GB/T 4937-1995 in English

SUPERSEDED

Mechanical and climatic test methods for semiconductor devices

Issued on:1995-01-02
Implemented on:1996-08-01
File Format:PDF
Delivery:Via email within 5 business days

Price(USD)： $480.00
$466.00

Standard No:	GB/T 4937-1995
Document status:	SUPERSEDED
Superseded by:	GB/T 4937.1-2006 Semiconductor devices - Mechanical and climatic test methods - Part 1 : General GB/T 4937.2-2006 Semiconductor devices - Mechanical and climatic test methods - Part 2 : Low air pressure
Superseded on:	2007-02-01
Title in English:	Mechanical and climatic test methods for semiconductor devices
Title in Chinese:	半导体器件机械和气候试验方法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 5 business days
Issued on:	1995-01-02
Implemented on:	1996-08-01
ICS Classification:	31.080-Semiconductor devices
Chinese Classification:	L40-Semiconductor discrete devices in general
Professional Classification:	GB-National Standard
Related Keywords:	climatic test methods supplementary test methods semiconductor devices scopethis standard basic environmental test procedures non-cavity devices
Related Topics:	as4937 semiconductor equipment Semiconductor outgassing Semiconductor device high temperature GB/T 4937 high temperature semiconductor device climate test high temperature semiconductor device gb4937 gb t4937 gb/t+4937 Mechanical and climatic test methods for semiconductor devices GBT4937 Semiconductor device high temperature test Semiconductor device Total dose test method for aerospace semiconductor devices Reference and candidate methods Reference method candidate method Semiconductor chemical purification methods gb/t4937

《GB/T 4937-1995半导体器件机械和气候试验方法》由TC78（全国半导体器件标准化技术委员会）归口，主管部门为工业和信息化部（电子）。
本标准列出了适用于半导体器件(分立器件和集成电路)的试验方法。使用时可从中进行选择。对于非空腔器件，可以要求补充的试验方法。

Scope

This standard lists test methods applicable to semiconductor devices (discrete and integrated circuits). You can choose from them when you use them. For non-cavity devices, supplementary test methods may be required. Note: A non-cavity device is one in which the encapsulation material is in intimate contact with all exposed surfaces of the die without any voids in the device structure. This standard has considered IEC 68 "Basic Environmental Test Procedures" as much as possible.

More samples: DL/T 368-2010 GB 50021-2001(2009) QC/T 942-2021

Sample only — not a preview of GB/T 4937-1995