YS/T 1105-2016 in English

This standard specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage for bonding silver wires used in semiconductor packaging. It covers aspects such as chemical composition, physical properties, dimensional tolerances, and performance characteristics. The standard applies to silver wires used in the bonding process of semiconductor devices, ensuring their quality and reliability during application. It provides guidelines for manufacturers, users, and relevant parties involved in the production and use of bonding silver wires. The content includes requirements for raw materials, production processes, quality control, and product inspection, aiming to ensure consistency and reliability of the product. This standard is applicable to the entire production and use chain of bonding silver wires in the semiconductor industry.