YS/T 641-2007 in English

SUPERSEDED

Aluminium wire for semiconductor lead bonding

Issued on:2007-04-13
Implemented on:2007-10-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $150.00
$146.00

Standard No:	YS/T 641-2007
Document status:	SUPERSEDED
Superseded by:	YS/T 641-2024 Aluminum bonding wire for semiconductor package
Title in English:	Aluminium wire for semiconductor lead bonding
Title in Chinese:	半导体器件键合用铝丝
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2007-04-13
Implemented on:	2007-10-01
ICS Classification:	77.150.10-Aluminium products
Chinese Classification:	H61-Light metals and their alloys
Professional Classification:	YS-Non-ferrous Metal
Related Keywords:	aluminum wire aluminium wire semiconductor lead semiconductor devices wire
Related Topics:	ys/t622-2007 Aluminum key wire Semiconducting sulfur ys/t647-2007 ys/t+641 Semiconductor Device Usage Rules bonder Bonded phase Semiconductor paint Semiconductor bonder semiconductor effect ys t 628 2007 Triple Bond C18 Alkyl Bonding Semiconductor device bonding strength triple bond c18 Semiconductor bonder triple bond Zirconium compound semiconductor Aluminum wire EFA and PFA Semiconductors Bonding force bonding void test Bonding wire diameter Bonding wire diameter related Aluminum strip bonding tension Bonding wire industry Aluminum wire bonding wire fuse current test standard Manufacturing of special equipment for semiconductor devices bonded aluminum wire Semiconductor bonding strength detection Gold wire bonding related standards bonding wire gold wire Aluminum alloy for semiconductor equipment ys/t308-2007 ys/t534-2007 Aluminum silicon wire bonding standards Nanjing Aluminum Conductor Semiconductor device material references Bonding wire related standards Semiconductor Bonding and Technology

本标准规定了半导体器件键合用铝丝的要求、试验方法、检验规则及标志、包装、运输、贮存。
本标准适用于半导体器件键合用铝丝。

Scope

This standard specifies the requirements, test methods, inspection rules and marking, packaging, transportation and storage of aluminum wire for bonding semiconductor devices. This standard applies to aluminum wire for bonding semiconductor devices (hereinafter referred to as aluminum wire).

More samples: NB/T 47013.2-2015 DL/T 5154-2012 JGJ 94-2008

Sample only — not a preview of YS/T 641-2007

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