Semiconductor Device Usage Rules

Semiconductor Device Usage Rules, Total:401 items.

The international standard classification for "Semiconductor Device Usage Rules" includes: Aerospace electric equipment and systems , Semiconductor devices in general , Plug-and-socket devices. Connectors , Other electromechanical components , Electromechanical components in general , Rectifiers. Convertors. Stabilized power supply , Components for aerospace construction , Integrated circuits. Microelectronics , Other semiconductor devices , Semiconductor devices , Optoelectronics. Laser equipment , Electronic components in general , Other products of non-ferrous metals , Mechanical structures for electronic equipment , Aluminium products , Glass products .

The Chinese standard classification for "Semiconductor Device Usage Rules" includes: Electronic components , Power semiconductor device and parts , Semiconductor discrete devices in general , Microcircuit in general , Laser device , Optoelectronic device assembly , Precious metals and their alloys , Dedicated processing equipment , Technical management , Technical management , Technical Management , Light metals and their alloys , Quartz glass .

Professional Standard - Aerospace

QJ 2225-1992 Semiconductor Device Usage Rules
QJ 1511A-1998 Semiconductor Discrete Devices - Specifications for Acceptance
QJ 10007-2008 General Specification for Semiconductor Discrete Devices for Aerospace

Professional Standard - Machinery

JB/T 7064-1993 General Specifications for Semiconductor Inverters
JB/T 5835-2005 Components of gate terminal for power semiconductor devices
JB/T 9687.2-1999 Tungsten disk for power semiconductor devices
JB/T 5843-2005 Connectors for power semiconductor devices
JB 5835-1991 Gate assembly for power semiconductor devices
JB/T 7061-1993 Silicon Wafers Intended to Be Used in Power Semiconductor Devices
JB/T 5843-1991 Connectors for Power Semiconductor Devices
JB/T 8757-1998 Hot Pipe Radiators Intended to be Used in Power Semiconductor Devices
JB/T 10097-2000 Case for power semiconductor device
JB/T 9684-2000 Selecting guide of heat sink for power semiconductor device
JB/T 10096-2000 Selection guidance of case for power semiconductor device
JB/T 5835-1991 Gate assemblies for power semiconductor devices
JB/T 9687.1-1999 Molybdenum Disk for Power Semiconductor Devices
JB/T 10096-1999 Selection Guidance of Case for Power Semiconductor Device
JB/T 10097-1999 Cases for Power Semiconductor Devices
JB/T 10501-2005 Ceramic parts of case for power semiconductor devices
JB 5843-1991 Connectors for power semiconductor devices

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
GB/T 32817-2016 Semiconductor devices - Micro-electromechanical devices - Generic specification for MEMS
GB/T 8446.1-1987 Heat sink for power semiconductor device
GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers
GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1：General
GB 12565-1990 Sectional Specification for Semiconductor Devices and Optoelectronic Devices
GB/T 15873-1995 Directives for drafting semiconductor facilities interface specification
GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
GB/T 16464-1996 Semiconductor devices Integrated circuits Part 1: General
GB/T 3859.2-1993 Semiconductor convertors Application guide
GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1:General
GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
GB/T 12565-1990 Semiconductor devices Sectional specification for optoelectronic devices
GB/T 17950-2000 Semiconductor converter - Part 6: Application guide for the protection of semiconductor converters against overcurrent by fuses
GB/T 7423.1-1987 Heat sink of semiconductor devices--Generic specification
GB 7423.1-1987 sink of semiconductor devices - Generic specification
GB/T 12560-1999 Semiconductor devices --Sectional specification for discrete devices
GB/T 8750-2007 Gold bonding wire for semiconductor devices
GB/T 43366-2023 General specification for discrete semiconductor devices of space application

Military Standard of the People's Republic of China-General Armament Department

GJB 33A-1997 General Specification for Semiconductor Discrete Devices
GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
GJB 8119-2013 General specification for semiconductor optoelectronic device
GJB 2146A-2011 General specification for semiconductor light-emitting diode devices
GJB 923-1990 General Specification for Semiconductor Discrete Device Cases
GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
GJB 33-1985 General Specification for Semiconductor Discrete Devices
GJB 3164-1998 Semiconductor discrete device packaging specifications
GJB 923A-2004 General specification for packages of semiconductor discrete devices
GJB 33B-2021 General Specification for Semiconductor Discrete Devices
GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
GJB 923B-2021 General Specification for Semiconductor Discrete Device Enclosures

Professional Standard - Electron

SJ/T 10414-2015 Solder for semiconductor device
SJ/Z 9021.1-1987 Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices
SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices
SJ/Z 9168-1995 Generic specifications for determination of discrete semiconductor devices used for VCR
SJ/T 10414-1993 Solder for semicoductor device
SJ 2355.1-1983 General procedures of measurement for light-emitting deivces
SJ/T 10535-1994 Tungsten boat for semiconductor devices
SJ 20072-1992 Semiconductor discrete device-Detail specification for semiconductor opto-couplers for Type GH24,GH25 and GH26

Group Standards of the People's Republic of China

T/CASME 1438-2024 Semiconductor device processing specification

未注明发布机构

JIS C 5944:1996 General Rule of Laser Diode Modules for Fiber Optic Transmission

Professional Standard - Non-ferrous Metal

YS/T 641-2007 Aluminium wire for semiconductor lead bonding
YS/T 678-2008 Copper wire for semiconductor lead bonding

Professional Standard - Building Materials

JC/T 181-2011 Transparent quartz glass devices for semiconductor

Bureau of Indian Standards

IS 5469-1-1969 Code of Practice for the Use of Semiconductor Junction Devices
IS 5469-3-1973 Code of practice for the use of semiconductor junction devices: Part 3 Thyristors
IS 5469-2-1973 Code of practice for the use of semiconductor junction devices: Part 2 Diodes
IS 14901-1-2010 Semiconductor Devices - Discrete Devices and Integrated Circuits - Part 1 : General
IS 12970-1-1990 Semiconductor Devices - Integrated Circuits-1 General

IN-BIS

IS 5469-1969 Operating instructions for the use of semiconductor junction devices
IS 5469 Pt.3-1973 Code of practice for use of semiconductor junction devices Part III Thyristors
IS 4400 Pt.1-1967 Semiconductor device measurement methods Part Ⅰ General principles
IS 1885 Pt.7/Sec.1-1970 Electrical Vocabulary Part Ⅶ Semiconductor Devices Section 1: General Principles
IS 5000 OD.4-1969 Semiconductor device size device outline OD4
IS 5000 OD.2-1969 Semiconductor device size device outline OD2
IS 5000 OD.16-1973 Semiconductor device size device outline OD16
IS 5000 OD.13-1971 Semiconductor device size device outline OD13
IS 5000 OD.18-1974 Semiconductor device size device outline OD18
IS 5000 OD.5-1969 Semiconductor device size device outline OD5
IS 5000 OD.33-1981 Semiconductor device size device outline OD33
IS 5000 OD.17-1974 Semiconductor device size device outline OD17
IS 5000 OD.11-1971 Semiconductor device size device outline OD11

British Standards Institution (BSI)

BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
BS CP 1016-1:1968 Code of practice on the use of semiconductor devices.-General considerations
BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
BS IEC 60748-1:2002 Semiconductor devices - Integrated circuits - General
BS 6493-2.1:1985 Semiconductor devices - Integrated circuits - General
BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
BS CP 1016-2:1973 Code of practice for the use of semiconductor devices-Particular considerations
BS EN 60191-6:2009 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2005 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2004 Mechanical standardization of semiconductor devices-Part 6:General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS IEC 60747-1:2006 Semiconductor devices. General
BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS EN IEC 60747-15:2024 Semiconductor devices - Discrete devices. Isolated power semiconductor devices
BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
PD IEC/PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges
BS PD IEC/PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges
BS EN 60747-5-1:2001 Discrete semiconductor devices and integrated circuits - Optoelectronic devices - General
BS EN 60747-5-1:1998 Discrete semiconductor devices and integrated circuits. Optoelectronic devices. General
BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
BS EN IEC 63244-1:2021 Semiconductor devices. Semiconductor devices for wireless power transfer and charging. General requirements and specifications
08/30181401 DC BS IEC 60747-14-1. Semiconductor devices. Part 14-1. Semiconductor sensors. Generic specification for sensors
BS 9351:1980 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: microwave semiconductor switches (without integrated driver circuits)
BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
BS EN 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10:General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
BS EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices
BS IEC 60191-1:2007 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of discrete devices
BS 9364:1973 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: switching transistors
BS 9301:1969 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: general purpose signal diodes
BS EN IEC 62969-2:2018 Semiconductor devices. Semiconductor interface for automotive vehicles - Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
BS EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - General
BS 9352:1980 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: field effect transistors for microwave applications
BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
BS 9329:1977 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: varactor diodes for frequency multiplication
BS EN 60191-3:2000 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of integrated circuits
BS 9362:1972 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: high power transistors for linear applications
07/30167960 DC BS EN 60191-6. Mechanical standardization of semiconductor devices. Part 6. General rules for the preparation of outline drawings of surface mounted semicondutor device packages
BS 9302:1969 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: switching diodes
BS 3934-6:1992 Mechanical standardization of semiconductor devices-Specification for the preparation of outline drawings of surface mounted semiconductor device packages
BS 9363:1972 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: high power transistors for switching applications
BS EN IEC 63364-1:2022 Semiconductor devices. Semiconductor devices for IoT system - Test method of sound variation detection
BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
BS 3839:1978 Specification for oxygen-free high-conductivity copper for electronic tubes and semiconductor devices
07/30162213 DC BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
BS EN IEC 62969-1:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
BS EN 60191-6-1:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
PAS 60191-6-18-2008 Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA) (Edition 1.0)
BS 9305:1969 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: voltage regulator diodes
BS EN 60749-23:2004+A1:2011 Semiconductor devices. Mechanical and climatic test methods. High temperature operating life
BS 6493-1.1:1984 Semiconductor devices - Part 1: Discrete devices - Section 1.1 General
BS 9361:1971 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: high frequency, low power transistors
BS IEC 60747-7:2011 Semiconductor devices. Discrete devices. Bipolar transistors
BS IEC 60747-7:2010 Semiconductor devices. Discrete devices. Bipolar transistors
BS EN IEC 63287-1:2021 Semiconductor devices. Generic semiconductor qualification guidelines - Guidelines for IC reliability qualification
BS EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
23/30451654 DC BS EN IEC 60747-15. Semiconductor devices. Part 15. Isolated power semiconductor devices. Discrete devices
BS 9360:1971 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: low frequency, low power transistors
BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
19/30404095 DC BS EN IEC 60747-5-4. Semiconductor devices. Part 5-4. Optoelectronic devices. Semiconductor lasers
BS IEC 60747-7:2010+A1:2019 Semiconductor devices. Discrete devices - Bipolar transistors
BS 9970-0:1985 Harmonized system of quality assessment for electronic components. Semiconductor devices-Generic specification
11/30248240 DC BS EN 60191-6-22. Mechanical standardization of semiconductor devices. Part 6-22. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages. Silicon Fine-pitch Ball G...
BS 3839:1965 Oxygen free high conductivity copper for electronic tubes and semiconductor devices

German Institute for Standardization

DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
DIN IEC 747-11:1992 Semiconductor devices; Sectional specification for semiconductor devices
DIN EN IEC 62969-2:2018-09*VDE 0884-69-2:2018-09 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN IEC 62969-4:2019-03*VDE 0884-69-4:2019-03 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN IEC 62969-3:2018-12*VDE 0884-69-3:2018-12 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN IEC 62969-1:2018-08*VDE 0884-69-1:2018-08 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN VDE V 0884-11:2017-01*VDE V 0884-11:2017-01 Semiconductor devices
DIN IEC 60747-10:1987 Semiconductor devices; generic specification for semiconductor devices and integrated circuits; identical with IEC 60747-10, edition 1984
DIN EN IEC 63244-1:2023-11*VDE 0884-244-1:2023-11 Semiconductor devices – Semiconductor devices for wireless power transfer and charging
DIN EN IEC 60747-17:2021-10*VDE 0884-17:2021-10 Semiconductor devices
DIN EN IEC 60747-5-5:2021-10*VDE 0884-5:2021-10 Semiconductor devices
DIN EN 60191-6:2010-06 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 / Note: DIN EN 60191-6 (2005-04) rem...
DIN EN 62779-1:2017-01*VDE 0884-79-1:2017-01 Semiconductor devices – Semiconductor interface for human body communication
DIN EN 62779-2:2017-01*VDE 0884-79-2:2017-01 Semiconductor devices – Semiconductor interface for human body communication
DIN EN 62779-3:2017-03*VDE 0884-79-3:2017-03 Semiconductor devices – Semiconductor interface for human body communication
DIN EN 60191-6-6:2002-02 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German vers...
DIN IEC 60747-10:1987-10 Semiconductor devices; generic specification for semiconductor devices and integrated circuits; identical with IEC 60747-10, edition 1984
DIN EN 60191-6-5:2002-05 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German vers...
DIN EN 60191-6-1:2002-08 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60...
DIN EN 60191-6-3:2001-06 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:200...
DIN EN 60747-15:2012-08 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010); German version EN 60747-15:2012 / Note: DIN EN 60747-15 (2004-08) remains valid alongside this standard until 2014-01-20.
DIN EN 60191-6-8:2002-05 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); Ge...
DIN EN 60191-6-2:2002-09 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal package...
DIN EN IEC 60191-1:2018-10 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018 / Note: DIN EN 60191-1 (2007-11) remains valid alongside this...
DIN EN 60191-6-22 E:2011 Draft Document - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball G...
DIN EN 60191-6:2005 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004); German version EN 60191-6:2004
DIN EN 62047-4:2011-03 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
DIN IEC 60191-6 E:2007 Draft Document - Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)
DIN EN 60191-6-10:2004-05 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
DIN EN 60191-6-22 E:2011-08 Draft Document - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball G...
DIN EN 60747-15:2004 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2003); German version EN 60747-15:2004
DIN IEC 60191-6 E:2007-11 Draft Document - Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)
DIN IEC 60747-14-5 E:2008-03 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
DIN EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018
DIN EN IEC 63244-1:2023 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications (IEC 63244-1:2021); German version EN IEC 63244-1:2021
DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
DIN EN IEC 60747-15 E:2024-06 Draft Document - Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 47E/812/CDV:2023); German and English version prEN IEC 60747-15:2023

International Electrotechnical Commission (IEC)

IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
IEC 60747-1:2006/AMD1:2010 Semiconductor devices - Part 1: General
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60747-1:2006 Semiconductor devices - Part 1: General
IEC 60747-1:1983 Semiconductor devices. Discrete devices. Part 1 : General
IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
IEC PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges
IEC 60191-6:1990 Mechanical standardization of semiconductor devices; part 6: general rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60747-15:2024 RLV Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
IEC 60747-5-4:2024 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
IEC 60748-1:1984 Semiconductor devices. Integrated circuits.. Part 1 : General
IEC 60747-5-4:2022+AMD1:2024 CSV Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
IEC 60747-15:2024 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
IEC 60191-6:1990/AMD1:1999 Amendment 1 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
IEC 60191-6/AMD1:1999 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Amendment 1
IEC 60747-5-4:2022/AMD1:2024 Amendment 1 - Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
IEC 60748-1/AMD3:1995 Semiconductor devices - Integrated circuits - Part 1: General; Amendment 3
IEC 60748-1/AMD1:1991 Semiconductor devices; integrated circuits; part 1: general; amendment 1
IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices (Edition 1.0)
IEC 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Dimensions of P-VSON
IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
IEC 60747-1/AMD3:1996 Semiconductor devices - Discrete devices and integrated circuits - Part 1: General; Amendment 3
IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices

Defense Logistics Agency

DLA QML-19500-2011 Semiconductor Devices, General Specification for
DLA QML-19500-QPD-2012 Semiconductor Devices, General Specification for
DLA QML-19500-QPD-2011 Semiconductor Devices, General Specification for
DLA QML-19500-2013 Semiconductor Devices, General Specification for
DLA QML-19500-QPD-2010 Semiconductor Devices, General Specification for
DLA QML-19500-2012 Semiconductor Devices, General Specification for
DLA QML-19500-31-2007 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
DLA DESC-DWG-84002-1984 HEAT SINKS FOR SEMICONDUCTOR DEVICES

Military Standards (MIL-STD)

MIL MIL-PRF-19500P-2010 Semiconductor Devices, General Specification for
MIL MIL-PRF-19500N-2005 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR(SUPERSEDING MIL-PRF-19500M)
MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
MIL MIL-S-19500/388B-1992 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-S-19500/388A)
MIL MIL-PRF-19500/547B-1999 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-S-19500/547A)

Comitato Elettrotecnico Italiano

CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
CEI EN 60191-6:2011 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
CEI EN IEC 60747-15:2025 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
CEI EN 60747-15:2012 Semiconductor devices - Discrete devices Part 15: Isolated power semiconductor devices
CEI EN 60191-1:2008 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
CEI EN IEC 63244-1:2022 Semiconductor devices - Semiconductor devices for wireless power transfer and charging Part 1: General requirements and specifications
CEI EN 60191-6-10:2005 Mechanical standardization of semiconductor devices Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
CEI EN 62047-4:2011 Semiconductor devices - Micro-electromechanical devices Part 4: Generic specification for MEMS
CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
CEI EN 60191-6-22:2014 Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic...
CEI EN IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors

Korean Agency for Technology and Standards (KATS)

KS C IEC 60747-14-1:2003 Semiconductor devices－Part 14－1：Semiconductor sensors－General and classification
KS C IEC 60747-1-2020 Semiconductor devices — Part 1: General
KS C IEC 60747-1:2020 Semiconductor devices — Part 1: General
KS C IEC 60747-1:2004 Semiconductor devices－Discrete devices and integrated circuits－Part 1：General
KS C IEC 60747-14-1:2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
KS C IEC 60747-14-1-2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
KS C IEC PAS 62240-2008(2018) Use of semiconductor devices outside manufacturers specified temperature range
KS C IEC 60747-14-1:2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
KS C IEC PAS 62240-2023 Use of semiconductor devices outside manufacturers specified temperature range
KS C IEC 60747-14-1-2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
KS C IEC PAS 62240-2008(2023) Use of semiconductor devices outside manufacturers specified temperature range
KS C IEC 60748-1-2019 Semiconductor devices — Integrated circuits — Part 1: General
KS C IEC 60748-1:2019 Semiconductor devices — Integrated circuits — Part 1: General
KS C IEC 60748-1:2002 Semiconductor devices－Integrated circuits－Part 1：General
KS C IEC 60748-1-2021 Semiconductor devices — Integrated circuits — Part 1: General
KS C IEC 60748-1:2021 Semiconductor devices — Integrated circuits — Part 1: General

CZ-CSN

CSN 35 8801-1979 Semiconductor devices for widely u?ed equipments. General specifications.
CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
CSN 35 8804-1985 Semiconductor optoelectronic devices for widely u?ed equipments. General specifications
CSN 35 4714-1983 Low-voltage fusos for tho protection of semiconductor devices
CSN 35 8797 Cast.1 IEC 747-1:1990 Discrete semiconductor devices and integrated circuits. Part 1: General

CENELEC - European Committee for Electrotechnical Standardization

EN 60191-6:2004 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices

Association Francaise de Normalisation

NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6: general rules for the preparation of outline drawings of packages for surface mount semiconductor devices
NF C96-013-6*NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages
NF EN 60191-6-6:2002 Mechanical Standardization of Semiconductor Devices - Part 6-6: General Rules for Preparing Dimension Drawings of Surface Mount Semiconductor Devices - FLGA Device Design Guide
NF C96-013-6:2005 Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages.
NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15: isolated semiconductor power devices
NF EN IEC 60747-15:2024 Semiconductor devices - Part 15 : discrete devices - Isolated power semiconductor devices
NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
NF C96-041/A1:1991 Semiconductor Devices Integrated circuits Part 1:General
NF EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: general rules for the preparation of outline drawings of discrete devices
NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
NF C96-013-6-10*NF EN 60191-6-10:2004 Mechanical standardization of semiconductor devices - Part 6-10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
NF EN 60191-6-12:2012 Mechanical standardization of semiconductor devices - Part 6-12: general rules for the preparation of outline drawings of surface-mount semiconductor device packages - Design guidelines for...
NF EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: general rules for the preparation of outline drawings of surface-mount semiconductor devices - Design guide for matrix packages...
NF EN 60191-6-10:2004 Mechanical standardization of semiconductor devices - Part 6-10: general rules for the preparation of outline drawings of surface-mount semiconductor devices - Dimensions of P-VSON packages
NF EN 62047-4:2011 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 4 : spécification générique pour les MEMS
NF EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for power transfer and wireless charging - Part 1: general requirements and specifications
NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
NF EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: general rules for the preparation of outline drawings of surface-mount semiconductor devices - Design guide for matrix packages...
NF EN 60191-6-20:2011 Mechanical standardization of semiconductor devices - Part 6-20: general rules for the preparation of outline drawings of packages for surface-mount semiconductor devices - Measurement methods for dimensions...
NF EN IEC 63364-1:2023 Semiconductor devices - Semiconductor devices for IDO system - Part 1: Acoustic variation detection test method
NF EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - Part 6-1: general rules for the preparation of outline drawings of surface-mount semiconductor devices - Design guide for pin-out packages...
NF EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: general rules for the preparation of outline drawings of surface-mount semiconductor devices - Design guide for pin-out packages...
NF EN 60191-6-17:2012 Mechanical standardization of semiconductor devices - Part 6-17: general rules for the preparation of outline drawings of surface-mount semiconductor devices - Design guide for stacked packages ...
NF EN 60191-6-21:2011 Mechanical standardization of semiconductor devices - Part 6-21: general rules for the preparation of outline drawings of packages for surface-mount semiconductor devices - Measuring methods for dimensions...
NF C96-069-2*NF EN IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2 : efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
NF C96-005-1*NF EN 60747-5-1:2001 Discrete semiconductor devices and integrated circuits - Part 5-1 : optoelectronic devices - General

British Standard / International Electrotechnical Commission

BS IEC 60747-5-4:2022+A1:2024 Semiconductor devices - Optoelectronic devices. Semiconductor lasers

The Directorate General of Specifications and Metrology (DGSM)

OS GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
OS GSO IEC 60191-6:2015 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
OS GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
OS GSO IEC 60191-1:2014 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
OS GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
OS GSO IEC 60191-6-10:2015 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
OS GSO IEC 62047-4:2013 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
OS GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
OS GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico

GCC Standardization Organization

GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
GSO IEC 60191-6:2015 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
GSO IEC 60191-1:2014 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
GSO IEC 60191-6-5:2015 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
GSO IEC 63244-1:2024 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
GSO IEC 60191-6-6:2015 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
GSO IEC 62779-1:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements

Kingdom of Bahrain Testing and Metrology Directorate

BH GSO IEC 60747-14-1:2016 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
BH GSO IEC 60191-6:2016 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BH GSO IEC 60747-15:2016 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
BH GSO IEC 60191-1:2016 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
BH GSO IEC 60747-5-4:2016 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
BH GSO IEC 62047-4:2016 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS

SE-SIS

SIS SS CECC 50000-1987 Generic specification: Discrete semiconductor devices
SIS SS CECC 20000-1983 Generic specification: Semiconductor optoelectronic and liquid crystal devices

Lithuanian Standards Office

LST EN 60191-6-2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009)
LST EN 60747-15-2012 Semiconductor devices - Discrete devices -- Part 15: Isolated power semiconductor devices (IEC 60747-15:2010)

Government Electronic & Information Technology Association

GEIA SP4900-2002 Use of Semiconductor Devices Outside Manufacturers?Specified Temperature Ranges Comment Period Expires: May 27, 2002; ANSI/EIA-4900
GEIA-4900-2001 Use of Semiconductor Devices Outside Manufacturers?Specified Temperature Ranges

Danish Standards Foundation

DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
DANSK DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
DANSK DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
DANSK DS/EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
DANSK DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
DANSK DS/EN 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
DANSK DS/EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
DS/EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
DS/EN 60191-6-10:2004 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
DS/EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
DANSK DS/EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
DS/EN 60747-5-1/A2:2002 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General
DS/EN 60747-5-1/A1:2002 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General

Spanish Association for Standardization (UNE)

UNE-EN 60191-6:2009 Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in April of 2010.)
UNE-EN 60191-6-10:2004 Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
UNE-EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (Endorsed by AENOR in June of 2012.)
UNE-EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (Endorsed by AENOR in February of 2011.)
UNE-EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications (Endorsed by Asociación Española de Normalización in December of 2021.)
UNE-EN 150012:1991 Detailed framework specification: Single gate field-effect transistor (FET)
UNE-EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
UNE-EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
UNE-EN IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors (Endorsed by Asociación Española de Normalización in June ...

Swedish Institute for Standards

SS-EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
SS-EN IEC 63244-1:2022 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
SS-EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
SS-EN 60191-6-10:2004 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
SS-EN 62047-4:2011 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specifications for MEMS
SS-EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
SS-EN 60747-5-1:2001 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General

European Committee for Electrotechnical Standardization（CENELEC）

EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN IEC 60747-15:2024 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
EN IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors

CH-SNV

VSM 10336.10-1939 Polycrystalline semiconductor. Rules for Rectifier Columns and Equipment

Association for Electrical, Electronic & Information Technologies (VDE)

VDE 0884-101 E*DIN IEC 62258-1:2007-10 Semiconductor die products – Part 1: Requirements for procurement and use (IEC 47/1913/CD:2007)
VDE 0884-244-1 E*DIN EN IEC 63244-1:2020-07 Semiconductor devices — Semiconductor devices for wireless power transfer and charging — Part 1: General requirements and specifications (IEC 47/2592/CD:2019);

TH-TISI

TIS 1863-2009 Semiconductor devices.discrete devices

Standard Association of Australia （SAA）

AS C379.3:1978 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of integrated circuits
AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices

PL-PKN

PN T01204-1990 Semiconductor devices Sectional specification for discrete devices
PN T01103-1992 Semiconductor devices. Generic specification for discrete devices and integrated circuits
PN T01204-A1-1990 Semiconductor devices Sectional specification for discrete devices Amendment 1

Japanese Industrial Standards Committee (JISC)

JIS C 7210:1977 General rules for reliability assured discrete semiconductor devices

Society of Automotive Engineers (SAE)

SAE EIA4900 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges
SAE EIA4900-2016 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges

Underwriters Laboratories (UL)

UL 1557-1993 Electrically isolated semiconductor devices
UL 1557-2011 Electrically isolated semiconductor devices
UL 1557-1997 Electrically isolated semiconductor devices
UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006

ESD - ESD ASSOCIATION

EP118-2007 Physics of Semiconductor Devices

PH-BPS

PNS IEC 62830-2:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting

American Society for Testing and Materials (ASTM)

ASTM F1211-89(2001) Specification for layout of passivation openings in semiconductor devices

Gosstandart of Russia

GOST R 57439-2017 Semiconductor devices. Basic dimensions

Others: Semiconductor Device Usage Rules