EFA and PFA Semiconductors
EFA and PFA Semiconductors, Total:426 items.
The international standard classification for "EFA and PFA Semiconductors" includes: Semiconductor devices in general , Nuclear energy in general , Semiconducting materials , Plug-and-socket devices. Connectors , Rectifiers. Convertors. Stabilized power supply , Electronic components in general , Optoelectronics. Laser equipment , Electrical engineering (Vocabularies) , Semiconductor devices , Chemical analysis , Therapy equipment , Aluminium products .
The Chinese standard classification for "EFA and PFA Semiconductors" includes: Semiconductor discrete devices in general , Semimetal and semiconductor material in general , Nuclear instrument and detector in general , Special electronic technology material , Connector , Precious metals and their alloys , Power semiconductor device and parts , Basic standards and general methods , Laser device , Basic standards and general methods , Others , Technical management , Optoelectronic device assembly , Technical management , Technical management , Technical Management , Technical management , Microcircuit in general , Temperature and pressure instrument , Industrial gas and chemical gas , Light metals and their alloys .
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 31469-2015 Semiconductor materials cutting fluid
- GB/T 5839-1986 Rating systems for electronic tubes and semiconductor devise
- GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
- GB/T 3859.4-2004 Semiconductor converter - Self-commutated semiconductor converters including direct d.c.converters
- GB/T 31359-2015 Test methods of semiconductor lasers
- GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
- GB/T 14264-2009 Semiconductor materials - Terms and definitions
- GB/T 15167-1994 General specification for light source of semiconductor lasers
- GB/T 3859.2-1993 Semiconductor convertors Application guide
- GB/T 7677-1987 Semiconductor direct d. c. convertors
- GB/T 11685-2003 Measurement procedures for semiconductor X-ray detector system and semiconductor X-ray energy spectrometers
- GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
- GB/T 31358-2015 General specification for semiconductor lasers
- GB/T 3859.3-1993 Semiconductor convertors—Transformers and reactors
- GB/T 2900.66-2004 Electrotechnical terminology - Semiconductor devices and integrated circuits
- GB/T 15872-1995 Power supply interface for semiconductor equipment
- GB/T 15872-2013 Power supply interface for semiconductor equipment
- GB/T 8750-2014 Gold bonding wire for semiconductor package
- GB 5839-1986 Rating systems for electronic tubes and semiconductor devise
- GB/T 14264-1993 Semiconductor materials-Terms and definitions
- GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
- GB/T 14264-2024 Terminology of semiconductor materials
- GB/T 7678-1987 Semiconductor self-commutated convertors
Professional Standard - Electron
- SJ 50033/5-1994 Semiconductor discrete device-Detail specification for semiconductor yellow light emitting diodes for type GF311 of GP and GT classes
- SJ/Z 9021.1-1987 Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices
- SJ 20642-1997 Semiconductor opto-electronic module-General specification for
- SJ 2433-1984 Bonding sheet for semiconductor tubes
- SJ 50033/4-1994 Semiconductor discrete device-Detail specification for semiconductor red light emitting diodes for type GF111 of GP and GT classes
- SJ/T 10535-1994 Tungsten boat for semiconductor devices
- SJ 20072-1992 Semiconductor discrete device-Detail specification for semiconductor opto-couplers for Type GH24,GH25 and GH26
- SJ/T 10229-1991 Graphic instrument for characteristics of semiconductor tubes for Type XJ4810
- SJ 50033/109-1996 Semiconductor optoelectronic devices - Detail specification for Types GJ903T and GJ9032T and GJ9034T semiconductor laser diodes
- SJ/T 10414-2015 Solder for semiconductor device
- SJ 50033/6-1994 Semiconductor discrete device-Detail specification for semiconductor green light emitting diodes for type GF411 of GP and GT classes
- SJ 50033/3-1994 Semiconductor discrete device - Detail specification for semiconductor opto-couplers for type GH21, GH22 and GH23 of GP, GT and GCT classes
- SJ/T 10414-1993 Solder for semicoductor device
- SJ/T 11395-2009 Semiconductor lighting terminology
Military Standard of the People's Republic of China-General Armament Department
- GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
- GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
- GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
- GJB 33/18-2011 Semiconductor optoelectronic device.Detail specification for type GO417 bidirectional analog switch semiconductor photocoupler
- GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
Guangdong Provincial Standard of the People's Republic of China
- DB44/T 1873-2016 semiconductor refrigeration wine cabinet
Group Standards of the People's Republic of China
- T/CASAS 002-2021 Terminology for wide bandgap semiconductors
- T/CASME 698-2023 Semiconductor laser therapy apparatus
- T/ZSA 224-2024 Equipment front end module
- T/QGCML 4122-2024 Semiconductor chip sorting machine
- T/CEMIA 030-2022 Positive photoresist developer for semiconductor manufacture
- T/IAWBS 019-2023 Equipment front end module
- T/QGCML 4030-2024 Semiconductor car heating and cooling box
- T/QGCML 4031-2024 Semiconductor optical wafer
- T/JSXH 0002-2020 Regeneration solution for semiconductor
- T/JGXH 008-2020 Diode pump solid state laser
- T/CASME 1438-2024 Semiconductor device processing specification
- T/ZZB 1718-2020 Gold bonding wire for semiconductor package
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 37031-2018 Semiconductor lighting terminology
- GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4:Coding system and classification into forms of package outlines for semiconductor device packages
工业和信息化部
- QB/T 5369-2019 Semiconductor refrigeration appliance
- YS/T 1105-2016 Silver bonding wire for semiconductor package
Guizhou Provincial Standard of the People's Republic of China
- DB52/T 844-2013 Semiconductor Current Regulator
- DB52/T 796-2013 Industrial semiconductor electric detonator
Professional Standard - Machinery
- JB/T 10097-2000 Case for power semiconductor device
- JB/T 10096-2000 Selection guidance of case for power semiconductor device
- JB/T 8661-1997 Construction Parts of Electric Semiconductor Modules
- JB/T 4277-1996 Packing of Power Semiconductor Parts
- JB/T 7059-1993 Guide for Preparation of Standard for Power Semiconductor Modules
- JB/T 5537-2006 Semiconductor pressure sensors
- JB/T 7063-1993 Rated Voltage and Current of Power Semiconductor Devices
Professional Standard - Aerospace
- QJ 2225-1992 Semiconductor Device Usage Rules
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会
- GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers
- GB/T 34971-2017 Guide for gaseous effluent handling in semiconductor industry
Taiwan Provincial Standard of the People's Republic of China
- CNS 7011-1981 Numbering of Electrodes in Multiple Electrode Semiconductor Devices and Designation of Units in Multiple Unit Semiconductor Devices
- CNS 6137-1988 Color Coding of Discrete Semiconductor Devices
Professional Standard - Post and Telecommunication
- YD 576-1992 Semiconductor rectifier equipments For telecommunications
Fujian Provincial Standard of the People's Republic of China
- DB35/T 1193-2011 Semiconductor LED chip
未注明发布机构
- GJB 33A-1997 General Specification for Semiconductor Discrete Devices
Professional Standard - Medicine
- YY/T 0998-2015 Semiconductor heating and/or cooling therapy equipment
Professional Standard - Non-ferrous Metal
- YS/T 641-2007 Aluminium wire for semiconductor lead bonding
CZ-CSN
- CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
- CSN 35 8701 Z1-1997 Semiconductor naming
- CSN 35 1531-1973 Silicon semiconductor rectifiers
- CSN 35 8720 Cast.1-1987 Semiconductor devices. Dimensions
- CSN 35 8740-1973 Semiconduotor deviees. Transistore. Measurement of saturation voltage
- CSN 35 8773-1977 Meaaurement of semiconductor devices. Thyristors. Meaaurement of blocking current and reverse blocking current.
- CSN 35 1530-1979 Power semiconductor converters
- CSN 35 8754-1973 Semiconductor devices. Transistors. Measurement of short-circuit output admittance
- CSN 34 5910-1986 Gold bonding wire for semiconductor devices
- CSN 01 3368-1990 Graphical symbols for semiconductor devices
- CSN 01 3347-1989 Graphical symbols for semiconductor devices
British Standards Institution (BSI)
- BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
- BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
- BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
- BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
- BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
- BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
- BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
- BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
- BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
- BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
- BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
- BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
- PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
- BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
- 18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
- BS EN IEC 63244-1:2021 Semiconductor devices. Semiconductor devices for wireless power transfer and charging. General requirements and specifications
- BS IEC 62951-1:2017 Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates
- BS EN 62779-3:2016 Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
- BS EN IEC 63287-1:2021 Semiconductor devices. Generic semiconductor qualification guidelines - Guidelines for IC reliability qualification
- BS EN 62258-1:2010 Semiconductor die products. Procurement and use
- BS EN 62258-1:2006 Semiconductor die products - Requirements for procurement and use
- 23/30478757 DC BS EN IEC 63287-3. Semiconductor devices. Generic semiconductor qualification guidelines - Part 3. Guidelines for reliability qualification plans for power semiconductor module
- 13/30264596 DC BS EN 60747-14-7. Semiconductor devices. Part 14-7. Semiconductor sensor. Flow meter
- BS IEC 62830-1:2017 Semiconductor devices. Semiconductor devices for energy harvesting and generation - Vibration based piezoelectric energy harvesting
- BS EN 62830-3:2017 Semiconductor devices. Semiconductor devices for energy harvesting and generation - Vibration based electromagnetic energy harvesting
- BS EN IEC 62969-1:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
- BS EN 60191-4:2014+A1:2018 Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages
- BS IEC 60747-8-4:2004 Discrete semiconductor devices - Metal-oxide semiconductor field-effect transistors (MOSFETs) for power switching applications
- BS IEC 62830-7:2021 Semiconductor devices. Semiconductor devices for energy harvesting and generation. Linear sliding mode triboelectric energy harvesting
- BS EN 60191-4:2014 Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
- BS EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
- 19/30404095 DC BS EN IEC 60747-5-4. Semiconductor devices. Part 5-4. Optoelectronic devices. Semiconductor lasers
- BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS IEC 60747-7:2001 Discrete semiconductor devices and integrated circuits - Bipolar transistors
- BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
- 13/30264591 DC BS EN 60747-14-6. Semiconductor devices. Part 14-6. Semiconductor sensor. Humidity sensor
- BS 3934-1:1992 Mechanical standardization of semiconductor devices - Recommendations for the preparation of drawings of semiconductor devices
SCC
- BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
- BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
- AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
- CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
- IEC 60146:1973 Semiconductor convertors
- DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
- 12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
- MIL MIL-S-19500/303-1964 Semiconductor Device, Transistor, Types 2N2631 and 2N2876
- CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
- BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- 07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
- 12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
- BS IEC 60747-1:2006 Semiconductor devices. General
- CEI 3-17:2005 Segni grafici per schemi - Semiconduttori e tubi elettronici
- AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
- DIN IEC 60747-10:1987 Semiconductor devices; generic specification for semiconductor devices and integrated circuits; identical with IEC 60747-10, edition 1984
- DANSK DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- CEI EN 60747-15:2012 Semiconductor devices - Discrete devices Part 15: Isolated power semiconductor devices
- DANSK DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
- 05/30137514 DC IEC 60747-14-4. Discrete semiconductor devices. Part 14-4. Semiconductor accelerometers
- BS 3934-4:1992 Mechanical standardization of semiconductor devices-Recommendations for a coding system and classification into forms of package outlines for semiconductor devices
- CEI EN IEC 63244-1:2022 Semiconductor devices - Semiconductor devices for wireless power transfer and charging Part 1: General requirements and specifications
- MIL MIL-S-19500/215-1961 SEMICONDUCTOR DEVICE, TRANSISTOR, TYPES 2N1173 AND 2N1174 (NAVY)
- MIL MIL-S-19500/425-1969 SEMICONDUCTOR DEVICE, TRANSISTOR, PN, SILICON, UNIJUNCTION JAN2N5431, AND JANTX2N5431
- MIL MIL-S-19500/530-1979 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3906
- MIL MIL-S-19500/529-1978 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3904
- CEI EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication Part 2: Characterization of interfacing performances
- CEI EN 62417:2011 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- DANSK DS/EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- BS PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- MIL MIL-PRF-19500P-2010 Semiconductor Devices, General Specification for
- BS 4417:1969 Specification for semiconductor rectifier equipments
- MIL MIL-S-19500/288-1964 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON TYPE 2N2377
- MIL MIL-S-19500/289-1964 Semiconductor Device, Transistor, PNP, Silicon Type 2N2378
- DIN IEC 60747-14-4 E:2002 Draft Document - Discrete semiconductor devices - Part 14-4: Semiconductor accelerometers (IEC 47E/220/CD:2002)
- BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
- 08/30181404 DC BS IEC 60747-14-3. Semiconductor devices. Part 14-3. Semiconductor sensors. Pressure sensors
- DANSK DS/EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
- CEI EN 62779-3:2017 Semiconductor devices - Semiconductor interface for human body communication Part 3: Functional type and its operational conditions
- 07/30162213 DC BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
- IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
- IEC PAS 62202:2000 Failure mechanisms and models for silicon semiconductor devices
- CEI EN 60191-6-16:2008 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
- AS 1955.3:1983 Semiconductor Convertors, Part 3: Semiconductor Direct D.C. Convertors (D.C. Chopper Convertors)
- BS 3363:1968 Schedule of letter symbols for semiconductor devices
- IEC 60146A:1974 first supplement - Semiconductor convertors
- UNE 20846-3:1994 SEMICONDUCTOR CONVERTORS. PART 3: SEMICONDUCTOR DIRECT D.C. CONVERTORS (D.C. CHOPPER-CONVERTORS).
GSO
- GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- OS GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- BH GSO IEC 60747-15:2016 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- OS GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- GSO IEC 62779-1:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
- OS GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- BH GSO IEC 62779-1:2022 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
- GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- BH GSO IEC 60747-14-1:2016 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- OS GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- GSO IEC 62779-2:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
- BH GSO IEC 60747-5-4:2016 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- GSO IEC 63244-1:2024 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
- GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- BH GSO IEC 60191-6-16:2022 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
- GSO IEC 60191-6-16:2021 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
- GSO IEC 63287-1:2024 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
- GSO IEC 62779-3:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
- GSO IEC 60191-4:2015 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
International Electrotechnical Commission (IEC)
- IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
- IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
- IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
- IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
- IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
- IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- IEC TR 63378-1:2021 Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
- IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
- IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
- IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
- IEC 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
- IEC 60191-4:2013+AMD1:2018 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
- IEC 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
- IEC 60191-1C:1974 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.
- IEC 60749:1996 Semiconductor devices - Mechanical and climatic test methods
- IEC 60749:2002 Semiconductor devices - Mechanical and climatic test methods
Korean Agency for Technology and Standards (KATS)
- KS C IEC 60747-14-1:2003 Semiconductor devices-Part 14-1:Semiconductor sensors-General and classification
- KS C IEC 60050-521-2002(2022) Semiconductor devices and integrated circuits
- KS C IEC 60050-521-2002(2017) Semiconductor devices and integrated circuits
- KS C IEC 60050-521-2022 Semiconductor devices and integrated circuits
- KS C 2607-2002 TESTING METHODS OF SEMICONDUCTOR
- KS C IEC 60747-14-1:2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
- KS C IEC 60119-2014(2019) Recommendations for polycrystalline semiconductor rectifier stacks and equipments
- KS C IEC 60747-14-1:2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
- KS C 7013-1985 TYPE DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
- KS C 7013-1971(2000) TYPE DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
- KS C IEC 62951-1:2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
- KS C IEC 60749-2020 Semiconductor devices-Mechanical and climate test methods
- KS C IEC 60146-2:2002 Semiconductor converters-Part 2:Self-commutated converters including direct d.c. converters
- KS C IEC 60749-2004(2020) Semiconductor devices-Mechanical and climate test methods
- KS C IEC 60119-2019 Recommendations for polycrystalline semiconductor rectifier stacks and equipments
- KS C IEC 60749:2004 Semiconductor devices-Mechanical and climate test methods
- KS C IEC 60146-6-2013 Semiconductor convertors-Part 6:Application guide for the protection of semiconductor convertors against overcurrent by fuses
NEMA - National Electrical Manufacturers Association
- NEMA CB-4:1989 Semiconductor Graphite
JP-JEITA
- JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)
German Institute for Standardization
- DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
- DIN EN 60747-15:2012-08 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010); German version EN 60747-15:2012 / Note: DIN EN 60747-15 (2004-08) remains valid alongside this standard until 2014-01-20.
- DIN EN 62417:2010-12 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010); German version EN 62417:2010
- DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
- DIN EN IEC 63287-1:2020-06 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for LSI reliability qualification (IEC 47/2614/CDV:2020); German and English version prEN IEC 63287-1:2020 / Note: Date of issue 2020-05-08*Intended as replacem...
- DIN EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
- DIN 50441-5:2001 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 5: Terms of shape and flatness deviation
- DIN EN 60146-2:2001 Semiconductor convertors - Part 2: Self-commutated semiconductor convertors including direct d.c. convertors (IEC 60146-2:1999); German version EN 60146-2:2000
- DIN EN 60191-4:2003 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
National Fire Protection Association (NFPA)
- NFPA FPH SECTION 6-30-2003 Semiconductor Manufacturing
YU-JUS
- JUS N.R1.322-1979 Terms and definitions for semiconductor ?evices. Thyristors
- JUS N.R1.520-1988 Seml?ouductor devices. Preparat ion of draurings
- JUS N.A3.500-1980 Semiconductor devices. Graphical symbols
- JUS A.A4.302-1990 Tabular layouts ofarticle characteristics for semiconductor diodes
- JUS N.R1.352-1979 Letter symbohfor semkonductor devices. Thyristors.
European Committee for Electrotechnical Standardization(CENELEC)
- EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
- EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
- EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
- EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
- EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
Defense Logistics Agency
- DLA MIL-S-19500/303 VALID NOTICE 3-2011 Semiconductor Device, Transistor, Types 2N2631 and 2N2876
- DLA MIL-DTL-19491 H-2002 SEMICONDUCTOR DEVICES, PACKAGING OF
- DLA MIL-S-19500/215 VALID NOTICE 3-2011 Semiconductor Device, Transistor, Types 2N1173 and 2N1174 (Navy)
- DLA MIL-S-19500/173 A VALID NOTICE 3-2011 Semiconductor Device, Transistor, Types 2N389 and 2N424 (Navy)
- DLA MIL-S-19500/72 C VALID NOTICE 4-2011 Semiconductor Device, Transistor, PNP, Germanium Types 2N499 and 2N499A
- DLA MIL-PRF-19500 N-2005 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
- DLA MIL-S-19500/425 VALID NOTICE 3-2011 Semiconductor Device, Transistor, PN, Silicon, Unijunction JAN2N5431, and JANTX2N5431
- DLA DESC-DWG-84002-1984 HEAT SINKS FOR SEMICONDUCTOR DEVICES
- DLA MIL-S-19500/529 VALID NOTICE 4-2011 Semiconductor Device, Transistor, Silicon Type 2N3904
- DLA QML-19500-QPD-2012 Semiconductor Devices, General Specification for
- DLA QML-19500-QPD-2011 Semiconductor Devices, General Specification for
- DLA MIL-S-19500/69 E VALID NOTICE 3-2011 Semiconductor Device, Transistor, NPN, Silicon, Types JAN-2N337 and JAN-2N338
- DLA MIL-S-19500/16 E VALID NOTICE 3-2011 Semiconductor Device, Transistor, NPN, Silicon Types 2N342, 2N342A and 2N343
- DLA QML-19500-2011 Semiconductor Devices, General Specification for
- DLA QML-19500-2013 Semiconductor Devices, General Specification for
- DLA QML-19500-2012 Semiconductor Devices, General Specification for
- DLA QML-19500-QPD-2010 Semiconductor Devices, General Specification for
- DLA QML-19500-31-2007 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
- DLA MIL-S-19500/216 A VALID NOTICE 3-2004 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON TYPE 2N1051
- DLA MIL-S-19500/273 A VALID NOTICE 3-2011 Semiconductor Device, Transistor Type Type 2N744
- DLA MIL-S-19500/425 VALID NOTICE 2-2004 SEMICONDUCTOR DEVICE, TRANSISTOR, PN, SILICON, UNIJUNCTION JAN2N5431, AND JANTX2N5431
- DLA MIL-S-19500/373 A VALID NOTICE 4-2011 Semiconductor Device, Transistor, NPN, Silicon Switching Types 2N914 and TX2N914
- DLA MIL-S-19500/268 C VALID NOTICE 4-2011 Semiconductor Device, Transistor, NPN, Silicon Switching Types 2N2481 and TX2N2481
- DLA MIL-S-19500/76 C VALID NOTICE 3-2011 Semiconductor Device, Transistor, PNP, Germanium, Power Types 2N1412 and 2N1412A
- DLA MIL-PRF-19500/287 G-2008 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN SILICON, SWITCHING, TYPE 2N3013, JAN AND JANTX
- DLA DSCC-DWG-91011 REV B-2003 SEMICONDUCTOR DEVICE, DIODE, ULTRA FAST
- DLA MIL-PRF-19500/198 E-2008 SEMICONDUCTOR DEVICE, THYRISTORS, TYPES 2N1870A, 2N1871A, 2N1872A, AND 2N1874A, JAN
- DLA MIL-S-19500/288 (2)-1966 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON TYPE 2N2377
IEEE - The Institute of Electrical and Electronics Engineers@ Inc.
- IEEE 256-1963 SEMICONDUCTOR DIODES
- IEEE 59-1962 SEMICONDUCTOR RECTIFIER COMPONENTS
RU-GOST R
- GOST 15133-1977 Semiconductor devices. Terms and definitions
- GOST 26239.5-1984 Semiconductor silicon and quartz. Method of impurities determination
- GOST R 50471-1993 Semiconductor photoemitters. Measuring method for halfintensity angle
- GOST R 57439-2017 Semiconductor devices. Basic dimensions
- GOST 18472-1988 Semiconductor devices. Basic dimensions
- GOST 11630-1984 Semiconductor devices. General specification
- GOST 24458-1980 Semiconductor optoelectronic couplers. Essential parameters
- GOST 23414-1984 Semiconductor power converters. Terms and definitions
- GOST 24461-1980 Power semiconductor devices. Test and measurement methods
- GOST 17465-1980 Semiconductor diodes. Basic parameters
- GOST 26239.7-1984 Semiconductor silicon. Method of oxygen, carbon and nitrogen determination
Lithuanian Standards Office
- LST 1412-1995 Semiconductor devices. Terms and definitions
- LST EN 60747-15-2012 Semiconductor devices - Discrete devices -- Part 15: Isolated power semiconductor devices (IEC 60747-15:2010)
- LST EN 62417-2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010)
GOSTR
- GOST R 57436-2017 Semiconductor devices. Terms and definitions
- GOST 18577-1980 Thermoelectric semiconductor devices. Terms and definitions
RO-ASRO
- STAS 6360-1974 SEMICONDUCTOR MATERIALS AND DEVICES Terminology
- STAS 1590/10-1974 SEMICONDUCTOR DEVICES Graphical symbols
- STAS CEI 191-4-1992 Mechanical standardization of semiconductor devices. Part 4: Coding system and classification into forms of package outlines for semiconductor devices
- STAS 11066/2-1980 THYRISTORS Test methods
Association Francaise de Normalisation
- NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
- NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
- NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15: isolated semiconductor power devices
- NF C53-221:1980 Semiconductor self-commutated convertors.
- NF C80-203*NF EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs).
- NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
- NF EN 62417:2010 Semiconductor Devices – Mobile Ion Testing for Metal Oxide Field Effect Semiconductor Transistors (MOSFETs)
- NF EN 62779-1:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 1 : exigences générales
- NF C96-779-2*NF EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2 : characterization of interfacing performances
- NF EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for power transfer and wireless charging - Part 1: general requirements and specifications
- NF C63-244-1*NF EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : general requirements and specifications
- NF C96-779-3*NF EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3 : functional type and its operational conditions
- NF EN 62779-2:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 2 : caractérisation des performances d'interfaçage
- NF C96-287-1*NF EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1 : guidelines for IC reliability qualification
- NF EN 60191-4/A1:2018 Mechanical standardization of semiconductor devices - Part 4: coding system and shape classification of package structures for semiconductor devices
HU-MSZT
- MSZ 9200/18-1980 Electronic signals. semiconductor
- MNOSZ 700-8.lap-1955 STMicroelectronics tests carbon and jaundice
- MSZ 700/23.lap-1965 STMicroelectronics tests coke
- MNOSZ 700-16.lap-1955 Detection of Nickel Content in Semiconductors
- MNOSZ 700-19.lap-1955 STMicroelectronics Pitch Content
- MSZ 700/24.lap-1965 STMicroelectronics Coke Test
- MNOSZ 700-18.lap-1956 Detection of chlorine content in semiconductors
- MSZ 771/5-1979 Mechanical properties of semiconductor materials
SE-SIS
- SIS SEN 01 03 51-1976 Semiconductor devices Terminology
- SIS SEN 01 03 51-1966 Semiconductor devices Terminology
- SIS SS-IEC 748:1991 Semiconductor devices — Integrated circuits
- SIS SS-IEC 747:1991 Semiconductor devices — Discrete devices
US-Unspecified Preparing Activity
- DI-QCIC-80924 A-2006 SEMICONDUCTOR PROCESS SPECIFICATION
BE-NBN
- NBN C 95-001-1977 Semiconductor equipment. the term
- NBN C 95-001-1973 Semiconductor devices. specialized vocabulary
IEC - International Electrotechnical Commission
- IEC 60146-2:1974 Semiconductor Convertors Part 2: Semiconductor Self-Commutated Convertors (Edition 1.0)
- IEC 62951-7:2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)
- IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices (Edition 1.0)
- IEC 60146-3:1977 Semiconductor Convertors Part 3: Semiconductor Direct D.C. Convertors (D.C. Chopper Convertors) (Edition 1.0)
- IEC 62779-1:2016 Dispositifs à semiconducteurs – Interface à semiconducteurs pour les communications via le corps humain – Partie 1: Exigences générales (Edition 1.0)
Danish Standards Foundation
- DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- DS/EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
- DS/EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- DS/EN 60191-4/A2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- DS/EN 60191-4:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- DS/EN IEC 63287-1:2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification
KR-KS
- KS C IEC 60747-14-1-2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
- KS C IEC 60747-14-1-2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
- KS C IEC 62951-1-2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
ES-UNE
- UNE-EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (Endorsed by AENOR in June of 2012.)
- UNE-EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
- UNE-EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (Endorsed by AENOR in September of 2010.)
- UNE-EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
- UNE-EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications (Endorsed by Asociación Española de Normalización in December of 2021.)
- UNE-EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification (Endorsed by Asociación Española de Normalización in November of 2021.)
IET - Institution of Engineering and Technology
- HIST WLD SEMI IND-1990 A History of the World Semiconductor Industry
Underwriters Laboratories (UL)
- UL 1557-2011 Electrically isolated semiconductor devices
- UL 1557-1993 Electrically isolated semiconductor devices
- UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006
- UL 1557-1997 Electrically isolated semiconductor devices
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- JEDEC EIA-323-1966 Air-Convection-Cooled Life Test Environment for Lead-Mounted Semiconductor Devices
- JEDEC EIA-321-C-1987 Numbering of Like-Named Terminal Functions in Semiconductor Devices and Designation of Units in Multiple-Unit Semiconductor Devices
- JEDEC JESD14-1986 Semiconductor Power Control Modules
- JEDEC JEP140-2002 Beaded Thermocouple Temperature Measurement of Semiconductor Packages
- JEDEC JEP122F-2010 Failure Mechanisms and Models for Semiconductor Devices
- JEDEC JEP122G-2011 Failure Mechanisms and Models for Semiconductor Devices
- JEDEC JEP122D-2008 Failure Mechanisms and Models for Semiconductor Devices
- JEDEC JESD370B-1982 Designation System for Semiconductor Devices
- JEDEC JEP122C-2006 Failure Mechanisms and Models for Silicon Semiconductor Devices
American National Standards Institute (ANSI)
- ANSI/EIA 321-C:1987 Numbering of Like-Named Terminal Functions in Semiconductor Devices and Designation of Units in Multiple-Unit Semiconductor Devices
ESD - ESD ASSOCIATION
- EP118-2007 Physics of Semiconductor Devices
PH-BPS
- PNS IEC 62830-2:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
GOST
- GOST R 71070-2023 Electronic semiconductor devices. Terms and definitions
- GOST R 71055-2023 Semiconductor devices. System of designations
- GOST R 70873-2023 Semiconductor rectifier diodes and poles. Parameters system
- GOST R 70999-2023 Semiconductor diodes. Parameters system
- GOST R 71069-2023 Semiconductor emitters. Parameters system
CENELEC - European Committee for Electrotechnical Standardization
- EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices
Standard Association of Australia (SAA)
- AS 60146.2:2001/Amdt 1:2001 Semiconductor converters Self-commutated semiconductor converters include direct-to-dc converters
- AS 60146.2:2001(R2013) Semiconductor converters Self-commutated semiconductor converters include direct-to-dc converters
- AS 60146.2:2001 Semiconductor converters - Self-commutated semiconductor converters including direct d.c. converters
DIN
- DIN EN 60747-15:2004 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2003); German version EN 60747-15:2004
JP-JEC
- JEC 2440-2005 SEMICONDUCTOR SELF-COMMUTATED CONVERTERS
- JEC 2407-2007 INSULATED TYPE POWER SEMICONDUCTOR MODULES
TH-TISI
- TIS 1863-2009 Semiconductor devices.discrete devices
IN-BIS
- IS 5001-1969 Semiconductor Device Drawing Guide
- IS 5001 Pt.1-1969 Semiconductor Device Drawing Guide
- IS 4411-1967 Semiconductor device name code
- IS 7412-1974 Life test of semiconductor devices
- IS 5000 OC.4-1969 Semiconductor device size CASE OUTLINE OC4
PL-PKN
- PN T01503 ArkusZ50-1973 Semiconductor devicesDimensions Case C9
- PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits
- PN T01503 ArkusZ06-1973 Semiconductor devices Dimensions Device A 24
- PN T01208-01-1992 Semiconductor devices Bipolar transistors Terminology and letter symbols
- PN T01208-02-1992 Semiconductor devices Bipolar transistors Essential ratings and characteristics
- PN T01503 ArkusZ16-1973 Semiconductor devices Dimensions Device A 51
Indonesia Standards
- SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials
ZA-SANS
- SANS 60146-2:1999 Semiconductor converters Part 2: Self-commutated semiconductor converters including direct d.c. converters
IECQ - IEC: Quality Assessment System for Electronic Components
- PQC 82-1989 Semiconductors for Use in Electronic Equipment: Sectional Specification: Semiconductor Integrated Circuits Excluding Hybrid Circuits
FI-SFS
- SFS 5327-1987 Glossary of electronic technology. Semiconductor components and overall circuits
European Standard for Electrical and Electronic Components
- CECC MUAHAG VOL 9 IS 4-1993 Preferred Products List; Semiconductors (En)
American Society for Testing and Materials (ASTM)
- ASTM D3004-02 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
- ASTM D3004-08(2020) Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials