Semiconductor device high temperature
Semiconductor device high temperature, Total:284 items.
The international standard classification for "Semiconductor device high temperature" includes: Semiconductor devices , Semiconductor devices in general , Optoelectronics. Laser equipment , Other fiber optic equipment .
The Chinese standard classification for "Semiconductor device high temperature" includes: Semiconductor discrete devices in general , Laser device , Precious metals and their alloys , Technical management , Technical Management , Technical management , Technical management , Technical management , Power semiconductor device and parts , Optical communication equipment .
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB 12565-1990 Sectional Specification for Semiconductor Devices and Optoelectronic Devices
- GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
- GB/T 45716-2025 Semiconductor devices—Bias temperature instability test for metal-oxide semiconductor field-effect transistors (MOSFETs)
- GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
- GB/T 12560-1999 Semiconductor devices --Sectional specification for discrete devices
- GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
- GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
- GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers
- GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
- GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
Military Standard of the People's Republic of China-General Armament Department
- GJB/Z 41.7-1993 Military semiconductor discrete device series spectral thermoelectric cooling components
- GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
- GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
- GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
Professional Standard - Electron
- SJ 50033/1-1994 Semiconductor discrete device-Detail specification for type 3DA150 high frequency and power transistor
- SJ 20072-1992 Semiconductor discrete device-Detail specification for semiconductor opto-couplers for Type GH24,GH25 and GH26
- SJ/T 10414-1993 Solder for semicoductor device
- SJ/Z 9021.1-1987 Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices
- SJ/T 10535-1994 Tungsten boat for semiconductor devices
- SJ/T 10414-2015 Solder for semiconductor device
- SJ 50033/103-1996 Semiconductor discrete devices - Detail specification for Type 3DA89 high-frequency power transistor
Group Standards of the People's Republic of China
- T/CASME 1438-2024 Semiconductor device processing specification
- T/IAWBS 009-2019 High Voltage Bias Steady-state Temperature Humidity Test for Power Semiconductor Devices
Professional Standard - Machinery
- JB/T 4277-1996 Packing of Power Semiconductor Parts
- JB/T 5843-1991 Connectors for Power Semiconductor Devices
Professional Standard - Post and Telecommunication
- YD/T 1687.1-2007 Technical Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication Part 1:2.5Gbit/s Cooled Direct Modulation Semiconductor Laser Assembly
- YD/T 1687.2-2007 Technical Requirements of High Speed Semiconductor Laser Assembly for Optical Fiber Communication Part 1:2.5Gbit/s Uncooled Direct Modulation Semiconductor Laser Assembly
Professional Standard - Aerospace
- QJ 1511-1988 Acceptance Specification for Semiconductor Devices
- QJ 2225-1992 Semiconductor Device Usage Rules
British Standards Institution (BSI)
- BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
- 07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
- BS EN 60749-6:2017 Semiconductor devices. Mechanical and climatic test methods - Storage at high temperature
- BS EN 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Storage at high temperature
- BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
- BS IEC 60747-5-4:2022+A1:2024 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
- BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
- BS EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - High temperature operating life
- BS EN 60749-23:2004+A1:2011 Semiconductor devices. Mechanical and climatic test methods. High temperature operating life
- BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
- BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS EN IEC 60747-15:2024 Semiconductor devices - Discrete devices. Isolated power semiconductor devices
- BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS 3839:1965 Oxygen free high conductivity copper for electronic tubes and semiconductor devices
- BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
- BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
- BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
- BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
- BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
- BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
- BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- BS IEC 60747-1:2006 Semiconductor devices. General
- BS 3839:1978 Specification for oxygen-free high-conductivity copper for electronic tubes and semiconductor devices
- BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
- 07/30162213 DC BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
- BS EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Temperature cycling
- BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
- BS 6493-1.1:1984 Semiconductor devices - Part 1: Discrete devices - Section 1.1 General
- 19/30404095 DC BS EN IEC 60747-5-4. Semiconductor devices. Part 5-4. Optoelectronic devices. Semiconductor lasers
- 23/30451654 DC BS EN IEC 60747-15. Semiconductor devices. Part 15. Isolated power semiconductor devices. Discrete devices
- BS IEC 60747-7:2011 Semiconductor devices. Discrete devices. Bipolar transistors
- BS IEC 60747-7:2010 Semiconductor devices. Discrete devices. Bipolar transistors
- BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 60747-7:2010+A1:2019 Semiconductor devices. Discrete devices - Bipolar transistors
- BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 62047-29:2017 Semiconductor devices. Micro-electromechanical devices - Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
- BS IEC 60747-14-11:2021 Semiconductor devices - Semiconductor sensors. Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
- BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
- BS IEC 60747-8:2010+A1:2021 Semiconductor devices. Discrete devices - Field-effect transistors
- 23/30473272 DC BS IEC 60747-5-4 AMD 1. Semiconductor devices - Part 5-4. Optoelectronic devices. Semiconductor lasers
- BS EN 13604:2013 Copper and copper alloys. Semiconductor devices, electronic and vacuum products made from high conductivity copper
International Electrotechnical Commission (IEC)
- IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- IEC 60749-6:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
- IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
- IEC 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
- IEC 60747-15:2024 RLV Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
- IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- IEC 60747-5-4:2024 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60747-5-4:2022+AMD1:2024 CSV Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- IEC 60747-15:2024 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
- IEC 60749-23:2004/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60749-23:2004+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
- IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
- IEC 60747-5-4:2022/AMD1:2024 Amendment 1 - Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
- IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices (Edition 1.0)
- IEC 60749-23:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
- IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
- IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- IEC PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges
German Institute for Standardization
- DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
- DIN IEC 60747-14-5 E:2008-03 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
- DIN EN IEC 62969-3:2018-12*VDE 0884-69-3:2018-12 Semiconductor devices – Semiconductor interface for automotive vehicles
- DIN EN IEC 62969-4:2019-03*VDE 0884-69-4:2019-03 Semiconductor devices – Semiconductor interface for automotive vehicles
- DIN EN IEC 62969-2:2018-09*VDE 0884-69-2:2018-09 Semiconductor devices – Semiconductor interface for automotive vehicles
- DIN VDE V 0884-11:2017-01*VDE V 0884-11:2017-01 Semiconductor devices
- DIN EN 60749-6:2017-11 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017 / Note: DIN EN 60749-6 (2003-04) remains valid alongside this standard until 2020-04-07.
- DIN EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2002); German version EN 60749-6:2003
- DIN EN IEC 62969-1:2018-08*VDE 0884-69-1:2018-08 Semiconductor devices – Semiconductor interface for automotive vehicles
- DIN EN IEC 60747-17:2021-10*VDE 0884-17:2021-10 Semiconductor devices
- DIN EN IEC 60747-5-5:2021-10*VDE 0884-5:2021-10 Semiconductor devices
- DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
- DIN EN 62779-1:2017-01*VDE 0884-79-1:2017-01 Semiconductor devices – Semiconductor interface for human body communication
- DIN EN 62779-2:2017-01*VDE 0884-79-2:2017-01 Semiconductor devices – Semiconductor interface for human body communication
- DIN EN 62779-3:2017-03*VDE 0884-79-3:2017-03 Semiconductor devices – Semiconductor interface for human body communication
- DIN IEC 747-11:1992 Semiconductor devices; Sectional specification for semiconductor devices
- DIN EN 60747-15:2012-08 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010); German version EN 60747-15:2012 / Note: DIN EN 60747-15 (2004-08) remains valid alongside this standard until 2014-01-20.
- DIN EN 60749-23:2011-07 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011 / Note: DIN EN 60749-23 (2004-10) remains valid alongside this standard unt...
- DIN EN 60749-6 E:2016-09 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
- DIN EN IEC 63244-1:2023-11*VDE 0884-244-1:2023-11 Semiconductor devices – Semiconductor devices for wireless power transfer and charging
- DIN EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017
- DIN EN 60747-15:2004 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2003); German version EN 60747-15:2004
- DIN IEC 60747-15 E:2007 Draft Document - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007)
- DIN IEC 60747-15 E:2007-06 Draft Document - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007)
- DIN EN IEC 60747-15 E:2024 Draft Document - Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 47E/812/CDV:2023); German and English version prEN IEC 60747-15:2023
- DIN 40700-8:1972 Semiconductor device graphic symbols
- DIN EN IEC 60747-15 E:2024-06 Draft Document - Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 47E/812/CDV:2023); German and English version prEN IEC 60747-15:2023
- DIN EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004); German version EN 60749-23:2004
GCC Standardization Organization
- GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- GSO IEC 60749-6:2014 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
Defense Logistics Agency
- DLA MIL-S-19500/230 C VALID NOTICE 4-2011 Semiconductor Device, Diode, Silicon, High-Conductance Type JAN- 1N3207
- DLA DSCC-DWG-04029-2005 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH POWER TYPE 2N5927
- DLA DSCC-DWG-04030-2005 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH POWER TYPE 2N5926
- DLA DESC-DWG-84002-1984 HEAT SINKS FOR SEMICONDUCTOR DEVICES
- DLA MIL-S-19500/9 B VALID NOTICE 3-2011 Semiconductor Device, Transistor, PNP, Germanium, High Frequency, 25 Milliwatt, Type JAN-2N128
- DLA MIL-S-19500/335 VALID NOTICE 4-2011 Semiconductor Device, Silicon, Voltage Reference (Temperature- Stable) Type 1N430A, 1N430B
- DLA QML-19500-QPD-2012 Semiconductor Devices, General Specification for
- DLA MIL-PRF-19500/622 C-2008 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH-POWER TYPE 2N7368 JAN, JANTX, JANTXV, AND JANS
- DLA QML-19500-2011 Semiconductor Devices, General Specification for
- DLA MIL-S-19500/208 B VALID NOTICE 4-2011 Semiconductor Device, Transistor, NPN, Silicon, High Power, Types 2N1487, 22N1488, 2N1489 and 2N1490
- DLA MIL-PRF-19500/622 D-2013 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH-POWER TYPE 2N7368 JAN, JANTX, JANTXV, AND JANS
- DLA QML-19500-QPD-2011 Semiconductor Devices, General Specification for
- DLA MIL-STD-750F w/CHANGE 3-2021 Test Methods for Semiconductor Devices
- DLA QML-19500-2013 Semiconductor Devices, General Specification for
- DLA MIL-S-19500/217 B VALID NOTICE 4-2011 Semiconductor Device, Transistors, PNP, Germanium, High-Power Types 2N456B, 2N457B, 2N458B, 2N1021A, 2N1022A
- DLA MIL-PRF-19500/384 G-2013 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON HIGH-POWER, TYPES 2N3584, 2N3585, JAN, JANTX, AND JANTXV
- DLA MIL-PRF-19500/262 G-2013 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH-POWER TYPES 2N1722 AND 2N1724, JAN AND JANTX
- DLA QML-19500-31-2007 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
- DLA QML-19500-QPD-2010 Semiconductor Devices, General Specification for
- DLA QML-19500-2012 Semiconductor Devices, General Specification for
Association Francaise de Normalisation
- NF EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: High temperature storage
- NF C96-022-6*NF EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature
- NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15: isolated semiconductor power devices
- NF EN IEC 60747-15:2024 Semiconductor devices - Part 15 : discrete devices - Isolated power semiconductor devices
- NF C96-022-23/A1*NF EN 60749-23/A1:2012 Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life.
- NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
- NF C96-022-23*NF EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life.
- NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
- NF EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: operating life at high temperatures
- NF EN 60749-23/A1:2012 Semiconductor devices - Mechanical and climatic test methods - Part 23: operating life at high temperatures
- NF C96-013-6-16*NF EN 60191-6-16:2013 Mechanical standardization of semiconductor devices - Part 6-16 : glossary of semiconductor test and burn-in sockets for BGA, LGA, FBGA and FLGA
- NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
Czech Standards Institute (UNMZ)
- CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
- CSN 35 1560-1969 Power semiconductor Rectifiers
- CSN 34 5910-1986 Gold bonding wire for semiconductor devices
- CSN 01 3368-1990 Graphical symbols for semiconductor devices
- CSN 01 3347-1989 Graphical symbols for semiconductor devices
Korean Agency for Technology and Standards (KATS)
- KS C IEC 60749-6-2020 Semiconductor devices — Mechanical and climatic test methods — Part 6: Storage at high temperature
- KS C IEC 60749-6:2020 Semiconductor devices — Mechanical and climatic test methods — Part 6: Storage at high temperature
- KS C IEC 60749-6:2004 Semiconductor devices-Mechanical and climatic test methods-Part 6:Storage at high temperature
- KS C IEC 60749-23-2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
- KS C IEC 60749-23:2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
- KS C IEC 60749-23:2006 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- KS C IEC 60749-23-2006(2016) Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- KS C IEC 60747-14-1:2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
- KS C IEC 60747-14-1-2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
- KS C IEC PAS 62240-2008(2018) Use of semiconductor devices outside manufacturers specified temperature range
- KS C IEC 60747-14-1:2003 Semiconductor devices - Part 14 - 1: Semiconductor sensors - General and classification
- KS C IEC 60747-14-1:2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
- KS C IEC 60747-14-1-2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
Danish Standards Foundation
- DS/EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
- DS/EN 60749-6/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
- DANSK DS/EN 60749-6:2002 Semiconductor devices – Mechanical and climatic test methods – Part 6: Storage at high temperature
- DANSK DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- DS/EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- DANSK DS/EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- DS/EN 60749-23/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- DANSK DS/EN 60749-23/A1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
Spanish Association for Standardization (UNE)
- UNE-EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature.
- UNE-EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
- UNE-EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (Endorsed by AENOR in June of 2012.)
- UNE-EN 60749-23:2005/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
- UNE-EN 60749-23:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
Comitato Elettrotecnico Italiano
- CEI EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods Part 6: Storage at high temperature
- CEI EN IEC 60747-15:2025 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
- CEI EN 60749-23/A1:2006 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- CEI EN 60747-15:2012 Semiconductor devices - Discrete devices Part 15: Isolated power semiconductor devices
- CEI EN 60749-23:2006 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
Swedish Institute for Standards
- SS-EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
- SS-EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
Military Standards (MIL-STD)
- MIL MIL-S-19500/340-1965 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, GERMANIUM, HIGH POWER TYPE 2N2079A
- MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
- MIL MIL-S-19500/465-1972 SEMICONDUCTOR DEVICE, DIODE, SILICON, RECTIFIER ASSEMBLY, HIGH VOLTAGE (NO S/S DOCUMENT)
- MIL MIL-S-19500/335-1965 SEMICONDUCTOR DEVICE, SILICON, VOLTAGE REFERENCE (TEMPERATURE-STABLE) TYPE 1N430A, 1N430B
- MIL MIL-PRF-19500/370H-2013 Semiconductor Device, Transistor, NPN, Silicon, High-Power, Type 2N3442, JAN, JANTX, and JANTXV
- MIL MIL-PRF-19500/370J-2018 Semiconductor Device, Transistor, NPN, Silicon, High-Power, Type 2N3442, JAN, JANTX, and JANTXV
- MIL MIL-S-19500/230C-1965 SEMICONDUCTOR DEVICE, DIODE, SILICON, HIGH-CONDUCTANCE TYPE JAN-1N3207 (SUPERSEDING MIL-S-19500/230B)
- MIL MIL-PRF-19500P-2010 Semiconductor Devices, General Specification for
- MIL MIL-PRF-19500/102C-2020 Semiconductor Device, Transistors, NPN, Silicon, High Power Types 2N1016B, 2N1016C, and 2N1016D JAN
- MIL MIL-PRF-19500/102B-2013 Semiconductor Device, Transistors, NPN, Silicon, High Power Types 2N1016B, 2N1016C, and 2N1016D JAN
- MIL MIL-PRF-19500/622E-2019 Semiconductor Device, Transistor, NPN, Silicon, High-Power Type 2N7368 JAN, JANTX, JANTXV,and JANS
- MIL MIL-PRF-19500/622D-2013 Semiconductor Device, Transistor, NPN, Silicon, High-Power Type 2N7368 JAN, JANTX, JANTXV,and JANS
- MIL MIL-PRF-19500/384F-2008 Semiconductor Device, Transistor, NPN, Silicon High-Power, Types 2N3584, 2N3585, JAN, JANTX, and JANTXV
- MIL MIL-S-19500/530-1979 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3906
- MIL MIL-S-19500/529-1978 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3904
- MIL MIL-PRF-19500/384G-2013 Semiconductor Device, Transistor, NPN, Silicon High-Power, Types 2N3584, 2N3585, JAN, JANTX, and JANTXV
- MIL MIL-S-19500/36C-1967 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, GERMANIUM, HIGH-POWER TYPE 2N297A (SUPERSEDING MIL-S-19500/36B)
- MIL MIL-S-19500/122C-1967 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, GERMANIUM, HIGH-POWER TYPE 2N1358 (SUPERSEDING MIL-S-19500/122B)
Magyar Szabványügyi Testület
- MNOSZ 700-10.lap-1955 STMicroelectronics is a very high temperature distillation
European Committee for Electrotechnical Standardization(CENELEC)
- EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
- EN IEC 60747-15:2024 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
- EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices
- EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods Part 23: High temperature operating life (Incorporates Amendment A1: 2011)
Kingdom of Bahrain Testing and Metrology Directorate
- BH GSO IEC 60747-15:2016 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- BH GSO IEC 60749-23:2016 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- BH GSO IEC 60747-5-4:2016 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- BH GSO IEC 60747-14-1:2016 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
The Directorate General of Specifications and Metrology (DGSM)
- OS GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- OS GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- OS GSO IEC 60749-23:2014 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
- OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- OS GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- OS GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
Thai Industrial Standards Institute (TISI)
- TIS 1863-2009 Semiconductor devices.discrete devices
Standard Association of Australia (SAA)
- AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
Lithuanian Standards Office
- LST EN 60747-15-2012 Semiconductor devices - Discrete devices -- Part 15: Isolated power semiconductor devices (IEC 60747-15:2010)
- LST EN 60749-6-2003 Semiconductor devices. Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2002)
- LST EN 60749-23-2004 Semiconductor devices. Mechanical and climatic test methods. Part 23: High temperature operating life (IEC 60749-23:2004)
Underwriters Laboratories (UL)
- UL 1557-1993 Electrically isolated semiconductor devices
- UL 1557-2011 Electrically isolated semiconductor devices
- UL 1557-1997 Electrically isolated semiconductor devices
- UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006
Electrostatic Discharge Association (ESDA)
- ESD EP118-2007 Physics of Semiconductor Devices
Bureau of Indian Standards
- IS 5000 OD.11-1971 Semiconductor device size device outline OD11
- IS 5000 OD.1-1969 Semiconductor device size device outline OD1
- IS 5000 OD.6-1969 Semiconductor device size device outline OD6
- IS 5000 OD.5-1969 Semiconductor device size device outline OD5
- IS 5000 OD.33-1981 Semiconductor device size device outline OD33
- IS 5000 OD.17-1974 Semiconductor device size device outline OD17
- IS 5000 OD.13-1971 Semiconductor device size device outline OD13
- IS 5000 OD.18-1974 Semiconductor device size device outline OD18
- IS 5000 OD.4-1969 Semiconductor device size device outline OD4
- IS 5000 OD.2-1969 Semiconductor device size device outline OD2
- IS 5000 OD.16-1973 Semiconductor device size device outline OD16
- IS 5000 OD.8-1969 Semiconductor device size device outline OD8
- IS 5000 OD.15-1973 Semiconductor device size device outline OD15
- IS 5000 OD.19-1974 Semiconductor device size device outline OD19
- IS 5000 OD.14-1971 Semiconductor device size device outline OD14
- IS 5001-1969 Semiconductor Device Drawing Guide
- IS 5001 Pt.1-1969 Semiconductor Device Drawing Guide
- IS 5000 OD.30-1981 Semiconductor device size device outline OD30
- IS 5000 OD.10-1971 Semiconductor device size device outline OD1O
- IS 5000 OD.9-1969 Semiconductor device size device outline OD9
- IS 5000 OD.31-1981 Semiconductor device size device outline OD31
- IS 5000 OD.35-1981 Semiconductor device size device outline OD35
- IS 5000 OD.7-1969 Semiconductor device size device outline OD7
- IS 5000 OD.12-1971 Semiconductor device size device outline OD12
- IS 4411-1967 Semiconductor device name code
- IS 5000 OD.21-1979 Semiconductor device size device outline OD 21
- IS 5000 OD.24-1979 Semiconductor device size device outline OD 24
- IS 5000 OD.36-1981 Semiconductor Device Dimensions Device Outline Figure 36
- IS 5000 OD.25-1978 Semiconductor device size device outline OD 25
Society of Automotive Engineers (SAE)
- SAE EIA4900-2016 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges
- SAE EIA4900 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges
Gosstandart of Russia
- GOST R 57439-2017 Semiconductor devices. Basic dimensions
- GOST 18472-1988 Semiconductor devices. Basic dimensions
- GOST R 71055-2023 Semiconductor devices. System of designations
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