GB/T 4909.12-2009 in English
VALIDTest methods for bare wires - Part 12: Solderability test of coating - Solder globule method
- Issued on:2009-03-19
- Implemented on:2009-12-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$117.00
| Standard No: | GB/T 4909.12-2009 |
| Document status: | VALID |
| Title in English: | Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method |
| Title in Chinese: | 裸电线试验方法 第12部分：镀层可焊性试验 焊球法 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 1~3 business days |
| Issued on: | 2009-03-19 |
| Implemented on: | 2009-12-01 |
| Superseding: |
GB 4909.12-1985 Test methods for bare wires; Solderability test of coating; Solder globule method
|
| ICS Classification: | 29.060.10-Wires |
| Chinese Classification: | K11-Bare wire |
| Professional Classification: | GB-National Standard |
| Related Keywords: | solder globule method scopethis part
solderability test bare wire solder ball coating test methods test equipment |
| Related Topics: | Solderability
GB/T 4909.12 GB/T 4909.12-1985 GB/T 4909.12-2009 Solderability testing method Electroplating factory trial plating laboratory Plating Solderability Test |
Scope
This part of GB/T 4909 specifies the test equipment, sample preparation, measurement procedures, test results and evaluation, etc. for the solderability test of the bare wire solder ball coating. This section is applicable to test the wettability of the surface of tinned copper wire by molten solder, which is expressed by a specific time. The method in this part is to use the sample to divide the solder ball of molten solder into two halves, and measure the time required for the sample to cut the solder ball until the solder flows around the sample and covers the sample. This time indicates the solderability of the sample. This section should be used together with GB/T 4909.1-2009.
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