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jedec standard digital integrated circuit

jedec standard digital integrated circuit, Total:303 items.

The international standard classification for "jedec standard digital integrated circuit" includes: Electricity. Magnetism. Electrical and magnetic measurements , Integrated circuits. Microelectronics , Electromechanical components for electronic and telecommunications equipment , Aerospace electric equipment and systems .

The Chinese standard classification for "jedec standard digital integrated circuit" includes: Radio Measurement , Microcircuit in general , Semiconductor integrated circuit , Technical management , Electronic components .


National Metrological Verification Regulations of the People's Republic of China

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 42848-2023 Semiconductor intergrated circuits—Test method of direct digital frequency synthesizer
  • GB/T 17574.20-2006 Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
  • GB/T 17024-1997 Semiconductor devices Integrated circuits Part2:Digital integrated circuits Section three—Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU
  • GB/T 17574.10-2003 Semiconductor devices—Integrated circuits—Part 2-10:Digital integrated circuits—Blank detail specification of integrated circuit dynamic read/write memories
  • GB/T 42973-2023 Semiconductor integrated circuits—Digital-analog(DA)converter
  • GB/T 17023-1997 Semiconductor devices Integrated circuits - Part 2: Digital integrated circuits Section two - Family specification for HCMOS digital integrated circuits series 54/74HC, 54/74HCT, 54/74
  • GB/T 5965-2000 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section one - Blank detail specification for bipolar monolithic digital integrated circuit gates (exc
  • GB/T 17574.11-2006 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory
  • GB/T 42839-2023 Semiconductor integrated circuits—Analog digital (AD) converter
  • GB/T 9424-1998 Semiconductor devices --Integrated circuits --Part 2:Digital integrated circuits --Section five --Blank detail specification for complementary MOS digital integrated circuits,series 4 0
  • GB/T 17574-1998 Semiconductor devices --Integrated circuits Part 2:Digital integrated circuits
  • GB/T 17572-1998 Semiconductor devices--Integrated circuits Part 2:Digital integrated circuits Section four--Family specification for complementary MOS digital integrated circuits,series 4 000B and 4 000UB

Military Standard of the People's Republic of China-General Armament Department

  • GJB/Z 42.2-1993 Military microcircuit series type spectrum semiconductor integrated circuit digital integrated circuit
  • GJB 9388-2018 Test methods for integrated circuit analog-to-digital and digital-to-analog converters
  • GJB/J 3524-1999 Calibration regulations for S10 large-scale digital integrated circuit test system

National Metrological Technical Specifications of the People's Republic of China

  • JJF 1160-2006 Calibration Specification of Small & Medium Scale Digital Integrated Circuit Testing System

Professional Standard - Electron

  • SJ/T 10196-1991 Measuring methods of MSI and SSI digital IC static parameter testers
  • SJ 2483-1984 Series and types of A/D converters for hybrid integrated circuits
  • SJ/T 9534-1993 Grading standard of quality for semiconductor integrated circuits
  • SJ 20802-2001 Visual inspection criteria for integrated circuits metal packages
  • SJ 2482-1984 Series and types of D/A converters for hybrid integrated circuits
  • SJ/T 10734-1996 Letter symbols for semiconductor integrated circuits - Letter symbols for electrical parameters

Professional Standard - Aerospace

  • QJ 257-1977 Semiconductor TTL Integrated Digital Circuit Testing Method
  • QJ 2875-1997 Detailed Specification for CMOS Digital Gate Array of Semiconductor Integrated Circuit
  • QJ/Z 33-1977 Field effect digital integration (P-MOS) circuit test method

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

  • GB/T 35004-2018 Logic digital integrated circuits—Specification for I/O interface model for integrated circuit

British Standards Institution (BSI)

  • BS IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Digital integrated circuits
  • BS IEC 60748-2:1998 Semiconductor devices. Integrated circuits. Digital integrated circuits
  • BS IEC 60748-4-3:2007 Semiconductor devices - Integrated circuits - Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
  • BS IEC 60748-2-20:2008 Semiconductor devices - Integrated circuits - Digital integrated circuits - Family specification - Low voltage integrated circuits
  • BS IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory - Blank detail specification for single supply integrated
  • BS IEC 60748-4-3:2006 Semiconductor devices. Integrated circuits - Interface integrated circuits. Dynamic criteria for analogue-digital converters (ADC)
  • DD IEC/TS 62404:2007 Logic digital integrated circuits. Specification for I/O interface model for integrated circuit (IMIC version 1.3)
  • BS DD IEC/TS 62404:2007 Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)
  • BS IEC 60748-2-12:2001 Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification for programmable logic devices (PLDs)
  • PD IEC/TR 63072-1:2017 Photonic integrated circuits. Introduction and roadmap for standardization
  • BS QC 790107:1995 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification. Integrated circuit dynamic read/write memories
  • BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits - Terminology
  • BS EN 165000-5:1998 Film and hybrid integrated circuits - Procedure for qualification approval

ES-UNE

  • UNE-EN 190116:1993 FS: AC MOS DIGITAL INTEGRATED CIRCUITS. (Endorsed by AENOR in September of 1996.)
  • UNE-EN 190100:1993 SS: DIGITAL MONOLITHIC INTEGRATED CIRCUITS. (Endorsed by AENOR in December of 1996.)
  • UNE-EN 190110:1994 BDS: DIGITAL MICROPROCESSOR INTEGRATED CIRCUITS. (Endorsed by AENOR in November of 1996.)
  • UNE-EN 190107:1994 FS: TTL FAST DIGITAL INTEGRATED CIRCUITS. SERIES 54F, 74F. (Endorsed by AENOR in September of 1996.)
  • UNE-EN 190109:1994 FS: DIGITAL INTEGRATED HC MOS CIRCUITS. SERIES HC/HCT/HCU. (Endorsed by AENOR in September of 1996.)
  • UNE-EN 190101:1994 FS: DIGITAL INTEGRATED TTL CIRCUITS. SERIES 54, 64, 74, 84, (Endorsed by AENOR in September of 1996.)
  • UNE-EN 190108:1994 FS: TTL ADVANCED SCHOTTKY DIGITAL INTEGRATED CIRCUITS. SERIES 54AS, 74AS. (Endorsed by AENOR in September of 1996.)
  • UNE-EN 190102:1994 FS: TTL-SCHOTTKY DIGITAL INTEGRATED CIRCUITS. SERIES 54S, 64S, 74S, 84S. (Endorsed by AENOR in September of 1996.)
  • UNE-EN 190106:1994 FS: TTL-ADVANCED LOW POWER SCHOTTKY DIGITAL INTEGRATED CIRCUITS. SERIES 54ALS, 74ALS. (Endorsed by AENOR in September of 1996.)

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

  • JEDEC JESD8C-2006 Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated Circuits
  • JEDEC JESD8-4-1993 Center-Tap-Terminated (CTT) Low-Level, High- Speed Interface Standard for Digital Integrated Circuits
  • JEDEC JESD8-3A-2007 Gunning Transceiver Logic (GTL) Low-Level, High Speed Interface Standard for Digital Integrated Circuits
  • JEDEC JESD8-3-1993 Gunning Transceiver Logic (GTL) Low-Level, High-Speed Interface Standard for Digital Integrated Circuits Errata - December 1994
  • JEDEC JESD12-6-1991 Interface Standard for Semicustom Integrated Circuits
  • JEDEC JESD8C.01-2007 Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated Circuits (Minor Revision of JESD8C, June 2006)
  • JEDEC JESD12-2-1986 Standard for Cell-Based Integrated Circuit Benchmark Set
  • JEDEC JESD8-6-1995 High Speed Transceiver Logic (HSTL) A 1.5V Output Buffer Supply Voltage Based Interface Standard for Digital Integrated Circuits
  • JEDEC JESD8-12A.01-2007 1.2 V +/- 0.1V (Normal Range) and 0.8 - 1.3 V (Wide Range) Power Supply Voltage and Interface Standard for Nonterminated Digital Integrated Circuits
  • JEDEC JESD8-11A-2005 1.5 V +/- 0.1 V (Normal Range) and 0.9 V 1.6 V (Wide Range) Power Supply Voltage and Interface Standard for Nonterminated Digital integrated Circuits
  • JEDEC JESD8-5A-2006 2.5 V (PLUS OR MINUS) 0.2 V (Normal Range) and 1.8 V ?2.7 V (Wide Range) Power Supply Voltage and Interface Standard for Nonterminated Digital Integrated Circuits
  • JEDEC JESD8-7A-2006 1.8 V (PLUS OR MINUS) 0.15 V (Normal Range), and 1.2 - 1.95 V (Wide Range) Power Supply Voltage and Interface Standard for Non-Terminated Digital Integrated Circuit

GSO

  • GSO IEC 60748-2-5:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 5: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)
  • OS GSO IEC 60748-2:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
  • BH GSO IEC 60748-2:2016 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
  • GSO IEC 60748-2:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
  • GSO IEC 60748-2-4:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 4: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB
  • GSO IEC 60748-2-20:2014 Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
  • OS GSO IEC 60748-2-20:2014 Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
  • GSO IEC 60748-2-8:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 8t: Blank detail specification for integrated circuit static read/write memories
  • GSO IEC 60748-2-6:2014 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section 6: Blank detail specification for microprocessor integrated circuits
  • BH GSO IEC 60748-2-4:2016 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 4: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB
  • OS GSO IEC 60748-2-4:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 4: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB
  • GSO IEC 60748-2-3:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)
  • OS GSO IEC/TS 62404:2014 Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)
  • GSO IEC 60748-2-10:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories
  • OS GSO IEC 60748-2-2:2014 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
  • BH GSO IEC 60748-2-2:2016 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
  • GSO IEC 60748-2-2:2014 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
  • GSO IEC 60748-2-1:2014 Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
  • OS GSO IEC 60748-2-5:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 5: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)
  • BH GSO IEC 60748-2-5:2016 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 5: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)
  • GSO IEC 60748-2-7:2014 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section7: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
  • BH GSO IEC 60748-2-1:2016 Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
  • BH GSO IEC 60748-2-6:2016 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section 6: Blank detail specification for microprocessor integrated circuits
  • GSO IEC/TS 62404:2014 Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)
  • OS GSO IEC 60748-2-1:2014 Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
  • OS GSO IEC 60748-2-3:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)
  • OS GSO IEC 60748-2-6:2014 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section 6: Blank detail specification for microprocessor integrated circuits
  • BH GSO IEC 60748-2-3:2016 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)
  • GSO IEC 60748-2-11:2014 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
  • GSO IEC 60748-4-3:2014 Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
  • OS GSO IEC 60748-4-3:2014 Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
  • BH GSO IEC 60748-4-3:2016 Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
  • OS GSO IEC 60748-2-10:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories
  • BH GSO IEC 60748-2-10:2016 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories
  • BH GSO IEC 60748-2-8:2016 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 8t: Blank detail specification for integrated circuit static read/write memories
  • OS GSO IEC 60748-2-8:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 8t: Blank detail specification for integrated circuit static read/write memories
  • GSO IEC 60748-2-12:2014 Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)
  • BH GSO IEC 60748-2-11:2016 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
  • OS GSO IEC 60748-2-11:2014 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
  • OS GSO IEC 60748-2-7:2014 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section7: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
  • OS GSO IEC 60748-2-12:2014 Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)

SCC

  • BS IEC 60748-2-20:2000 Semiconductor devices. Integrated circuits. Digital integrated circuits-Family specification. Low voltage integrated circuits
  • BS 6493-2-2.2:1986 Semiconductor devices. Integrated circuits-Recommendations for digital integrated circuits
  • IEC 60748-2:1985/AMD2:1993 Amendment 2 - Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
  • DANSK DS/EN 190116:2016 Family Specification: AC MOS Digital integrated circuits
  • IEC 60748-2:1985/AMD1:1991 Amendment 1 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
  • DANSK DS/EN 190100:2016 Sectional Specification: Digital monolithic integrated circuits
  • 06/30153491 DC EN 60748-2-20. Semiconductor devices. Integrated circuits. Part 2-20. Digital integrated circuits. Family specification. Low voltage integrated circuits
  • DANSK DS/IEC 748-2-6:1993 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section six: Blank detail specification for microprocessor integrated circuits
  • MIL MIL-I-48634-1986 INTEGRATED CIRCUIT, DIGITAL, CMOS LOGIC ARRAY MONOLITHIC SILICON
  • DANSK DS/EN 190110:2016 Blank Detail Specification: Digital microprocessor integrated circuits
  • DANSK DS/EN 190107:2016 Family Specification: TTL FAST digital integrated circuits – Series 54F, 74F
  • BS PD IEC/TR 63072-1:2017 Photonic integrated circuits-Introduction and roadmap for standardization
  • DANSK DS/EN 190109:2016 Family Specification: Digital integrated HC MOS circuits – Series HC/HCT/HCU
  • MIL MIL-I-48632-1986 INTEGRATED CIRCUIT, DIGITAL, CMOS CONTROL AND TIMING BASE, MONOLITHIC, SILICON
  • DANSK DS/EN 190101:2016 Family Specification: Digital integrated TTL circuits – Series 54, 64, 74, 84

Korean Agency for Technology and Standards (KATS)

  • KS C IEC 60748-2-3-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 3:Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
  • KS C IEC 60748-2-2001(2021) Semiconductor devices-integrated circuits-Part 2:Digital integrated circuits
  • KS C IEC 60748-2:2001 Semiconductor devices-integrated circuits-Part 2:Digital integrated circuits
  • KS C IEC 60748-2-2001(2016) Semiconductor devices-integrated circuits-Part 2:Digital integrated circuits
  • KS C IEC 60748-2-2021 Semiconductor devices-integrated circuits-Part 2:Digital integrated circuits
  • KS C IEC 60748-2-4-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 4:Family specification for complementary MOS digital integrated circuits, series 4 000 B and 4 000 UB
  • KS C IEC 60748-2-20:2002 Semiconductor devices-Integrated circuits-Part 2-20:Digital integrated circuits-Family specification-Low voltage integrated circuits
  • KS C IEC 60748-2-20:2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits
  • KS C IEC 60748-2-12-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 12:Digital integrated circuits-Blank detail specification for programmable logic devices(PLDs)
  • KS C IEC 60748-2-2-2003(2019) Semiconductor devices — Integrated circuits — Part 2: Digital integrated circuits — Section 2: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
  • KS C IEC 60748-2-2:2003 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 2:Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
  • KS C IEC 60748-2-4-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 4:Family specification for complementary MOS digital integrated circuits, series 4 000 B and 4 000 UB
  • KS C IEC 60748-2-7:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 7:Blank detail specification for integrated circuits fusible-link programmable bipolar read-only memories
  • KS C IEC 60748-2-5-2002(2017) Semiconductor devices-Integrated circuits Part 2:Digital integrated circuits Section 5-Blank detail specification for complementary MOS digital integrated circuits(series 4 000B and 4 000UB)
  • KS C IEC 60748-2-12-2022 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 12:Digital integrated circuits-Blank detail specification for programmable logic devices(PLDs)
  • KS C IEC 60748-2-12-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 12:Digital integrated circuits-Blank detail specification for programmable logic devices(PLDs)
  • KS C 5113-2002 MEASURING METHODS FOR MOS DIGITAL INTEGRATED CIRCUITS
  • KS C 5113-1983 MEASURING METHODS FOR MOS DIGITAL INTEGRATED CIRCUITS
  • KS C 5113-1983(1998) MEASURING METHODS FOR MOS DIGITAL INTEGRATED CIRCUITS
  • KS C IEC 60748-2-8:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories
  • KS C IEC 60748-2-5-2002(2022) Semiconductor devices-Integrated circuits Part 2:Digital integrated circuits Section 5-Blank detail specification for complementary MOS digital integrated circuits(series 4 000B and 4 000UB)
  • KS C IEC 60748-2-5-2022 Semiconductor devices-Integrated circuits Part 2:Digital integrated circuits Section 5-Blank detail specification for complementary MOS digital integrated circuits(series 4 000B and 4 000UB)
  • KS C IEC 60748-2-2-2019 Semiconductor devices — Integrated circuits — Part 2: Digital integrated circuits — Section 2: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
  • KS C IEC 60748-2-1:2001 Semiconductor integrated circuits-Part 2:Digital integrated circuits Section One:Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
  • KS C IEC 60748-2-4-2022 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 4:Family specification for complementary MOS digital integrated circuits, series 4 000 B and 4 000 UB
  • KS C 6050-1985(2000) MEASURING METHODS FOR BIPOLAR DIGITAL INTEGRATED CIRCUITS
  • KS C 6050-1985 MEASURING METHODS FOR BIPOLAR DIGITAL INTEGRATED CIRCUITS
  • KS C IEC 60748-2-4:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 4:Family specification for complementary MOS digital integrated circuits, series 4 000 B and 4 000 UB
  • KS C IEC 60748-2-3:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 3:Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
  • KS C IEC 60748-2-1-2001(2016) Semiconductor integrated circuits-Part 2:Digital integrated circuits Section One:Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
  • KS C IEC 60748-2-3-2022 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 3:Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
  • KS C IEC 60748-2-3-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 3:Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
  • KS C IEC 60748-2-5:2002 Semiconductor devices-Integrated circuits Part 2:Digital integrated circuits Section 5-Blank detail specification for complementary MOS digital integrated circuits(series 4 000B and 4 000UB)
  • KS C IEC 60748-2-1-2001(2021) Semiconductor integrated circuits-Part 2:Digital integrated circuits Section One:Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
  • KS C IEC 60748-2-6-2022 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 6:Blank detail specification for microprocessor integrated circuits
  • KS C IEC 60748-2-6-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 6:Blank detail specification for microprocessor integrated circuits
  • KS C IEC 60748-2-6-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 6:Blank detail specification for microprocessor integrated circuits
  • KS C IEC 60748-5:2003 Semiconductor devices-Integrated circuits-Part 5:Semicustom integrated circuits
  • KS C IEC 60748-2-1-2021 Semiconductor integrated circuits-Part 2:Digital integrated circuits Section One:Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
  • KS C IEC 60748-2-6:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 6:Blank detail specification for microprocessor integrated circuits
  • KS C IEC 60748-2-8-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories
  • KS C IEC 60748-2-10:2001 Semiconductor integrated circuits-Part 2:Digital integrated circuits Section 10-Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)
  • KS C IEC 60748-2-8-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories
  • KS C IEC 60748-2-8-2022 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 8:Blank detail specification for integrated circuits static read/write memories
  • KS C IEC 60748-2-11-2002(2017) Semiconductor devices-Integrated circuits-Part 2-11:Digital integrated circuits-Blank detail specification for single supply integrated circuit,electrically erasable, and programmable read-only memory
  • KS C 5210-1980(2020) General rules for reliability assured digital semiconductor integrated circuits
  • KS C IEC 60748-2-11-2002(2022) Semiconductor devices-Integrated circuits-Part 2-11:Digital integrated circuits-Blank detail specification for single supply integrated circuit,electrically erasable, and programmable read-only memory
  • KS C IEC 60748-2-11-2022 Semiconductor devices-Integrated circuits-Part 2-11:Digital integrated circuits-Blank detail specification for single supply integrated circuit,electrically erasable, and programmable read-only memory
  • KS C IEC 60748-2-7-2002(2022) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 7:Blank detail specification for integrated circuits fusible-link programmable bipolar read-only memories
  • KS C IEC 60748-2-11:2002 Semiconductor devices-Integrated circuits-Part 2-11:Digital integrated circuits-Blank detail specification for single supply integrated circuit,electrically erasable, and programmable read-only memory
  • KS C IEC 60748-2-10-2001(2016) Semiconductor integrated circuits-Part 2:Digital integrated circuits Section 10-Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)
  • KS C 5218-1983(2013) Reliability assured complementary MOS digital semiconductor integrated circuits(Gates)
  • KS C IEC 60748-2-10-2001(2021) Semiconductor integrated circuits-Part 2:Digital integrated circuits Section 10-Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)
  • KS C IEC 60748-2-12:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 12:Digital integrated circuits-Blank detail specification for programmable logic devices(PLDs)
  • KS C IEC 60748-2-7-2002(2017) Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 7:Blank detail specification for integrated circuits fusible-link programmable bipolar read-only memories
  • KS C IEC 60748-2-7-2022 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 7:Blank detail specification for integrated circuits fusible-link programmable bipolar read-only memories
  • KS C IEC 60748-2-10-2021 Semiconductor integrated circuits-Part 2:Digital integrated circuits Section 10-Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)

CZ-CSN

International Electrotechnical Commission (IEC)

  • IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
  • IEC 60748-2-4:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section four: family specification for complementary MOS digital integrated circuits; series 4000 B and 4000 UB
  • IEC 60748-2-20:2000 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits; Family specifications: Low voltage integrated circuits
  • IEC 60748-2-2:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section 2: familiy specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
  • IEC 60748-2-20:2008 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
  • IEC 60748-2-5:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section five: blank detail specification for complementary MOS digital integrated circuits; series 4000 B and 4000 UB
  • IEC 60748-4-3:2006 Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
  • IEC 60748-2-1:1991 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section 1: blank detail specification for bipolar monolithic digital integrated circuits gates (excluding uncommitted logic arrays)
  • IEC 60748-2-3:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section 3: blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)
  • IEC 60748-2/AMD1:1991 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; amendment 1
  • IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
  • IEC 60748-2-6:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section six: blank detail specification for microprocessor integrated circuits
  • IEC TS 62404:2007 Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)
  • IEC 60748-2-2:1992/AMD1:1994 Amendment 1 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54
  • IEC 60748-2-10:1994 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits; section 10: Blank detail specification for integrated circuit dynamic read/write memories
  • IEC 60748-2-7:1992 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
  • IEC 60748-2-12:2001 Semiconductor devices - Integrated circuits - Part 2-12: Digital integrated circuits; Blank detail specification for programmable logic devices (PLDs)

Association Francaise de Normalisation

  • NF C96-042:1989 Semiconductor Devices Integrated circuits Part 2:Digital integrated circuits
  • NF C86-200*NF EN 190100:2013 Sectional specification : digital monolithic integrated circuits
  • NF C86-226*NF EN 190116:2013 Family specification : AC MOS Digital Integrated Circuits
  • NF EN 190100:2013 Spécification intermédiaire : circuits intégrés digitaux monolithiques
  • NF C86-213*NF EN 190101:2013 Family Specification : Digital Integrated TTL Circuits - Series 54, 64, 74, 84
  • NF C86-241*NF EN 190110:2013 Blank Detail Specification : Digital Microprocessor Integrated Circuits
  • NF C86-218*NF EN 190107:2013 Family Specification : TTL FAST Digital Integrated Circuits - Series 54F, 74F
  • NF C86-222*NF EN 190109:2013 Family specification : Digital Integrated HC MOS Circuits - Series HC/HCT/HCU
  • NF EN 190101:2013 Family specification: TTL digital integrated circuits - Series 54, 64, 74, 84
  • NF C86-218/A3:1989 Components for Electronic Equipment Digital Integrated TTL FAST Circuits Collection of detail specifications within the scope of the French Standard NF C 86-218(CECC 90 107)
  • NF C86-222/A12:1991 Components for Electronic Equipment Digital Integrated HC MOS Circuits Collection of detail specifications within the scope of the French Standard NF C 86-222(CECC 90 109)
  • NF C86-212/A1:1986 Components for Electronic Equipment Digital TTL Low Power SCHOTTKY Integrated Circuits Collection of detail specifications within the scope of the French Standard NF C 86-212(CECC 90 103)

Danish Standards Foundation

  • DS/IEC 748-2:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
  • DS/IEC 748-2-1:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Section one: Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
  • DS/IEC 748-2-6:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Section six: Blank detail specification for microprocessor integrated circuits

American Society for Testing and Materials (ASTM)

  • ASTM F1262M-95(2002) Standard Guide for Transient Radiation Upset Threshold of Digital Integrated Circuits
  • ASTM F1262M-95 Standard Guide for Transient Radiation Upset Threshold of Digital Integrated Circuits
  • ASTM F1262M-14 Standard Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric)
  • ASTM F1262M-95(2008) Standard Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric)
  • ASTM F744M-97(2003) Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits [Metric]
  • ASTM F744M-16 Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric)
  • ASTM F744M-97 Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits
  • ASTM F744M-10 Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits [Metric]
  • ASTM F375-89(2010) Standard Specification for Integrated Circuit Lead Frame Material
  • ASTM F375-20 Standard Specification for Integrated Circuit Lead Frame Material
  • ASTM F375-89(1999) Standard Specification for Integrated Circuit Lead Frame Material

RO-ASRO

  • STAS 7128/11-1985 T.ETTJ?R SYMBOLS FOR EMICONDUCTOR DEVICES ND INTHGRATED CIRCUITS Symbols fur digital integrated eircuits
  • STAS SR CEI 748-2/A1-1994 DISPOZITIVE CU SEMICONDUCTOARE Circuite integrate. Partea 2: Circuite integrate digitale
  • STAS 12161-1984 DIGITAL' INTEGRATED CIRCUITS Measuring methods of main electrical parameters
  • STAS 10630-1976 DIGITAL INTEGRATED CIRCUITS Measuring methods of outptut quantities
  • STAS 10350-1983 DIGITAL INTEGRATED CIRCUITS Terminology and classified list of main parameters
  • STAS 7128/10-1984 LETTER SIMBOLS FOR SEMICON- DUCTOR DEVICES ANI) INTF.GHA- TED CIRCU1TS Sinibols for analoguc inlcgnated circuits

RU-GOST R

  • GOST 29107-1991 Semiconductor devices. Integrated circuits. Part 2. Digital integrated circuits
  • GOST 18683.0-1983 Digital integrated circuits. General requirements for measuring electrical parameters
  • GOST 18683.1-1983 Digital integrated circuits. Methods for measuring static electrical parameters
  • GOST 18683.2-1983 Digital integrated circuits. Methods of measuring dynamic electrical parameters
  • GOST 19480-1989 Integrated circuits. Terms, definitions and letter symbols of electrical parameters
  • GOST R 55893-2013 Integrated microcircuits. Basic parameters
  • GOST 4.465-1987 Product-quality index system. Integratet circuits. Index nomenclature

IEC - International Electrotechnical Commission

  • IEC 60748-2:1985 Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits (Amendment 1-1991) (Amendment 2-1993) (Edition 1.0)
  • TS 62404-2007 Logic digital integrated circuits – Specification for I/O interface model for integrated circuit (IMIC version 1.3) (Edition 1.0)
  • IEC 60748-2-6:1991 Semiconductor devices Integrated circuits Part 2: Digital integrated circuits Section six - Blank detail specification for microprocessor integrated circuits (Edition 1.0)
  • IEC 60748-2-8:1993 Dispositifs à semiconducteurs - Circuits intégrés - Partie 2: Circuits intégrés numériques - Section Huit: Spécification particulière cadre pour les mémoires à circuits intégrés à lecture-écriture à fonctionnement statique (Edition 1.0)

KR-KS

  • KS C IEC 60748-2-20-2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits

SE-SIS

German Institute for Standardization

  • DIN EN 190100:1995-02 Sectional specification: Digital monolithic integrated circuits; German version EN 190100:1993
  • DIN 4000-50:1986 Tabular layouts of article characteristics for digital integrated circuits
  • DIN EN 190116:1995-06 Family specification: AC MOS digital integrated circuits; German version EN 190116:1993
  • DIN EN 190101:1996 Family specification - Digital integrated TTL circuits - Series 54, 64, 74, 84; German version EN 190101:1994
  • DIN EN 190110:1996 Blank detail specification - Digital microprocessor integrated circuits; German version EN 190110:1994
  • DIN EN 190110:1996-11 Blank detail specification - Digital microprocessor integrated circuits; German version EN 190110:1994
  • DIN EN 190107:1996 Family specification - TTL FAST digital integrated circuits - Series 54 F, 74 F; German version EN 190107:1994
  • DIN EN 190109:1996-11 Family specification - Digital integrated HC MOS circuits - Series HC/HCT/HCU; German version EN 190109:1994
  • DIN EN 190101:1996-11 Family specification - Digital integrated TTL circuits - Series 54, 64, 74, 84; German version EN 190101:1994
  • DIN EN 190109:1996 Family specification - Digital integrated HC MOS circuits - Series HC/HCT/HCU; German version EN 190109:1994
  • DIN EN 190107:1996-11 Family specification - TTL FAST digital integrated circuits - Series 54 F, 74 F; German version EN 190107:1994
  • DIN EN 190100:1995 Sectional specification: Digital monolithic integrated circuits; German version EN 190100:1993

European Committee for Electrotechnical Standardization(CENELEC)

  • EN 190116:1993 Family Specification: AC MOS Digital Integrated Circuits
  • EN 190100:1993 Sectional Specification: Digital Monolithic Integrated Circuits
  • EN 190109:1994 Family Specification: Digital Integrated HC MOS Circuits Series HC/HCT/HCU
  • EN 190110:1994 Blank Detail Specification: Digital Microprocessor Integrated Circuits

Japanese Industrial Standards Committee (JISC)

  • JIS C 7042:1982 Measuring methods for MOS digital integrated circuits
  • JIS C 7041:1982 Measuring methods for bipolar digital integrated circuits
  • JIS C 7310:1979 General rules for reliability assured digital semiconductor integrated circuits
  • JIS C 7040:1969 General rules for mechanical standardization of semiconductor integrated circuits
  • JIS C 7312:1982 Reliability assured complementary MOS digital semiconductor integrated circuits (gates)

Lithuanian Standards Office

ESD - ESD ASSOCIATION

  • JTR001-01-2012 User Guide of ANSI/ESDA/JEDEC JS-001 Human Body Model Testing of Integrated Circuits

YU-JUS

IN-BIS

  • IS 12970 Pt.2/Sec.3-1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Essential rating and characteristics. Section 3: Integrated circuit microprocessors
  • IS 12970 Pt.2/Sec.2-1992 Semiconductor devices—Integrated circuits Part 2 Digital integrated circuits—Basic ratings and characteristics Part 2 Integrated circuits Memory
  • IS 12970 Pt.3/Sec.1-1992 Semiconductor devices—Integrated circuits Part 3 Digital integrated circuits—Measurement methods Section 1: General
  • IS 12970 Pt.3/Sec.2-1992 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Measuring methods. Section 2: Static characteristics
  • IS 12970 Pt.3/Sec.3-1993 Semiconductor devices—Integrated circuits Part 3 Digital integrated circuits—Measurement methods Section 3: Dynamic measurements
  • IS 12970 Pt.2/Sec.1-1992 Semiconductor devices—Integrated circuits Part 2 Digital integrated circuits—Basic ratings and characteristics Section 1: General

IECQ - IEC: Quality Assessment System for Electronic Components

  • QC 790132/SU 0005-1990 Detail Specification for Electronic Components Digital Integrated Circuits KII02AP4 - KII02AP14
  • QC 790109-1992 Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Two - Family Specification for HCMOS Digital Integrated Circuits@ Series 54/74 HC@ 54/74 HCT@ 54/74 HCU (IEC 748-2-2 ED 1)
  • QC 790132-1991 Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section One - Blank Detail Specification for Bipolar Monolithic Digital Integrated Circuit Gates (Excluding Uncommitted Logic Arrays) (IEC 748-2-1 ED 1)
  • QC 790107-1994 Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits - Section 10: Blank Detail Specification for Integrated Circuit Dynamic Read/Write Memories (IEC 748-2-10 ED 1)

PT-IPQ

  • NP 2955/8-1985 Electronic component. "TTL Fast" Digital Integrated Circuit, Specification Note
  • NP 2955/1-1985 Electronic component. Monolithic digital integrated circuits. Midpoint specification
  • NP 2955/2-1985 Electronic component. TTL54, 64, 74 and 84 series digital integrated circuits. Specifications

GOSTR

  • GOST R 57441-2017 Integrated circuits. Terms, definitions and letter symbols of electrical parameters

GOST

  • GOST R 71071-2023 Integrated circuits. Delay circuits. Parameters system
  • GOST R 71074-2023 Integrated circuits. Magnetic bubble integrated circuits memory. Terms, definitions and letter symbols characteristics
  • GOST R 70845-2023 Integrated circuits. Terms, definitions and letter symbols of digital-to-analog andanalog-to-digital converters

IEEE - The Institute of Electrical and Electronics Engineers@ Inc.

  • IEEE 1076.4-2000 Standard for VITAL ASIC (Application Specific Integrated Circuit) Modeling Specification

American National Standards Institute (ANSI)

Institute of Electrical and Electronics Engineers (IEEE)

  • IEEE Std 1076.4-1995 IEEE Standard VITAL Application-Specific Integrated Circuit (ASIC) Modeling Specification