Semiconductor device material references

Semiconductor device material references, Total:432 items.

The international standard classification for "Semiconductor device material references" includes: Semiconductor devices in general , Plug-and-socket devices. Connectors , Other electromechanical components , Electromechanical components in general , Mechanical structures for electronic equipment , Semiconducting materials , Semiconductor devices , Other products of non-ferrous metals , Integrated circuits. Microelectronics , Electrical equipment of ships and of marine structures , Components for aerospace construction , Other semiconductor devices , Optoelectronics. Laser equipment , Aluminium products , Glass products , Other electrical accessories .

The Chinese standard classification for "Semiconductor device material references" includes: Technical management , Technical Management , Technical management , Technical management , Power semiconductor device and parts , Semimetal and semiconductor material in general , Special electronic technology material , Precious metals and their alloys , Semiconductor discrete devices in general , Semiconductor integrated circuit , Power generation, transformation and distribution equipment for vessel , Electronic components , Microcircuit in general , Optoelectronic device assembly , Light metals and their alloys , Laser device , Quartz glass .

Professional Standard - Electron

SJ/Z 9021.1-1987 Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices
SJ 1794-1981 General specification for diffusion furnace for semiconductor device manufacturing
SJ/T 10414-2015 Solder for semiconductor device
SJ 2854-1988 Discrete semiconductor devices--Detail specification for lead frame of plastic package
SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
SJ/T 10424-1993 Glass powder for passivation packaging for use in semiconductor devices
SJ/T 10414-1993 Solder for semicoductor device
SJ 2850-1988 General specification for base, cap and lead frame of discrete semiconductor devices
SJ/T 10535-1994 Tungsten boat for semiconductor devices
SJ/T 10585-1994 Semiconductor discrete device Dimensions of outline and lead-frame for the surface mounting device
SJ 20072-1992 Semiconductor discrete device-Detail specification for semiconductor opto-couplers for Type GH24,GH25 and GH26

Shaanxi Provincial Standard of the People's Republic of China

DB61/T 1250-2019 General Specification for Sic (Silicon Carbide) Material Semiconductor Discrete Devices

Professional Standard - Machinery

JB/T 10501-2005 Ceramic parts of case for power semiconductor devices
JB/T 5835-1991 Gate assemblies for power semiconductor devices
JB/T 5842-1991 Die alignment rings for power semiconductor devices
JB/T 7061-1993 Silicon Wafers Intended to Be Used in Power Semiconductor Devices
JB/T 9687.1-1999 Molybdenum Disk for Power Semiconductor Devices
JB/T 10097-1999 Cases for Power Semiconductor Devices
JB/T 10097-2000 Case for power semiconductor device
JB/T 5781-1991 Sectioned Radiator for Power Semiconductor Devices. Technical Specification
JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices
JB/T 10096-2000 Selection guidance of case for power semiconductor device
JB/T 5843-2005 Connectors for power semiconductor devices
JB/T 10096-1999 Selection Guidance of Case for Power Semiconductor Device
JB/T 8757-1998 Hot Pipe Radiators Intended to be Used in Power Semiconductor Devices
JB/T 7064-1993 General Specifications for Semiconductor Inverters
JB/T 5842-2005 Rings for dies of semiconductor devices
JB/T 4277-1996 Packing of Power Semiconductor Parts
JB/T 9684-2000 Selecting guide of heat sink for power semiconductor device
JB/T 5835-2005 Components of gate terminal for power semiconductor devices
JB/T 9687.2-1999 Tungsten disk for power semiconductor devices
JB/T 5843-1991 Connectors for Power Semiconductor Devices

机械电子工业部

JB 5781-1991 Technical conditions of profile radiators for power semiconductor devices
JB 5842-1991 Die positioning rings for power semiconductor devices
JB 5835-1991 Gate assembly for power semiconductor devices
JB 5843-1991 Connectors for power semiconductor devices

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 43366-2023 General specification for discrete semiconductor devices of space application
GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
GB/T 32817-2016 Semiconductor devices - Micro-electromechanical devices - Generic specification for MEMS
GB/T 8446.3-1988 Insulators and fasteners for heat sink for power semiconductor device
GB/T 14264-2009 Semiconductor materials - Terms and definitions
GB/T 16525-2015 Semiconductor integrated circuits―Specification of leadframes for plastic leaded chip carrier package
GB/T 12565-1990 Semiconductor devices Sectional specification for optoelectronic devices
GB/T 15876-2015 Semiconductor integrated circuits―Specification of leadframes for plastic quad flat package
GB/T 8446.1-1987 Heat sink for power semiconductor device
GB/T 14264-1993 Semiconductor materials－Terms and definitions
GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
GB/T 31469-2015 Semiconductor materials cutting fluid
GB/T 7423.1-1987 Heat sink of semiconductor devices--Generic specification
GB 7423.1-1987 sink of semiconductor devices - Generic specification
GB/T 12560-1999 Semiconductor devices --Sectional specification for discrete devices
GB/T 14264-2024 Terminology of semiconductor materials
GB 7423.2-1987 sink of semiconductor devices - Heat sink, Extruded shapes
GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
GB/T 14548-1993 specification for marine semiconductor conver - Tors
GB/T 3859.2-1993 Semiconductor convertors Application guide
GB/T 14844-1993 of semiconductor materials
GB/T 8750-2007 Gold bonding wire for semiconductor devices
GB 12565-1990 Sectional Specification for Semiconductor Devices and Optoelectronic Devices
GB/T 7423.2-1987 Heat sink of semiconductor devices--Heat sink, Extruded shapes

Military Standard of the People's Republic of China-General Armament Department

GJB 923B-2021 General Specification for Semiconductor Discrete Device Enclosures
GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
GJB 33B-2021 General Specification for Semiconductor Discrete Devices
GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
GJB 33-1985 General Specification for Semiconductor Discrete Devices
GJB/Z 55-1994 Selection Guide for Aerospace Electronic Components Semiconductor Discrete Devices
GJB 8119-2013 General specification for semiconductor optoelectronic device
GJB 923A-2004 General specification for packages of semiconductor discrete devices

Professional Standard - Aerospace

QJ 2225-1992 Semiconductor Device Usage Rules
QJ 10007-2008 General Specification for Semiconductor Discrete Devices for Aerospace

Group Standards of the People's Republic of China

T/ICMTIA CM0035-2023 Sealing gasket for semiconductor silicon material process device
T/CASME 798-2023 Specialized processing tools for semiconductor materials
T/CASME 1438-2024 Semiconductor device processing specification
T/CNIA 0143-2022 Ultrapure Resin Vessels for Trace Impurity Analysis of Semiconductor Materials
T/SHDSGY 135-2023 New Energy Semiconductor Silicon Wafer Material Technology

Professional Standard - Non-ferrous Metal

YS/T 678-2008 Copper wire for semiconductor lead bonding
YS/T 641-2007 Aluminium wire for semiconductor lead bonding

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers

Professional Standard - Building Materials

JC/T 181-2011 Transparent quartz glass devices for semiconductor

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 14844-2018 Designations of semiconductor materials
GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity）

未注明发布机构

GJB 33A-1997 General Specification for Semiconductor Discrete Devices
DIN EN 62047-21 E:2012-11 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

British Standards Institution (BSI)

BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
BS EN IEC 60749-39:2022 Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
BS EN IEC 63364-1:2022 Semiconductor devices. Semiconductor devices for IoT system - Test method of sound variation detection
BS 6493-1.1:1984 Semiconductor devices - Part 1: Discrete devices - Section 1.1 General
BS EN IEC 62969-1:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
BS EN IEC 63287-1:2021 Semiconductor devices. Generic semiconductor qualification guidelines - Guidelines for IC reliability qualification
23/30451654 DC BS EN IEC 60747-15. Semiconductor devices. Part 15. Isolated power semiconductor devices. Discrete devices
BS IEC 60747-7:2011 Semiconductor devices. Discrete devices. Bipolar transistors
BS IEC 60747-7:2010 Semiconductor devices. Discrete devices. Bipolar transistors
BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
BS IEC 60747-7:2010+A1:2019 Semiconductor devices. Discrete devices - Bipolar transistors
19/30404095 DC BS EN IEC 60747-5-4. Semiconductor devices. Part 5-4. Optoelectronic devices. Semiconductor lasers
BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
BS EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BS EN IEC 63244-1:2021 Semiconductor devices. Semiconductor devices for wireless power transfer and charging. General requirements and specifications
BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
BS IEC 60747-8:2010+A1:2021 Semiconductor devices. Discrete devices - Field-effect transistors
BS EN 60191-6-1:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
BS EN IEC 62969-4:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. Evaluation method of data interface for automotive vehicle sensors
23/30473272 DC BS IEC 60747-5-4 AMD 1. Semiconductor devices - Part 5-4. Optoelectronic devices. Semiconductor lasers
BS IEC 62830-1:2017 Semiconductor devices. Semiconductor devices for energy harvesting and generation - Vibration based piezoelectric energy harvesting
BS EN 62830-3:2017 Semiconductor devices. Semiconductor devices for energy harvesting and generation - Vibration based electromagnetic energy harvesting
BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
BS IEC 62830-7:2021 Semiconductor devices. Semiconductor devices for energy harvesting and generation. Linear sliding mode triboelectric energy harvesting
BS EN 62779-3:2016 Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
BS EN IEC 60747-5-5:2020 Semiconductor devices. Optoelectronic devices. Photocouplers
BS 3934-1:1992 Mechanical standardization of semiconductor devices - Recommendations for the preparation of drawings of semiconductor devices
BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
BS IEC 62047-31:2019 Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films

SCC

BS IEC 60747-1:2006 Semiconductor devices. General
BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
MIL MIL-PRF-19500P-2010 Semiconductor Devices, General Specification for
DANSK DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
CEI EN 60747-15:2012 Semiconductor devices - Discrete devices Part 15: Isolated power semiconductor devices
BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
DANSK DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
DANSK DS/EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
CEI EN 62047-10:2012 Semiconductor devices - Microelectromechanical devices Part 10: Micro-pillar compression test for MEMS materials
CEI EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
CEI EN 62047-18:2014 Semiconductor devices - Micro-electromechanical devices Part 18: Bend testing methods of thin film materials
CEI EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
DANSK DS/EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
DANSK DS/EN IEC 60749-39:2022 Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
07/30162213 DC BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
DIN IEC 60747-10:1987 Semiconductor devices; generic specification for semiconductor devices and integrated circuits; identical with IEC 60747-10, edition 1984
DANSK DS/EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
CEI EN 62047-21:2016 Semiconductor devices - Micro-electromechanical devices Part 21: Test method for Poisson's ratio of thin film MEMS materials
CEI EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solublity in organic materials used for semiconductor components
CEI EN 62047-6:2011 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
BS 3839:1965 Oxygen free high conductivity copper for electronic tubes and semiconductor devices
DANSK DS/EN 60749-39:2006 Semiconductor devices – Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
08/30181401 DC BS IEC 60747-14-1. Semiconductor devices. Part 14-1. Semiconductor sensors. Generic specification for sensors
DANSK DS/EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
DIN IEC 60747-15 E:2007 Draft Document - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007)
DIN EN IEC 60747-15 E:2024 Draft Document - Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 47E/812/CDV:2023); German and English version prEN IEC 60747-15:2023
MIL MIL-S-19500/530-1979 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3906
MIL MIL-S-19500/529-1978 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3904
CEI EN IEC 63364-1:2023 Semiconductor devices - Semiconductor devices for IoT system Part 1: Test method of sound variation detection
DANSK DS/EN IEC 63364-1:2023 Semiconductor devices – Semiconductor devices for IoT system – Part 1: Test method of sound variation detection
CEI EN 62779-3:2017 Semiconductor devices - Semiconductor interface for human body communication Part 3: Functional type and its operational conditions
DANSK DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
CEI EN IEC 63244-1:2022 Semiconductor devices - Semiconductor devices for wireless power transfer and charging Part 1: General requirements and specifications
CEI EN 62047-14:2013 Semiconductor devices - Micro-electromechanical devices Part 14: Forming limit measuring method of metallic film materials
DIN EN IEC 60749-39:2023 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022
BS CP 1016-1:1968 Code of practice on the use of semiconductor devices.-General considerations
AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
CEI EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for automotive vehicles Part 1: General requirements of power interface for automotive vehicle sensors
MIL MIL-STD-750D-1995 SEMICONDUCTOR DEVICES (SUPERSEDING MIL-STD-750C)
BS 3363:1968 Schedule of letter symbols for semiconductor devices
IEC 60146:1973/AMD1:1975 Amendment 1 - Semiconductor convertors
MIL MIL-S-19500/288-1964 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON TYPE 2N2377
MIL MIL-S-19500/289-1964 Semiconductor Device, Transistor, PNP, Silicon Type 2N2378
CEI EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication Part 2: Characterization of interfacing performances
IEC 60148:1963 Letter symbols for semiconductor devices
DANSK DS/EN 62779-3:2016 Semiconductor devices – Semiconductor interface for human body communication – Part 3: Functional type and its operational conditions

International Electrotechnical Commission (IEC)

IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC TR2 60146-6:1992 Semiconductor convertors; part 6: application guide for the protection of semiconductor convertors against overcurrent by fuses
IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
IEC 60749-32:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
IEC 60749-31:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 63364-1:2022 Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
IEC 60191-1C:1974 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.
IEC 60191-1A:1969 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.

CZ-CSN

CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
CSN 35 4714-1983 Low-voltage fusos for tho protection of semiconductor devices
CSN 35 1560-1969 Power semiconductor Rectifiers
CSN 34 5910-1986 Gold bonding wire for semiconductor devices
CSN 01 3347-1989 Graphical symbols for semiconductor devices
CSN 01 3368-1990 Graphical symbols for semiconductor devices
CSN 34 5175-1979 Terminology of power semiconductor convenors

Association Francaise de Normalisation

NF EN 62418:2011 Semiconductor Devices - Testing Cavities Due to Metallization Stresses
NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15: isolated semiconductor power devices
NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
NF EN 62047-18:2014 Semiconductor devices - Microelectromechanical devices - Part 18: bending test methods for thin film materials
NF EN 62047-2:2006 Semiconductor devices - Microelectromechanical devices - Part 2: tensile testing methods for thin film materials
NF C96-050-10*NF EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
NF EN IEC 63364-1:2023 Semiconductor devices - Semiconductor devices for IDO system - Part 1: Acoustic variation detection test method
NF EN 62047-6:2010 Semiconductor devices - Microelectromechanical devices - Part 6: axial fatigue testing methods for thin film materials
NF C96-022-32*NF EN 60749-32:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced).
NF EN 62047-10:2012 Semiconductor devices - Microelectromechanical devices - Part 10: Compression testing using the micro-pillar technique for MEMS materials
NF C96-022-39*NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
NF EN 62047-21:2014 Semiconductor devices - Microelectromechanical devices - Part 21: test method for Poisson's ratio of thin film MEMS materials
NF C96-779-3*NF EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3 : functional type and its operational conditions
NF EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: general rules for the preparation of outline drawings of surface-mount semiconductor devices - Design guide for pin-out packages...
NF EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - Part 6-1: general rules for the preparation of outline drawings of surface-mount semiconductor devices - Design guide for pin-out packages...
NF EN 62047-14:2012 Semiconductor devices - Microelectromechanical devices - Part 14: method of measuring forming limits of metal layer materials
NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: measurement of moisture diffusivity and water solubility in organic materials used in semiconductor components
NF C96-013-6-1*NF EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - Part 6-1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - Design guide for gull-wing lead terminals.

German Institute for Standardization

DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
DIN EN 60747-15:2012-08 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010); German version EN 60747-15:2012 / Note: DIN EN 60747-15 (2004-08) remains valid alongside this standard until 2014-01-20.
DIN EN 62047-10:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
DIN EN 62047-2:2007-02 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
DIN EN 62047-18:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
DIN EN 62047-6:2010-07 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
DIN EN 60749-39:2007-01 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006 / Note: To be r...
DIN EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
DIN EN 60749-31:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31:2002 + Corr. 1:2003); German version EN 60749-31:2003
DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
DIN EN 62047-14:2012-10 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012

GSO

GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
BH GSO IEC 60747-15:2016 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
OS GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
OS GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
OS GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
BH GSO IEC 60747-5-4:2016 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
BH GSO IEC 60747-14-1:2016 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
BH GSO IEC 62047-10:2016 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
OS GSO IEC 62047-2:2014 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
GSO IEC 62047-2:2014 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
OS GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
BH GSO IEC 62047-2:2016 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
GSO IEC 62047-18:2021 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
OS GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
GSO IEC 62047-6:2013 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BH GSO IEC 62047-6:2016 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
OS GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
GSO IEC 62779-1:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
GSO IEC 62047-21:2021 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
BH GSO IEC 62047-21:2022 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
BH GSO IEC 62779-1:2022 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
GSO IEC 62779-3:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
GSO IEC 62779-2:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
BH GSO IEC 62047-14:2022 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

Defense Logistics Agency

DLA QML-19500-QPD-2012 Semiconductor Devices, General Specification for
DLA QML-19500-QPD-2011 Semiconductor Devices, General Specification for
DLA QML-19500-2011 Semiconductor Devices, General Specification for
DLA QML-19500-2012 Semiconductor Devices, General Specification for
DLA QML-19500-QPD-2010 Semiconductor Devices, General Specification for
DLA QML-19500-2013 Semiconductor Devices, General Specification for
DLA DESC-DWG-84002-1984 HEAT SINKS FOR SEMICONDUCTOR DEVICES
DLA MIL-S-19500/529 VALID NOTICE 4-2011 Semiconductor Device, Transistor, Silicon Type 2N3904
DLA QML-19500-31-2007 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
DLA DSCC-DWG-91011 REV B-2003 SEMICONDUCTOR DEVICE, DIODE, ULTRA FAST
DLA MIL-S-19500/303 VALID NOTICE 3-2011 Semiconductor Device, Transistor, Types 2N2631 and 2N2876
DLA MIL-PRF-19500/672-2001 SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, NPN, SILICON, SWITCHING, TYPE 2N2222AUE1 JAN, JANTX, JANJ
DLA MIL-STD-750 F CHANGE 1-2013 TEST METHODS FOR SEMICONDUCTOR DEVICES
DLA MIL-S-19500/273 A VALID NOTICE 3-2011 Semiconductor Device, Transistor Type Type 2N744

Danish Standards Foundation

DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
DS/EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
DS/EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
DS/EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
DS/EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
DS/EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
DS/EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications

ES-UNE

UNE-EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (Endorsed by AENOR in June of 2012.)
UNE-EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Endorsed by AENOR in December of 2011.)
UNE-EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)
UNE-EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (Endorsed by Asociación Española de Normalización in March of 2022.)
UNE-EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
UNE-EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (Endorsed by AENOR in November of 2014.)
UNE-EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials (Endorsed by AENOR in June of 2010.)
UNE-EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (Endorsed by AENOR in July of 2016.)
UNE-EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006). (Endorsed by AENOR in November of 2006.)
UNE-EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
UNE-EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (Endorsed by AENOR in June of 2012.)

Korean Agency for Technology and Standards (KATS)

KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60747-14-1:2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
KS C IEC 60749-39:2006 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 62047-22-2021 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-22:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18-2021 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-22-2016(2021) Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18-2016(2021) Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 60749-39-2021 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60747-14-1:2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
KS C 6520-2021 Components and materials of semiconductor process —Measurement of wear characteristics by plasma
KS C IEC 60747-14-1:2003 Semiconductor devices－Part 14－1：Semiconductor sensors－General and classification
KS C IEC 60050-521-2002(2022) Semiconductor devices and integrated circuits
KS C IEC 60050-521-2002(2017) Semiconductor devices and integrated circuits
KS C IEC 60050-521-2022 Semiconductor devices and integrated circuits

TH-TISI

TIS 1863-2009 Semiconductor devices.discrete devices

European Committee for Electrotechnical Standardization（CENELEC）

EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

CENELEC - European Committee for Electrotechnical Standardization

EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices

KR-KS

KS C IEC 60747-14-1-2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
KS C IEC 60747-14-1-2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
KS C IEC 62047-22-2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials

SE-SIS

SIS SS CECC 50000-1987 Generic specification: Discrete semiconductor devices
SIS SS CECC 20000-1983 Generic specification: Semiconductor optoelectronic and liquid crystal devices

Lithuanian Standards Office

LST EN 60747-15-2012 Semiconductor devices - Discrete devices -- Part 15: Isolated power semiconductor devices (IEC 60747-15:2010)
LST EN 62047-10-2011 Semiconductor devices - Micro-electromechanical devices -- Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011)
LST 1412-1995 Semiconductor devices. Terms and definitions
LST EN 60749-39-2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006)
LST EN 62047-2-2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006)

RO-ASRO

STAS 6360-1974 SEMICONDUCTOR MATERIALS AND DEVICES Terminology

IEC - International Electrotechnical Commission

IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices (Edition 1.0)
IEC 62047-10:2011 Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials (Edition 1.0)
IEC 62779-1:2016 Dispositifs à semiconducteurs – Interface à semiconducteurs pour les communications via le corps humain – Partie 1: Exigences générales (Edition 1.0)

ESD - ESD ASSOCIATION

EP118-2007 Physics of Semiconductor Devices

Underwriters Laboratories (UL)

UL 1557-2011 Electrically isolated semiconductor devices
UL 1557-1993 Electrically isolated semiconductor devices
UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006
UL 1557-1997 Electrically isolated semiconductor devices

HU-MSZT

MSZ 771/5-1979 Mechanical properties of semiconductor materials

Indonesia Standards

SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials

PH-BPS

PNS IEC 62830-2:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting

Japanese Industrial Standards Committee (JISC)

JIS C 5630-2:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 2: Tensile testing method of thin film materials

DIN

DIN EN 60747-15:2004 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2003); German version EN 60747-15:2004

IN-BIS

IS 5000 OD.11-1971 Semiconductor device size device outline OD11
IS 5000 OD.1-1969 Semiconductor device size device outline OD1
IS 5000 OD.6-1969 Semiconductor device size device outline OD6
IS 5000 OD.19-1974 Semiconductor device size device outline OD19
IS 5000 OD.14-1971 Semiconductor device size device outline OD14
IS 5000 OD.15-1973 Semiconductor device size device outline OD15
IS 5000 OD.8-1969 Semiconductor device size device outline OD8
IS 5000 OD.5-1969 Semiconductor device size device outline OD5
IS 5000 OD.33-1981 Semiconductor device size device outline OD33
IS 5000 OD.17-1974 Semiconductor device size device outline OD17
IS 5000 OD.13-1971 Semiconductor device size device outline OD13
IS 5000 OD.18-1974 Semiconductor device size device outline OD18
IS 5000 OD.2-1969 Semiconductor device size device outline OD2
IS 5000 OD.16-1973 Semiconductor device size device outline OD16
IS 5000 OD.4-1969 Semiconductor device size device outline OD4
IS 5469-1969 Operating instructions for the use of semiconductor junction devices
IS 5000 OD.35-1981 Semiconductor device size device outline OD35
IS 5000 OD.31-1981 Semiconductor device size device outline OD31
IS 5000 OD.10-1971 Semiconductor device size device outline OD1O
IS 5000 OD.9-1969 Semiconductor device size device outline OD9
IS 5000 OD.30-1981 Semiconductor device size device outline OD30
IS 5001-1969 Semiconductor Device Drawing Guide
IS 5001 Pt.1-1969 Semiconductor Device Drawing Guide
IS 5000 OD.7-1969 Semiconductor device size device outline OD7
IS 5000 OD.12-1971 Semiconductor device size device outline OD12
IS 4411-1967 Semiconductor device name code
IS 5000 OD.21-1979 Semiconductor device size device outline OD 21
IS 5000 OD.36-1981 Semiconductor Device Dimensions Device Outline Figure 36
IS 5000 OD.24-1979 Semiconductor device size device outline OD 24
IS 5000 OD.28-1978 Semiconductor device size device outline OD 28
IS 5000 OD.26-1978 Semiconductor device size device outline OD 26
IS 5000 OD.22-1978 Semiconductor device size device outline OD 22
IS 5000 OD.25-1978 Semiconductor device size device outline OD 25
IS 5000 OD.20-1978 Semiconductor device size device outline OD 20
IS 5000 OD.29-1979 Semiconductor Device Dimensions Device Outline OD 29
IS 5000 OD.27-1978 Semiconductor Device Dimensions Device Outline OD 27
IS 5000 OD.23-1978 Semiconductor device size device outline OD 23
IS 5000 OC.4-1969 Semiconductor device size CASE OUTLINE OC4
IS 7412-1974 Life test of semiconductor devices
IS 5000 OD.34-1981 Semiconductor device size DEVICE OUTLINE 34

RU-GOST R

GOST 18472-1988 Semiconductor devices. Basic dimensions
GOST R 57439-2017 Semiconductor devices. Basic dimensions
GOST 15133-1977 Semiconductor devices. Terms and definitions

American Society for Testing and Materials (ASTM)

ASTM F72-24 Standard Specification for Gold Wire for Semiconductor Lead Bonding
ASTM F487-88(2001) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
ASTM F487-88(2006) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
ASTM F72-06 Standard Specification for Gold Wire for Semiconductor Lead Bonding

GOST

GOST R 71055-2023 Semiconductor devices. System of designations

PL-PKN

PN T01503 ArkusZ06-1973 Semiconductor devices Dimensions Device A 24
PN T01503 ArkusZ16-1973 Semiconductor devices Dimensions Device A 51
PN T01503 ArkusZ15-1973 Semiconductor devices Oimensions Device A 33

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD370B-1982 Designation System for Semiconductor Devices
JEDEC JESD31C-2003 General Requirements for Distributors of Commercial and Military Semiconductor Devices

GOSTR

GOST R 57436-2017 Semiconductor devices. Terms and definitions

American National Standards Institute （ANSI)

ANSI/EIA 370-B:1992 Semiconductor Devices, Designation System for

Others: Semiconductor devices. Microelectromechanical devices. Bending test methods for thin film materials,New semiconductor materials and devices,Semiconductor material device,Semiconductor material device,Materials for Semiconductor Discrete Devices