Modern IC Testing Technology

Modern IC Testing Technology, Total:252 items.

The international standard classification for "Modern IC Testing Technology" includes: Industrial automation systems , Industrial process measurement and control , Integrated circuits. Microelectronics , Identification cards and related devices , Telecommunication terminal equipment in general , Electrical engineering (Vocabularies) , Electromechanical components for electronic and telecommunications equipment , Electronic tubes , Aerospace electric equipment and systems , Acids , IT applications in transport and trade , Electricity. Magnetism. Electrical and magnetic measurements , Multilayer applications .

The Chinese standard classification for "Modern IC Testing Technology" includes: Computer application , Microcircuit in general , Semiconductor integrated circuit , Data medium , Dedicated processing equipment , Computer application , Communication equipment in general , Basic standards and general methods , Industrial automation and control device in general , Electronic industry production equipment in general , Technical management , Technical management , Technical management , Electronic components , Inorganic acid and alkali , Electrical system and equipment , Computer application , Radio Measurement , Opening and system interconnection of computer .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 31441-2015 Electronic toll collection―Technical specification of IC card reader
GB/T 15136-1994 General principles of measuring methods for quartz clock and watch circuits of semiconductor integrated circuits
GB/T 36479-2018 Integrated circuits—Test methods for column grid array
GB/T 14030-1992 principles of measuring methods of timer circuits for semiconductor integrated circuits
GB 51122-2015 Code for design of integrated circuit assembly and test factory
GB/T 14862-1993 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T 43063-2023 Integrated circuit—Test method for CMOS image sensors
GB/T 42848-2023 Semiconductor intergrated circuits—Test method of direct digital frequency synthesizer
GB/T 18726-2002 Software interface specification of integrated technology of modern design engineering
GB/T 6798-1996 Semiconductor integrated circuits-General principles of measuring methods of voltage comparators
GB/T 42838-2023 Semiconductor integrated circuits—Measuring method of Holzer circuit
GB/T 43538-2023 Quality and technical requirements for metal packages used for integrated circuits
GB/T 4377-2018 Semiconductor integrated circuits—Measuring method of voltage regulators
GB/T 42970-2023 Semiconductor integrated circuits—Measuring methods of video encoder and decoder circuits
GB/T 43061-2023 Semiconductor integrated circuits—Test methods of PWM controller
GB/T 16878-1997 Specification for metrology pattern cells for integrated circuit manufacture
GB/T 9178-1988 Terminology for integrated circuits
GB/T 18726-2011 Software interface specification of integrated technology of modern design engineering
GB/T 14113-1993 of packages for semiconductor integrated circuits
GB/T 18392-2001 Norm of Integrated Circuit (IC) card of certificate of identity code for organizations institutions and enterprises of the Pepoples Republic of China
GB 14030-1992 Basic principles of semiconductor integrated circuit time-based circuit testing methods
GB/T 42975-2023 Semiconductor integrated circuits—Test method of driver device
GB 35007-2018 Semiconductor integrated circuit low voltage differential signal circuit testing method
GB/T 12842-1991 Terminology for film integrated circuits and hybrid film integrated circuits
GB/T 4377-1996 Semiconductor integrated circuits-General principles of measuring methods of voltage regulator
GB/T 43040-2023 Semiconductor integrated circuits—Test method of AC/DC converters
GB/T 19558-2004 General specifications for integrated circuit(IC) card payphone and sytem
GB/T 36477-2018 Semiconductor integrated circuit—Measuring methods for flash memory
GB/T 2900.66-2004 Electrotechnical terminology - Semiconductor devices and integrated circuits

Taiwan Provincial Standard of the People's Republic of China

CNS 10619-1983 Glossary of Integrated Circuit Production Techniques

工业和信息化部

YD/T 3036-2016 Technical specification for USB characteristic between UICC and terminal interface
SJ/T 11702-2018 Semiconductor integrated circuit serial peripheral interface test method
SJ/T 11706-2018 Semiconductor integrated circuit field programmable gate array testing method
JB/T 14013-2020 IC trim dies- -Specifications
SJ/T 10805-2018 Semiconductor integrated circuits Measuring methods for voltage comparators

Professional Standard - Machinery

JB/T 14215-2023 Forming dies for integrated circuit lead — Specifications

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 40305-2021 Field device integration—EDD and OPC UA integration technology specification
GB/T 40577-2021 Terminology for integrated circuit(IC) manufacturing equipment

Professional Standard - Electron

SJ/T 10111-1991 Automatic measuring instruments for integrated circuits for Type GH3123
SJ 20954-2006 Integrated circuits latch-up test
SJ/T 10741-2000 Semiconductor integrated circuits General principles of measuring methods for CMOS circuits
SJ/T 10804-2000 Semiconductor integrated circuits.General principles of measuring methods for level translator
SJ/T 10196-1991 Measuring methods of MSI and SSI digital IC static parameter testers
SJ/T 10195-1991 General specification for MSI and SSI digital IC static parameter test instrument
SJ 20646-1997 The measuring methods of DC/DC converters for hybrid integrated circuits
SJ/T 11430-2010 Technical requirements and test methods for baseband processing IC of GPS receiver
SJ/T 10400-1993 General principles of measuring methods for graphic equalizers of semiconductor audio integrated circuits
SJ/T 10741-1996 Semiconductor integrated circuits--General principles of measuring methods for CMOS circuits
SJ/T 10736-1996 Semiconductor integrated circuits - General principles of measuring methods for HTL circuits
SJ/T 11512-2015 Test methods of electronic pastes for integrated circuit performent
SJ 2232-1982 Specification for metal packages of thick-film and thin-film integrated circuits
SJ/T 11005-1996 Semiconductor TV integrated circuits - General principles of measuring methods for audio channel circuits
SJ/T 10427.2-1993 General principles of measuring methods of intermediate-frequency amplifier for semiconductor audio integrated circuits
SJ/Z 2926-1988 Test methods for properties of mask-making equipment for manufacturing of ICs
SJ/T 10401-1993 General principles of measuring methods for motor speed stablizers of semiconductor audio integrated circuits
SJ/T 11774-2021 Specification of integrated circuit lead frame plating silver layer
SJ 2520-1984 General specification for sockets for integrated circuits
SJ/Z 11352-2006 Integrated circuit IP core test data interchange formats and guidelines specification
SJ/Z 2927-1988 Terminology for mask-making equipment for integrated circuits manufacturing
SJ/T 11006-1996 Semiconductor TV integrated circuits - General principles of measuring methods for horizontal and vertical sweep circuits
SJ/T 10402-1993 General principles of measuring methods for automatic music selectors of semiconductor audio integrated circuits
SJ/T 10737-1996 Semiconductor integrated circuits - General principles of measuring methods for ECL circuits
SJ/T 11004-1996 Semiconductor TV integrated circuits - General principles of measuring methods for picture channel circuits
SJ/T 10427.1-1993 Grneral Principles of measuring methods of FM converter for semiconductor audio integrated circuits
SJ/T 10152-1991 Terms relating to main equipment for integrated circuit technologies
SJ/T 10735-1996 Semiconductor integrated circuits General principles of measuring methods for TTL circuits
SJ/T 11222-2000 General specification for Integrated circuit cards.Part 3:Test methods
SJ/T 10803-1996 Semiconductor integrated circuits used as interface circuits - General principles of measuring methods for line circuits
SJ 20237-1993 Verification regulation of model GH3123 IC automatic tester
SJ/T 10805-2000 Semiconductor integrated circuits - General principles of measuring methods for voltage comparators

Professional Standard - Military and Civilian Products

WJ 2061-1991 General technical requirements for fuze integrated circuits

Professional Standard - Aerospace

QJ 2491-1993 Test methods for operational amplifiers in semiconductor integrated circuits
QJ 260-1977 器件
QJ 1460-1988 Measuring Methods for Broadband Amplifiers of Semiconductor Integrated Circuits
QJ 257-1977 Semiconductor TTL Integrated Digital Circuit Testing Method
QJ 2660-1994 Test method for pulse width modulator of semiconductor integrated circuit switching power supply
QJ/Z 33-1977 Field effect digital integration (P-MOS) circuit test method
QJ 786-1983 Semiconductor Integrated Circuits - Specifications for Screening
QJ 1528-1988 Semiconductor integrated circuit time base test method

Group Standards of the People's Republic of China

T/CSGF 019-2022 Second Generation Fitness Path Integrated Management and Service System Information Transmission Technical Specifications
T/CESA 1266-2023 Semiconductor integrated circuits-technical requirement for optical interconnection interface
T/QDAS 002-2017 General technical specifications for modern guided tram
T/CSEE 0242-2021 Power quality field test technical specification
T/JSSES 16-2021 Technical requirements and test method for comprehensive utilization of waste sulfuric acid in integrated circuit manufacturing industry
T/JSEE 004-2024 Coiled cable field tester
T/QDAS 035-2020 Technical specification for modern guided tram engineering
T/SZCX 001-2019 Electronic controller of integration cooking appliances
T/ICMTIA 1-2019 The Integrated Circuit Materials Industry Technology Innovative Alliance—Gas base specification
T/SIA 036-2023 Application modernization technology capacity maturity assessment model
T/SLEIA 0004-2024 Technical specifications for long-term storage of integrated circuit chips
T/SICA 006-2024 General technical requirements for overhead hoist transfer system used in integrated circuit wafer factory

Professional Standard - Aviation

HB 5834-1983 Technical Specifications of TTL Integrated Circuit Screening for Aviation

Professional Standard - Urban Construction

CJ/T 166-2006 Integrated circuit card application technology of construction cause
CJ/T 166-2014 Integrated circuit card application technology of construction cause

National Metrological Verification Regulations of the People's Republic of China

JJG(电子) 04027-1989 1600 Type Integrated Circuit DC Parameter Test System Verification Regulations
JJG(电子) 04032-1989 BJ3122 (QL11) logic integrated circuit tester verification regulations
JJG 1015-2006 Verification Regulation of General Digital Integrated Circuit Testing System
JJG(电子) 04029-1989 J273B type linear integrated circuit test system verification regulations
JJG(电子) 04033-1989 BJ3123 type bipolar logic integrated circuit tester verification regulations
JJG(电子) 04042-1991 Verification regulations for GH3111/3111G integrated circuit tester
JJG(船舶) 22-1998 SID Large-Scale Digital Integrated Circuit Test System Verification Regulations
JJG(电子) 04021-1989 Specification for verification of BJ3110 model MOS integrated circuit testers
JJG(电子) 31001-2006 Specification for verification of testing system for integrated circuits' electrostatic discharge susceptibility
JJG(电子) 04031-1989 9200 Large-Scale Integrated Circuit Test System Verification Regulations
JJG(船舶) 23-1998 Verification Regulations for ITS9000 Series VLSI Test System
JJG(电子) 04034-1989 GR1731M type analog integrated circuit test system verification regulations
JJG(电子) 04035-1989 GR1732M digital integrated circuit test system verification regulations

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

GB/T 14028-2018 Semiconductor integrated circuits—Measuring method of analogue switch
GB/T 35006-2018 Semiconductor integrated circuits—Measuring method of level converter
GB/T 35007-2018 Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry
GB/T 35005-2018 Test methods for flip chip integrated circuits
GB/T 32419.5-2017 Information technology--SOA technology implementation specification--Part 5: Development of service integration

Shanghai Provincial Standard of the People's Republic of China

DB31/ 188-1996 Contact IC Card Organization Code Certificate

Military Standard of the People's Republic of China-General Armament Department

GJB 9147-2017 Semiconductor integrated circuit operational amplifier test methods
GJB 9388-2018 Test methods for integrated circuit analog-to-digital and digital-to-analog converters
GJB 9389-2018 Integrated circuit lock test method
GJB/J 3524-1999 Calibration regulations for S10 large-scale digital integrated circuit test system

未注明发布机构

IEC 60311-3:2018 Integrated circuits – Three dimensional integrated circuits – Part 3: Model and measurement conditions of through-silicon via
DIN EN 62769-6 E:2019-06 Field Device Integration (FDI) - Part 6: FDI Technology Mapping
DIN EN 62769-6 E:2013-01 Field Device Integration (FDI) - Part 6: FDI Technology Mapping

National Metrological Technical Specifications of the People's Republic of China

JJF 1238-2022 Calibration Specification for Testing Systems of Microcircuits Electro-static Discharge (ESD) Sensitivity
JJF 1238-2010 Calibration Specification for the Testing System for Microcircuits Electro-static Discharge(ESD)Sensitivity
JJF 1160-2006 Calibration Specification of Small & Medium Scale Digital Integrated Circuit Testing System

Beijing Provincial Standard of the People's Republic of China

DB11/T 2080-2023 Technical Guidelines for Environmental Impact Assessment of Construction Projects Integrated Circuit Manufacturing

Professional Standard - Energy

NB/T 11316-2023 Technical specification for field testing of power quality in substation

Henan Provincial Standard of the People's Republic of China

DB41/T 1643.3-2018 Technical Specifications for Elevator Operation Monitoring System Part 3: Technical Requirements for Field Acquisition Devices

British Standards Institution (BSI)

BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits - Terminology
BS PD ISO/IEC TR 30117:2021 Information technology. Standards and applications for the integration of biometrics and integrated circuit cards (ICCs)
PD ISO/IEC TR 30117:2021 Information technology. Standards and applications for the integration of biometrics and integrated circuit cards (ICCs)
BS EN IEC 62769-6-100:2023 Field Device Integration (FDI®) - Technology Mapping – .Net
BS EN IEC 62769-6-200:2023 Field Device Integration (FDI®) - Technology Mapping. HTML5
BS IEC 63011-3:2018 Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon via
BS EN IEC 62769-6:2021 Field Device Integration (FDI) Part 6 : Technology Mapping
BS EN 165000-2:1996 Film and hybrid integrated circuits. Internal visual inspection and special tests
BS EN 62132-8:2012 Integrated circuits. Measurement of electromagnetic immunity. Measurement of radiated immunity. IC stripline method
BS IEC 62265:2005 Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells and blocks
BS ISO/IEC 24727-5:2011 Identification cards. Integrated circuit card programming interfaces. Testing procedures
BS EN 60747-16-10:2004 Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
18/30363192 DC BS EN 62769-6. Field Device Integration (FDI). Part 6. FDI Technology Mapping

IET - Institution of Engineering and Technology

SILI TECH INTEG CIRC-2004 Silicide Technology for Integrated Circuits
TECH COMP AID DES SI SIGE GAAS INTEG CIRC-2007 Technology Computer Aided Design for Si@ SiGe and GaAs Integrated Circuits

RU-GOST R

GOST 18725-1983 Integrated circuits. General specifications
GOST R 57435-2017 Integrated circuits. Terms and definitions
GOST 17021-1988 Integrated circuits. Terms and definitions
GOST R 59702-2021 Monolithic microwave integrated circuits. Terms and definitions

KR-KS

KS C IEC 63011-1-2022 Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology

Korean Agency for Technology and Standards (KATS)

KS C 6063-1978(2001) GLOSSARY OF TERMS USED IN INTEGRATED CIRCUIT
KS C IEC 63011-1:2022 Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology
KS C 5113-1983 MEASURING METHODS FOR MOS DIGITAL INTEGRATED CIRCUITS
KS C 5113-1983(1998) MEASURING METHODS FOR MOS DIGITAL INTEGRATED CIRCUITS
KS C 6050-1985(2000) MEASURING METHODS FOR BIPOLAR DIGITAL INTEGRATED CIRCUITS
KS C 6050-1985 MEASURING METHODS FOR BIPOLAR DIGITAL INTEGRATED CIRCUITS
KS C 6063-2002 GLOSSARY OF TERMS USED IN INTEGRATED CIRCUIT
KS C 5113-2002 MEASURING METHODS FOR MOS DIGITAL INTEGRATED CIRCUITS
KS C 6049-2020 Environmental Testing Methods and Endurance Testing Methods for Semiconductor Integrated Circuits
KS C IEC 62528:2015 Standard Testability Method for Embedded Core-based Integrated Circuits
KS C IEC 62381-2013 Automation systems in the process industry－Factory acceptance test(FAT), site acceptance test(SAT), and site integration test(SIT)

International Electrotechnical Commission (IEC)

IEC 63011-1:2018 Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
IEC 62769-6:2021 Field Device Integration (FDI) - Part 6: Technology Mapping
IEC 62769-6:2021 RLV Field Device Integration (FDI) - Part 6: Technology Mapping
IEC 62769-6:2023 Field Device Integration (FDI？) - Part 6: FDI Technology Mappings
IEC 62769-6:2015 Field Device Integration (FDI) - Part 6: FDI Technology Mapping
ISO/IEC TR 30117:2014 Information technology - Guide to on-card biometric comparison standards and applications
IEC 62769-6:2023 RLV Field Device Integration (FDI？) - Part 6: FDI Technology Mappings
IEC 62769-6-200:2023 Field Device Integration (FDI？) - Part 6-200: Technology Mapping - HTML5
IEC 63011-3:2018 Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
IEC 62132-8:2012 Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC Stripline method

SE-SIS

SIS SEN 01 03 62-1974 Integrated circuits. Analog circuits. Terminology

SCC

BS EN 62769-6:2015 Field Device Integration (FDI)-FDI Technology Mapping
MIL MIL-PRF-38535H-2007 INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR(SUPERSEDING MIL-PRF-38535G)
DANSK DS/EN IEC 62769-6:2021 Field Device Integration (FDI) – Part 6: Technology Mapping
CEI EN IEC 62769-6:2021 Field Device Integration (FDI) Part 6: Technology Mapping
CEI EN 62769-6:2016 Field Device Integration (FDI) Part 6: FDI Technology Mapping
DANSK DS/EN 62769-6:2015 Field Device Integration (FDI) – Part 6: FDI Technology Mapping
CEI EN IEC 62769-6-200:2023 Field Device Integration (FDI) Part 6-200: Technology Mapping - HTML5
CEI EN IEC 62769-6-100:2023 Field Device Integration (FDI) Part 6-100: Technology Mapping - .Net
INCITS 410:2006 Information technology - Information technology - Identification cards -Limited Use (LU), Proximity Integrated Circuit Card (PICC)
12/30260255 DC BS EN 62769-6. Field device integration. Part 6. Technology Mapping
MIL MIL-PRF-38535E-1997 INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-I-38535D) (S/S BY MIL-PRF-38535F)
MIL MIL-PRF-38535F-2002 INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-PRF-38535E)(S/S BY MIL-PRF-38535G)
INCITS 410:2015 Information technology - Identification cards - Limited Use (LU), Proximity Integrated Circuit Card (PICC)
DIN EN IEC 62769-6:2022 Field Device Integration (FDI) - Part 6: Technology Mapping (IEC 62769-6:2021); English version EN IEC 62769-6:2021
CEI EN 62381:2013 Automation systems in the process industry - Factory Acceptance Test (FAT), Site Acceptance Test (SAT) and Site Integration Test (SIT)

Japanese Industrial Standards Committee (JISC)

JIS C 5610:1996 Glossary of terms used in integrated circuits
JIS C 7042:1982 Measuring methods for MOS digital integrated circuits

PL-PKN

PN T01303-03-1991 Semicondutor devices. Integrated circuits. Analogue integrated circuits. Measuring methods
PN T01303-03-A1-1991 Semiconductor devices Integrated circuits Analogue integrated circuits Measuring methods Amendment 1
PN T01600 ArkusZ00-1972 Integrated circuits Terms and definitions General resolu?ions
PN T01600 ArkusZ01-1972 In?egra?ed circui?s Terms and definitions Fundamental concep?s

IEC - International Electrotechnical Commission

IEC 60748-22:1992 Semiconductor Devices Integrated Circuits Part 22: Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures (IECQ QC 760200) (Edition 1.0)

Danish Standards Foundation

DS/ISO/IEC TR 30117:2021 Information technology – Standards and applications for the integration of biometrics and integrated circuit cards (ICCs)
DS/CECC 265001:2000 Technology Approval Schedule: Film and hybrid integrated circuits
DS/EN IEC 62769-6:2021 Field Device Integration (FDI) – Part 6: Technology Mapping

ES-AENOR

UNE 21-302 Pt.521-1992 Electrotechnical vocabulary. Semiconductor devices and integrated circuits

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD47I-2012 Stress-Test-Driven Qualification of Integrated Circuits
JEDEC JESD47G.01-2010 Stress-Test-Driven Qualification of Integrated Circuits
JEDEC JESD47H-2011 Stress-Test-Driven Qualification of Integrated Circuits
JEDEC JESD51-8-1999 Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board

RO-ASRO

STAS 10630-1976 DIGITAL INTEGRATED CIRCUITS Measuring methods of outptut quantities
SR CEI 34-6-1991 Rotating electrical machines. Part 6: Methcds of cooling (IC Code)
STAS 8051-1988 Television Receivers ASSEMBLIES, COMPONENTS, CIRCUITS Terminology

Association Francaise de Normalisation

NF C46-769-6*NF EN IEC 62769-6:2021 Field Device Integration (FDI) - Part 6 : technology Mapping
NF C46-769-6*NF EN 62769-6:2015 Field device integration (FDI) - Part 6 : FDI technology mapping
NF EN IEC 62769-6-100:2023 Field device integration (FDIR) - Part 6-100: technology mapping - .Net
NF EN 62132-8:2013 Integrated circuits - Measurement of electromagnetic immunity - Part 8: measurement of radiated immunity - Plate TEM line method for integrated circuit
NF EN IEC 61967-8:2023 Integrated circuits - Measurement of electromagnetic emissions - Part 8: measurement of radiated emissions - TEM stripline method for integrated circuits
NF EN 62381:2015 Systèmes d'automatisation pour les procédés industriels - Essais d'acceptation en usine (FAT), essais d'acceptation sur site (SAT) et essais d'intégration sur site (SIT)
NF C96-261-8*NF EN 62132-8:2013 Integrated circuits - Measurement of electromagnetic immunity - Part 8 : measurement of radiated immunity - IC stripline method
NF C46-071*NF EN 62381:2015 Automation systems in the process industry - Factory acceptance test (FAT), site acceptance test (SAT), and site integration test (SIT)

German Institute for Standardization

DIN EN IEC 62769-6:2022-11 Field Device Integration (FDI) - Part 6: Technology Mapping (IEC 62769-6:2021); English version EN IEC 62769-6:2021 / Note: DIN EN 62769-6 (2016-03) remains valid alongside this standard until 2024-03-12.

ES-UNE

UNE-EN IEC 62769-6:2021 Field Device Integration (FDI) - Part 6: Technology Mapping (Endorsed by Asociación Española de Normalización in May of 2021.)
UNE-EN 62769-6:2015 Field Device Integration (FDI) - Part 6: FDI Technology Mapping (Endorsed by AENOR in August of 2015.)
UNE-EN IEC 62769-6:2023 Field Device Integration (FDI®) - Part 6: FDI Technology Mappings (Endorsed by Asociación Española de Normalización in July of 2023.)
UNE-EN IEC 62769-6-200:2023 Field Device Integration (FDI®) - Part 6-200: Technology Mapping - HTML5 (Endorsed by Asociación Española de Normalización in July of 2023.)
UNE-EN IEC 62769-6-100:2023 Field Device Integration (FDI®) - Part 6-100: Technology Mapping - .Net (Endorsed by Asociación Española de Normalización in July of 2023.)

GOST

GOST R 71074-2023 Integrated circuits. Magnetic bubble integrated circuits memory. Terms, definitions and letter symbols characteristics

Society of Automotive Engineers (SAE)

SAE J1752/1-2006 Electromagnetic Compatibility Measurement Procedures for Integrated Circuits—Integrated Circuit EMC Measurement Procedures—General and Definitions
SAE J1752/1-1997 Electromagnetic Compatibility Measurement Procedures for Integrated Circuits-Integrated Circuit Emc Measurement Procedures-General and Definition
SAE J1752-1-1997 Electromagnetic Compatibility Measurement Procedures for Integrated Circuits - Integrated Circuit EMC Measurement Procedures - General and Definitions
SAE J1752/1-2021 Electromagnetic Compatibility Measurement Procedures for Integrated Circuits - Integrated Circuit EMC Measurement Procedures - General and Definitions
SAE J1752-3-2017 Electromagnetic Compatibility Measurement Procedures for Integrated Circuits Integrated Circuit EMC Measurement Procedures General and Definition
SAE J1752-1-2021 Electromagnetic Compatibility Measurement Procedures for Integrated Circuits Integrated Circuit EMC Measurement Procedures General and Definition
SAE J1752/1-2016 Electromagnetic Compatibility Measurement Procedures for Integrated Circuits - Integrated Circuit EMC Measurement Procedures - General and Definitions

American National Standards Institute （ANSI)

BS EN IEC 62769-6:2023 Field Device Integration (FDI®) FDI Technology Mappings (British Standard)
ANSI/INCITS 273-1997 Information Technology - CASE Tool Integration Messages Replaces ANSI X3.273-1997
ANSI/INCITS 410-2006 Information technology - Identification cards - Limited Use (LU), Proximity Integrated Circuit Card (PICC)

European Committee for Electrotechnical Standardization（CENELEC）

EN 62769-6:2015 Field Device Integration (FDI) - Part 6: FDI Technology Mapping
EN 165000-2:1996 Film and Hybrid Integrated Circuits Part 2: Internal Visual Inspection and Special Tests

SAE - SAE International

SAE J1752-1-2016 Electromagnetic Compatibility Measurement Procedures for Integrated Circuits Integrated Circuit EMC Measurement Procedures General and Definition
SAE J1752-3-2003 Electromagnetic Compatibility Measurement Procedures for Integrated Circuits Integrated Circuit EMC Measurement Procedures General and Definition

International Organization for Standardization (ISO)

ISO/IEC TR 30117:2021 Information technology — Standards and applications for the integration of biometrics and integrated circuit cards (ICCs)

CZ-CSN

CSN 35 8793 Cast.1-1986 Microprocessor integrated circuits. Technical terms, definltions and symbols of electrlcal parameters
CSN 35 8790 Cast.1-1983 Digital integrated circuits. Measuring methods of electrical parameters
CSN 35 8791 Cast.1-1984 Analogue integrated circuits. Measuring methods of electrical parameters

IX-IX-IEC

IEC 62769-6-100:2023 Field Device Integration (FDI？) - Part 6-100: Technology Mapping - .Net

VDI - Verein Deutscher Ingenieure

VDI 6010 BLATT 3-2018 Technical safety installations for buildings - Integrated system test

YU-JUS

JUS N.R1.900-1980 Digital integrated circuits. Acceptance and reSability. Ekctrical tests

IN-BIS

IS 12641-1989 Environmental testing procedures for semiconductor devices and integrated circuits
IS 12970 Pt.3/Sec.3-1993 Semiconductor devices—Integrated circuits Part 3 Digital integrated circuits—Measurement methods Section 3: Dynamic measurements
IS 12970 Pt.3/Sec.1-1992 Semiconductor devices—Integrated circuits Part 3 Digital integrated circuits—Measurement methods Section 1: General
IS 12970 Pt.6/Sec.1-1992 Semiconductor Devices—Integrated Circuits Part 6 Analog Integrated Circuit Measurement Methods Section 1: General
IS 12970 Pt.6/Sec.3-1992 Semiconductor Devices—Integrated Circuits Part 6 Analog Integrated Circuit Measurement Methods Section 3: Voltage Regulators
IS 12970 Pt.3/Sec.2-1992 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Measuring methods. Section 2: Static characteristics

BE-NBN

NBN-CECC 63200-1994 Special Note Coated Hybrid Integrated Circuits (Approved Proprietary Technology)
NBN-CECC 63201-1994 Special Note. Coated hybrid integrated circuits (approved proprietary technology)

ANSI - American National Standards Institute

INCITS 410-2015 Information Technology – Identification Cards – Limited Use (LU)@ Proximity Integrated Circuit Card (PICC)

Institute of Electrical and Electronics Engineers (IEEE)

IEEE Std 1838-2019 IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits
IEEE 1838-2019 IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

GSO

GSO IEC 62528:2014 Standard Testability Method for Embedded Core-based Integrated Circuits
GSO IEC 62381:2015 Automation systems in the process industry - Factory acceptance test (FAT), site acceptance test (SAT), and site integration test (SIT)

Lithuanian Standards Office

LST EN IEC 62769-6:2021 Field Device Integration (FDI) - Part 6: Technology Mapping (IEC 62769-6:2021)

ESD - ESD ASSOCIATION

JTR001-01-2012 User Guide of ANSI/ESDA/JEDEC JS-001 Human Body Model Testing of Integrated Circuits

Others: Modern Physical Testing Technology,Modern Analysis and Testing Technology,Modern Optical Testing Technology,Integrated Circuit Testing Technology,Modern IC Testing Technology,Modern photoelectric testing technology,Modern Mechanical Testing Technology