GB/T 16878-1997 in English
VALIDSpecification for metrology pattern cells for integrated circuit manufacture
- Issued on:1997-06-20
- Implemented on:1998-03-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$175.00
| Standard No: | GB/T 16878-1997 |
| Document status: | VALID |
| Title in English: | Specification for metrology pattern cells for integrated circuit manufacture |
| Title in Chinese: | 用于集成电路制造技术的检测图形单元规范 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 1~3 business days |
| Issued on: | 1997-06-20 |
| Implemented on: | 1998-03-01 |
| ICS Classification: | 31.200-Integrated circuits. Microelectronics |
| Chinese Classification: | L97-Dedicated processing equipment |
| Professional Classification: | GB-National Standard |
| Related Keywords: | metrology pattern cells
integrated circuit manufacture scopethis specification specifies test pattern actual test pattern several basic test pattern units |
| Related Topics: | Multivariate Detection Technology
Manufacturing Technology Manufacturing Technology Modern IC Testing Technology detection integrated circuit GBT16878 Homemade voltage test circuit diagram integrated circuit technology Integrated circuit micro-nano testing equipment testing |
《GB/T 16878-1997用于集成电路制造技术的检测图形单元规范》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。
本规范规定若干种标准测试图形，用以对集成电路生产中所用的微图形设备、计量仪器和工艺进行一致的全面评估和检测。
Scope
This specification specifies several standard test patterns for the consistent and comprehensive evaluation and testing of micrographic equipment, metrology instruments and processes used in the production of integrated circuits. This specification specifies the shape, general size, and recommended layout and design rules of several basic test pattern units for the needs of line width measurement, resolution test and proximity effect test. These standard patterns include various pattern elements available for optical microscope, electron microscope, and electron probe measurements. This specification does not specify the measurement technology for verifying the critical dimensions of the test pattern on the master, nor does it specify how to measure the photolithographic pattern on the wafer. It only specifies several necessary basic test patterns and the actual test pattern that the user implements in accordance with this specification.
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