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GB/T 41488-2022 in English

GB/T 41488-2022 in English

VALID

Plastics—Prepregs—Definitions of terms and symbols for designations

  • Issued on:2022-04-15
  • Implemented on:2022-11-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $100.00
$97.00
Standard No: GB/T 41488-2022
Document status: VALID
Title in English: Plastics—Prepregs—Definitions of terms and symbols for designations
Title in Chinese: 塑料 预浸料 术语定义和命名符号
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2022-04-15
Implemented on: 2022-11-01
ICS Classification: 83.120-Reinforced plastics
Professional Classification: GB-National Standard
Related Topics: Prepreg
gb plastic
Prepreg abroad
GBT41488
GB/T 41488-2022
plastic shell symbol
Foreign prepreg
Dip plastic products
Solder naming

《GB/T 41488-2022塑料 预浸料 术语定义和命名符号》由TC15(全国塑料标准化技术委员会)归口,主管部门为中国石油和化学工业联合会。


Introduction

Standard framework and technological evolution

This standard is equivalent to the classic definition of prepreg in ISO8604, and adds the classification of thermoplastic resin to meet the needs of emerging fields such as new energy vehicle components, 5G communication housings, etc. A three-level standard system has been formed in terms of technological evolution:

Level1990s2010 edition2022 new edition
Resin typeMainly thermosettingAdd vinyl ester resinAdd thermoplastic classification
Product formSheet/ribbonIntroduction of flat wire windingDefinition of bobbin melting process

Interpretation of the core terminology system

1—Resin matrix classification

Definitionthermosetting molding materials (3.1.2) is the irreversible cross-linking characteristics in the 120-180℃ curing range; the newly added thermoplastic matrix must meet the technical requirement of 200-400℃ melt index>15g/10min.


2—Grading Control System

Shrinkage LevelLinear Shrinkage RateApplication Field
Zero Shrinkage Level≤0%Precision Optical Devices
Micro Shrinkage Level<0.05%Aerospace Structural Parts

Implementation Suggestion Template

Step 1: Substrate Selection—For electrical components, DMC/PIR combination is preferred to achieve CTI≥600V; Step 2: Storage management - Thermosetting products need to be kept 5-15℃ refrigerated (RH <30%);
Step 3: Formula optimization - Auto parts processing is toughened by 5‰ carbon black + dioctyl ester to improve fluidity

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