013 integrated circuit ceramic substrate Integrated circuit chip design Ceramic membrane related Alumina ceramic manufacturing Alumina Ceramic Standard Alumina Ceramic Sheet Execution Execution of Alumina Ceramics National standard for alumina ceramics Alumina ceramic tile testing standards Alumina ceramic industry Film thickness meter standard sheet Alumina porcelain tube standard Alumina porcelain tube industry Alumina ceramic national standard inspection Alumina ceramic conforms to Silicon carbide ceramic substrate group Cell thickness Alumina ceramics company Ceramic substrate thickness Alumina ceramic membrane Alumina ceramic sheet standard Alumina ceramic electrostatic chuck industry Silicon carbide ceramic substrate Gamma Alumina Standard Card gb14619 Alumina Ceramic Gasket Execution Alumina Ceramic Execution Alumina ceramic processing Integrated circuit chip general Integrated circuit packaging aluminum wire current

《GB/T 14619-1993厚膜集成电路用氧化铝陶瓷基片》由339-1（工业和信息化部（电子））归口，主管部门为工业和信息化部（电子）。
本标准规定了厚膜集成电路用氧化铝陶瓷基片的结构尺寸、技术要求、试验方法、检验规则、标志、包装、运输、贮存。本标准适用于厚膜集成电路用氧化铝陶瓷基片，片状件用氧化铝陶瓷基片亦可参照使用。

Scope

This standard specifies the structural dimensions, technical requirements, test methods, inspection rules, marks, packaging, transportation, and storage of alumina ceramic substrates for thick film integrated circuits. This standard applies to alumina ceramic substrates for thick film integrated circuits, and alumina ceramic substrates for chip components can also be used as a reference. (hereinafter referred to as substrate).

More samples: DL/T 5154-2012 QC/T 942-2021 YD/T 3934-2021

Sample only — not a preview of GB/T 14619-1993

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