Integrated circuit chip design

Integrated circuit chip design, Total:104 items.

The international standard classification for "Integrated circuit chip design" includes: Integrated circuits. Microelectronics , Physicochemical methods of analysis , Components for aerospace construction , Electromechanical components for electronic and telecommunications equipment .

The Chinese standard classification for "Integrated circuit chip design" includes: Microcircuit in general , Semiconductor integrated circuit , Special electronic technology material , Electron optics and other physical optics instrument , Technical Management , Aerospace hydraulic elements and accessories , Electronic industry production equipment in general , Electronic components .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB 51122-2015 Code for design of integrated circuit assembly and test factory
GB/T 14619-1993 ceramic substrates for thick film integrated circuits
GB/T 14619-2013 Alumina Ceramic Substrates for Thick Film Integrated Circuits
GB/T 43863-2024 Format for LSI—Package—Board interoperable design
GB/T 20515-2006 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
GB 50809-2012 Code for design of silicon integrated circuits wafer fab
GB/T 43454-2023 Design requirements of integrated circuit intellectual property (IP) core
GB/T 43931-2024 General specification for microwave integrated circuit chip for aerospace
GB/T 43748-2024 Microbeam analysis—Transmission electron microscopy—Method for measuring the thickness of functional thin films in integrated circuit chips
GB/T 14620-2013 Alumina Ceramic Substrates for Thin Film Integrated Circuits
GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC)
GB/T 43536.2-2023 Three dimensional integrated circuits—Part 2：Alignment of stacked dies having fine pitch interconnect

Group Standards of the People's Republic of China

T/GDEIIA 17-2021 Microwave Oven Special Chip Integrated Design Standard
T/CIE 071-2020 Evaluation of industrial high-reliability integrated circuits―Part 6:Bluetooth IC
T/SLEIA 0004-2024 Technical specifications for long-term storage of integrated circuit chips
T/QGCML 256-2022 Integrated circuit design engineering experiment box

Professional Standard - Aerospace

QJ 2212-1991 Semiconductor Integrated Circuit Design Guidelines

Professional Standard - Electron

SJ/T 10607-1994 Gate array design generals for semiconductor integrated circuits
SJ 2154-1982 Miorocrystal glass substrates for use in thick film integrated circuits
SJ 20142-1992 Microcrystalline glass substrate for military integrated circuit
SJ/T 10456-1993 Porcelain enameled steel substrate for hybrid integrated circuits

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 38345-2019 General design requirements of semiconductor integrate circuit for space application
GB/T 41033-2021 Design requirements of radiation hardening for CMOS IC
GB/T 41213-2021 Integrated circuit full automatic die bonder

Jiangsu Provincial Standard of the People's Republic of China

DB3202/T 1033-2022 Technical specifications for the prevention and control of occupational hazards in silicon integrated circuit chip manufacturing enterprises

Fujian Provincial Standard of the People's Republic of China

DB35/T 1403-2013 Multi-chip integrated package LED downlight for lighting

Professional Standard - Urban Construction

CJ/T 334-2010 Integrated circuit(IC) card gas flow-meter

工业和信息化部

SJ/T 11566-2016 Automatically trim & forming equipment for integrated circuit (IC)

Military Standard of the People's Republic of China-General Armament Department

GJB/Z 42.3-1993 Military microcircuit series type spectrum semiconductor integrated circuit microcomputer and memory integrated circuit

ES-UNE

UNE-EN 16602-60-12:2014 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs) (Endorsed by AENOR in November of 2014.)
UNE-EN 190100:1993 SS: DIGITAL MONOLITHIC INTEGRATED CIRCUITS. (Endorsed by AENOR in December of 1996.)
UNE-EN 190000:1992 GENERIC SPECIFICATION: MONOLITHIC INTEGRATED CIRCUITS. (Endorsed by AENOR in January of 1996.)

German Institute for Standardization

DIN EN 16602-60-12:2014-12 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs); English version EN 16602-60-12:2014
DIN EN 190000:1996 Generic specification: Monolithic integrated circuits; German version EN 190000:1995
DIN EN 190000:1996-05 Generic specification: Monolithic integrated circuits; German version EN 190000:1995
DIN 58002:2001 Integrated optics - Near-field-measurement for single-mode optical chip components
DIN EN 190100:1995-02 Sectional specification: Digital monolithic integrated circuits; German version EN 190100:1993
DIN 41850-1:1986 Integrated film circuits; substrates

SCC

NS-EN 16602-60-12:2014 Space product assurance — Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)
DANSK DS/EN 16602-60-12:2015 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)
DIN EN 16602-60-12 E:2013 Draft Document - Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs); English version FprEN 16602-60-12:2013
DANSK DS/EN 190000:1997 Generic Specification: Monolithic integrated circuits
DANSK DS/EN 190100:2016 Sectional Specification: Digital monolithic integrated circuits

British Standards Institution (BSI)

BS IEC 63011-2:2018 Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect
BS IEC 62528:2007 Standard testability method for embedded core-based integrated circuits
BS IEC 61523-4:2015 Design and Verification of Low-Power Integrated Circuits
BS EN 16602-60-12:2014 Space product assurance. Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)
BS IEC 63055:2016 Format for LSI-Package-Board interoperable design
BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits - Terminology
BS ISO/IEC 7816-9:2017 Identification cards. Integrated circuit cards. Commands for card management
BS IEC 60748-2-20:2008 Semiconductor devices - Integrated circuits - Digital integrated circuits - Family specification - Low voltage integrated circuits

GOST

GOST R 70969-2023 Integrated circuits based on master chips. Terms and definitions
GOST R 59749-2021 Monolithic microwave integrated circuits. Parameter system

ECIA - Electronic Components Industry Association

EIA-800-1999 Integrated Passive Device (IPD) Chipscale Package Design Guidelines

Association Francaise de Normalisation

NF L90-200-60-12*NF EN 16602-60-12:2016 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)
NF EN 190000:2013 Spécification générique : circuits intégrés monolithiques
NF C86-020*NF EN 190000:2013 Generic Specification : monolithic integrated circuits
NF C96-024:1990 Microcircuits Thermal modelisation of monolithic integrated circuits
NF C86-200*NF EN 190100:2013 Sectional specification : digital monolithic integrated circuits
NF EN 16602-60-12:2016 Product assurance of space projects - Design, selection, procurement and use of monolithic microwave die-shaped integrated circuits
NF EN 190100:2013 Spécification intermédiaire : circuits intégrés digitaux monolithiques

Institute of Electrical and Electronics Engineers (IEEE)

IEEE 1500-2005 Standard Testability Method for Embedded Core-based Integrated Circuits IEEE Computer Society document
IEEE Std 1801-2009 IEEE Standard for Design and Verification of Low Power Integrated Circuits
IEEE Std P1801/D14, January 23, 2013 IEEE Standard for Design and Verification of Low-Power Integrated Circuits
IEEE Std 1801-2013 IEEE Standard for Design and Verification of Low-Power Integrated Circuits - Redline
IEEE Std P1801/D13, January 2013 IEEE Draft Standard for Design and Verification of Low Power Integrated Circuits

Defense Logistics Agency

DLA SMD-5962-94667-1995 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 1750 CHIP SET, MULTICHIP MICROCIRCUIT, SILICON
DLA SMD-5962-96847 REV B-2005 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 1750 CHIP SET, MULTICHIP MICROCIRCUIT, SILICON
DLA DSCC-VID-V62/07619-2013 MICROCIRCUIT, LINEAR, HEX INVERTERS, MONOLITHIC IC SILICON

International Electrotechnical Commission (IEC)

IEC 62528:2007 Standard testability method for embedded core-based integrated circuits
IEC 61523-3:2004*IEEE 1497 Design and Verification of Low-Power Integrated Circuits
IEC 61523-4:2015 Design and Verification of Low-Power Integrated Circuits
IEC 61523-4:2015*IEEE Std 1801:2013 Design and Verification of Low-Power Integrated Circuits
IEC 63055:2016 Format for LSI-Package-Board interoperable design
IEC 60748-3-1:1991 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; section 1: blank detail specification for monolithic integrated operational amplifiers
IEC 60748-2-1:1991 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section 1: blank detail specification for bipolar monolithic digital integrated circuits gates (excluding uncommitted logic arrays)

GSO

GSO IEC 60748-23-1:2015 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification

American National Standards Institute （ANSI)

ANSI/IEEE 1500:2005 Standard Testability Method for Embedded Core-Based Integrated Circuits C/TT
ANSI/IEEE 1801:2009 Standard for Design and Verification of Low Power Integrated Circuits

ECSS - European Cooperation for Space Standardization

Q-ST-60-12C-2008 Design@ selection@ procurement and use of die form monolithic microwave integrated circuits (MMICs) (Second Issue)

Lithuanian Standards Office

LST EN 190000-2001 Generic specification. Monolithic integrated circuits
LST EN 190100-2001 Sectional specification. Digital monolithic integrated circuits

SE-SIS

SIS SS-CECC 90000-1991 Generic specification: Monolithic integrated circuits
SIS SS CECC 90300-1988 Sectional specification: Interface monolithic integrated circuits
SIS SS CECC 90200-1988 Sectional specification: Analogue monolithic integrated circuits
SIS SS CECC 90100-1987 Sectional specification: Digital monolithic integrated circuits
SIS SS-IEC 748:1991 Semiconductor devices — Integrated circuits

European Committee for Electrotechnical Standardization（CENELEC）

EN 190000:1995 Generic Specification Monolithic Integrated Circuits
EN 190100:1993 Sectional Specification: Digital Monolithic Integrated Circuits

Danish Standards Foundation

DS/EN 190000:1997 Generic Specification: Monolithic integrated circuits

ESD - ESD ASSOCIATION

EP110-2002 ON-CHIP ESD PROTECTION FOR INTEGRATED CIRCUITS

European Committee for Standardization (CEN)

EN 16602-60-12:2014 Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)

CZ-CSN

CSN IEC 748-2:1994 Semiconductor devices.Integrated circuits.Part 2:Digital integrated circuits
CSN IEC 748-4:1994 Semiconductor devices.Integrated circuits.Part 4:Interface integrated circuits
CSN IEC 748-3:1994 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
CSN IEC 748-20:1993 Semiductors devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

IET - Institution of Engineering and Technology

TECH COMP AID DES SI SIGE GAAS INTEG CIRC-2007 Technology Computer Aided Design for Si@ SiGe and GaAs Integrated Circuits

Korean Agency for Technology and Standards (KATS)

KS C IEC 63011-2:2022 Integrated circuits — Three dimensional integrated circuits —Part 2: Alignment of stacked dies having fine pitch interconnect

JP-JEITA

JEITA ED-7302A-2007 Manual for preparation of design guides of integrated circuits packages

IEEE - The Institute of Electrical and Electronics Engineers@ Inc.

IEEE 1801-2013 Design and Verification of Low-Power Integrated Circuits (IEEE Computer Society)
IEEE 1801-2009 Design and Verification of Low Power Integrated Circuits (IEEE Computer Society)

RU-GOST R

GOST R 59702-2021 Monolithic microwave integrated circuits. Terms and definitions

KR-KS

KS C IEC 63011-2-2022 Integrated circuits — Three dimensional integrated circuits —Part 2: Alignment of stacked dies having fine pitch interconnect

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC 2225-1998 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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