YS/T 678-2008 in English

SUPERSEDED

Copper wire for semiconductor lead bonding

Issued on:2008-03-12
Implemented on:2008-09-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $210.00
$204.00

Standard No:	YS/T 678-2008
Document status:	SUPERSEDED
Superseded by:	YS/T 678-2024 Copper bonding wire for semiconductor package
Title in English:	Copper wire for semiconductor lead bonding
Title in Chinese:	半导体器件键合用铜丝
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2008-03-12
Implemented on:	2008-09-01
ICS Classification:	77.150.10-Aluminium products
Chinese Classification:	H61-Light metals and their alloys
Professional Classification:	YS-Non-ferrous Metal
Related Keywords:	copper wire semiconductor lead semiconductor devices wire copper
Related Topics:	key ys/t 581.16-2008 Semiconducting sulfur ys/t 244.1-2008 copper wire ys/t 678-2008 ys/t 682-2008 Semiconductor Device Usage Rules ys/t678 ys/t 244.2-2008 bonder Bonded phase Semiconductor copper target Semiconductor paint Semiconductor bonder semiconductor effect ys/t 119.5-2008 Triple Bond C18 Alkyl Bonding Semiconductor device bonding strength Semiconductor bonder Key copper wire triple bond Zirconium compound semiconductor semiconductor Semiconductor device Bonding Copper Wire International Bonding force bonding void test Bonding wire diameter Bonding wire diameter related Bonding wire industry Manufacturing of special equipment for semiconductor devices Semiconductor bonding strength detection Gold wire bonding related standards Copper wire quality bonding wire gold wire gbt678-2008 Semiconductor device material references ys/t269-2008 Bonding wire related standards Semiconductor Bonding and Technology

本标准规定了半导体器件键合用铜丝的要求、试验方法、检验规范和标志、包装、运输、贮存及订货单（或合同）内容。
本标准适用于半导体器件键合用铜丝。

Scope

This standard specifies the requirements, test methods, inspection specifications and marking, packaging, transportation, storage and order form (or contract) content for copper wire used for bonding semiconductor devices. This standard applies to copper wire for bonding semiconductor devices (hereinafter referred to as copper wire).

More samples: GB 18306-2015 YD/T 3934-2021 DL/T 5154-2012

Sample only — not a preview of YS/T 678-2008

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