GB/T 17024-1997 in English
VALIDSemiconductor devices Integrated circuits Part2:Digital integrated circuits Section three—Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU
- Issued on:1997-10-07
- Implemented on:1998-09-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$156.00
| Standard No: | GB/T 17024-1997 |
| Document status: | VALID |
| Title in English: | Semiconductor devices Integrated circuits Part2:Digital integrated circuits Section three—Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU |
| Title in Chinese: | 半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 1~3 business days |
| Issued on: | 1997-10-07 |
| Implemented on: | 1998-09-01 |
| ICS Classification: | 31.200-Integrated circuits. Microelectronics |
| Chinese Classification: | L55-Microcircuit in general |
| Professional Classification: | GB-National Standard |
| Related Keywords: | integrated circuits
blank detail specification circuits series semiconductor devices circuits part2 |
| Related Topics: | din58170/54
IC Tape GBT17024 integrated circuit digital integrated circuit jedec standard digital integrated circuit Integrated circuit flatness |
《GB/T 17024-1997半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范》由TC78（全国半导体器件标准化技术委员会）归口，主管部门为工业和信息化部（电子）。
详见本标准。
Scope
The IEC electronic component quality assessment system follows the IEC regulations and works under the authorization of the IEC. The purpose of this system is to determine the quality assessment procedures so that electronic components released by one member state as qualified according to the corresponding normative requirements can be similarly recognized as qualified in all other member states without further inspection. This blank detail specification is one of a series of blank detail specifications related to semiconductor devices, and is used together with the following standards. IEC747-10/QC700000 Semiconductor Devices Part 10: General Specifications for Discrete Devices and Integrated Circuits
Loading PDF document...
Error loading PDF. Please make sure the file is valid and try again.
We also recommend
-
GB/T 32814-2016 in English
Fabrication Technology of Silicon Based MEMS Process Specification Based on SOI Silicon
2016-08-29 -
GB/T 43931-2024 in English
General specification for microwave integrated circuit chip for aerospace
2024-06-29 -
GB/T 42972-2023 in English
Microwave circuits—Test methods for detector
2023-09-07 -
GB/T 26112-2010 in English
Micro-electromechanical system technology—General rules for the assessment of micro-mechanical parameters
2011-01-10 -
GB/T 38446-2020 in English
Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films
2020-03-06 -
GB/T 15879.5-2018 in English
Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits
2018-09-17 -
GB/T 36614-2018 in English
Integrated circuits—Memory devices pin configuration
2018-09-17 -
GB/T 7092-2021 in English
Outline dimensions of semiconductor integrated circuits
2021-03-09 -
GB/T 14862-1993 in English
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
1993-01-02 -
GB/T 43536.1-2023 in English
Three dimensional integrated circuit—Part 1：Terminologies and definitions
2023-12-28
