GB/T 36479-2018 in English
VALIDIntegrated circuits—Test methods for column grid array
- Issued on:2018-06-07
- Implemented on:2019-01-01
- File Format:PDF
- Delivery:Via email within 5 business days
$301.00
| Standard No: | GB/T 36479-2018 |
| Document status: | VALID |
| Title in English: | Integrated circuits—Test methods for column grid array |
| Title in Chinese: | 集成电路 焊柱阵列试验方法 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 5 business days |
| Issued on: | 2018-06-07 |
| Implemented on: | 2019-01-01 |
| Professional Classification: | GB-National Standard |
| Related Keywords: | circuits test methods
integrated circuit solder pillar arrays solder column integrated circuits test methods |
| Related Topics: | column english
Integration Test Trials peptide array low frequency array Amino column method peptide array steering column Modern IC Testing Technology column failure GBT36479 GB/T 36479-2018 integrated circuit : Column chromatography column packing method Experimental purpose Integrated circuit incoming material inspection standards Overseas integrated circuit testing Welding fume collector method Integrated circuit testing related |
《GB/T 36479-2018集成电路 焊柱阵列试验方法》由TC599（全国集成电路标准化技术委员会）归口，主管部门为工业和信息化部（电子）。
Introduction
Standard Overview
GB/T 36479-2018 "Test Method for Integrated Circuit Solder Pillar Arrays" is a method standard for testing integrated circuits in the form of solder pillar array (CGA) packaging. This standard specifies a variety of test indicators such as coplanarity, position, solderability, pull-off force, shear force and fatigue of solder pillar arrays, and is applicable to different types of solder pillars such as high-lead solder pillars and micro-coil solder pillars.
Detailed technical requirements
| Project | Test content | Key indicators |
|---|---|---|
| Coplanarity | Measure the maximum deviation from the top of the solder column to the reference plane | Maximum allowable deviation: ≤150μm |
| Position | Determine the deviation between the center of the solder column and the theoretical position | Depending on the pitch, the maximum allowable deviation range is 80-150μm |
| Solderability | Evaluate the soldering performance of solder pillars under reflow conditions | Sn63Pb37 or lead-free solder is recommended, with wettability ≥ 95% |
Background of standard formulation and technological evolution
With the development of integrated circuit packaging technology, solder pillar arrays, as a high-performance connection method, have been widely used in high-end chip packaging. This standard is formulated based on military standards such as GJB548B-2005, and the test methods are optimized and supplemented in combination with the needs of the civilian market.
Implementation recommendations
- In mass production, it is recommended to use automated equipment for coplanarity and position detection to improve efficiency and accuracy.
- For high-reliability applications, it is recommended to add fatigue test items to evaluate the durability of solder pillars in long-term use.
- When selecting test parameters, the test conditions should be adjusted according to the pitch and material properties of the specific device to ensure the validity of the results.
Loading PDF document...
Error loading PDF. Please make sure the file is valid and try again.
We also recommend
-
GB/T 378-1964 in English
Test for copper strip corrosion of engine fuels
- -
GB/T 41333-2022 in English
Technical requirements of complete equipment for lime calcination
2022-03-09 -
GB 3800-1983 in English
Technical requirements for automobile frames being overhauled
- -
GB/T 18115.10-2006 in English
Chemical analysis methods of rare earth impurities in rare earth metals and their oxides Holmium - Determination of lanthanum, cerium, praseodymium, neodymium, samarium, europium, g
2000-04-13 -
GB/T 18156-2023 in English
Delivery document of maritime containerized cargo
2023-12-28 -
GB/T 3626-1983 in English
Technical requirements of tantalum pentoxide
- -
GB/T 50639-2019 in English
Standard for design of polyamide polymer and fiber plant
2019-07-10 -
GB/T 29023.2-2016 in English
Measurement and characterization of particles by acoustic method—Part 2: Guidelines for linear theory
2016-02-24 -
GB/T 29261.5-2014 in English
Information technology―Automatic identification and data capture techniques―Harmonized vocabulary―Part 5:Locating systems
2014-09-03 -
GB/T 7583-1987 in English
- Pure tone air conduction threshold audiometry - For hearing conservation purposes
1987-03-27
