Semiconductor packaging nitrogen

Semiconductor packaging nitrogen, Total:162 items.

The international standard classification for "Semiconductor packaging nitrogen" includes: Integrated circuits. Microelectronics , Other products of non-ferrous metals , Software development and system documentation , Semiconductor devices .

The Chinese standard classification for "Semiconductor packaging nitrogen" includes: Microcircuit in general , Precious metals and their alloys , Semiconductor integrated circuit , Technical Management , Software engineering , Power semiconductor device and parts .

Group Standards of the People's Republic of China

T/CMIF 137-2021 Silver-gold alloy wire for semiconductor packaging bonding
T/QGCML 1407-2023 Double sleeve sealing device for semiconductor photovoltaic manufacturing
T/ZZB 1718-2020 Gold bonding wire for semiconductor package
T/CIECCPA 007-2024 Semiconductor Industry Nitrogen Oxide Emission Requirements
T/ICMTIA CM0035-2023 Sealing gasket for semiconductor silicon material process device

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 15878-2015 Semiconductor integrated circuits―Specification of leadframes for small outline package
GB/T 14113-1993 of packages for semiconductor integrated circuits
GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package
GB/T 8750-2014 Gold bonding wire for semiconductor package

工业和信息化部

YS/T 1105-2016 Silver bonding wire for semiconductor package

Professional Standard - Electron

SJ/T 10424-1993 Glass powder for passivation packaging for use in semiconductor devices
SJ 2849-1988 Construction dimensions for package parts of discrete semiconductor devices

未注明发布机构

DIN EN 60191-4:2019 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4:Coding system and classification into forms of package outlines for semiconductor device packages
GB/T 36646-2018 Software component management—Management information model

Professional Standard - Machinery

JB/T 8736-1998 Aluminum Nitride Ceramics Substrate Intended to Be Used in Power Semiconductor Modules

SCC

MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
BS PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
MIL MIL-DTL-19491H-2002 SEMICONDUCTOR DEVICES, PACKAGING OF (SUPERSEDING MIL-S-19491G)
11/30248240 DC BS EN 60191-6-22. Mechanical standardization of semiconductor devices. Part 6-22. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages. Silicon Fine-pitch Ball G...
CEI EN 60191-4:2015 Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
CEI EN 60191-4/A1:2015 Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DANSK DS/EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
BS 3934-6:1992 Mechanical standardization of semiconductor devices-Specification for the preparation of outline drawings of surface mounted semiconductor device packages
UNE-EN 60191-4:2001 Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.
IEC 60191-4:1999+AMD1:2001+AMD2:2002 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DANSK DS/EN 60191-4/A1:2018 Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
DIN EN 60191-6-22 E:2011 Draft Document - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball G...
CEI EN 60191-6-22:2014 Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic...
MIL MIL-S-19491F-1985 SEMICONDUCTOR DEVICES, PACKAGING OF (S/S BY MIL-S-19491G)
DANSK DS/EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
BS 3934-4:1992 Mechanical standardization of semiconductor devices-Recommendations for a coding system and classification into forms of package outlines for semiconductor devices
IEC 60191-4:1999/AMD2:2002 Amendment 2 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:1999/AMD1:2001 Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DANSK DS/EN 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
CEI EN 60191-6-21:2011 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
10/30227777 DC BS EN 60191-4. Mechanical standardization of semiconductor devices. Part 4. Coding system and classification into forms of package outlines for semiconductor device packages
DIN IEC 60191-6-21 E:2009 Draft Document - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline package...
CEI EN 60191-6:2011 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
DIN IEC 60191-6-15 E:2007 Draft Document - Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline package...
CEI EN 60191-6-3:2001 Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
DANSK DS/EN 60191-6-3:2001 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
DANSK DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
DIN EN 60191-4/A1 E:2017 Draft Document - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/882/CD:2016)
DIN IEC 60191-4 E:2010 Draft Document - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
CEI EN 60191-6-4:2004 Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
DANSK DS/EN 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
CEI EN 60191-6-20:2011 Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
BS IEC 60092-304:1980 Electrical installation in ships-Equipment. Semiconductor convertors
08/30190030 DC BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages...

British Standards Institution (BSI)

PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
BS EN 60191-4:2014+A1:2018 Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages
22/30443234 DC BS EN 63378-3. Thermal standardization on semiconductor packages - Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis
BS EN 60191-6-3:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)
BS EN 60191-6:2004 Mechanical standardization of semiconductor devices-Part 6:General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2009 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
BS EN 60191-6:2005 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
23/30469486 DC BS EN IEC 63378-2. Thermal standardization on semiconductor packages - Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
BS EN 60749-8:2003 Semiconductor devices. Mechanical and climatic test methods. Sealing
23/30469010 DC BS EN IEC 63378-3. Thermal standardization on semiconductor packages - Part 3. Thermal circuit simulation models of discrete semiconductor packages for transient analysis
BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
BS EN 60191-6-20:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
BS EN 60191-6-8:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)
BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
BS EN 60191-4:2014 Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
BS IEC 60092-304:2022 Electrical installations in ships. Equipment. Semiconductor converters
BS IEC 60092-304:2002 Electrical installation in ships - Equipment - Semiconductor convertors
BS EN 60749:1999 Semiconductor devices - Mechanical and climatic test methods

International Electrotechnical Commission (IEC)

IEC TR 63378-1:2021 Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
IEC 60191-6:1990 Mechanical standardization of semiconductor devices; part 6: general rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-4:2013+AMD1:2018 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Aerospace Industries Association/ANSI Aerospace Standards

AIA/NAS NAS4120-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
AIA/NAS NAS4123-2012 HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

AIA/NAS - Aerospace Industries Association of America Inc.

NAS4120-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Encapsulating Type@ TO-5
NAS4123-1995 Heat Sink@ Electrical-Electronic Component@ Semiconductor Devices@ for Dual Inline Packages (DIP)
NAS4120-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ ENCAPSULATING TYPE@ TO-5 (Rev 1)

Danish Standards Foundation

DS/EN 60191-4/A2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DS/EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DS/EN 60191-4:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DS/EN 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
DS/EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
DS/EN 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
DS/EN 60191-6-3:2001 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
DS/EN 60191-6-4:2004 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JEP167-2013 Characterization of Interfacial Adhesion in Semiconductor Packages
JEDEC JEP167A-2020 Characterization of Interfacial Adhesion in Semiconductor Packages
JEDEC JESD30D-2006 Descriptive Designation System for Semiconductor-device Packages
JEDEC JESD30G-2016 Descriptive Designation System for Semiconductor-device Packages
JEDEC JESD30F-2013 Descriptive Designation System for Semiconductor-device Packages

Aerospace Industries Association

AIA NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
AIA NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)

GSO

GSO IEC 60191-4:2015 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
OS GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
GSO IEC 60191-6-21:2017 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
OS GSO IEC 60191-6-21:2017 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
OS GSO IEC 60191-6-3:2015 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
GSO IEC 60191-6-3:2015 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
BH GSO IEC 60191-6-3:2016 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
GSO IEC 60191-6:2015 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
OS GSO IEC 60191-6:2015 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
OS GSO IEC 60191-6-20:2017 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
BH GSO IEC 60191-6:2016 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
GSO IEC 60191-6-20:2017 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

RU-GOST R

GOST 26239.7-1984 Semiconductor silicon. Method of oxygen, carbon and nitrogen determination

Association Francaise de Normalisation

NF C96-013-4/A1*NF EN 60191-4/A1:2018 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
NF C96-013-4*NF EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
NF C96-013-4/A2*NF EN 60191-4/A2:2003 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6: general rules for the preparation of outline drawings of packages for surface mount semiconductor devices
NF C96-013-6-20*NF EN 60191-6-20:2011 Mechanical standardization of semiconductor devices - Part 6-20 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
NF C96-013-6*NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages
NF C96-013-6-4*NF EN 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
NF C96-013-6:2005 Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages.
NF C96-013-6-21*NF EN 60191-6-21:2011 Mechanical standardization of semiconductor devices - Part 6-21 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).
NF EN 60191-4/A1:2018 Mechanical standardization of semiconductor devices - Part 4: coding system and shape classification of package structures for semiconductor devices

ES-UNE

UNE-EN 60191-6-21:2010 Mechanical standardization of semiconductor devices -- Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (Endorse...
UNE-EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by AENOR in May of 2014.)
UNE-EN 60191-4:2014/A1:2018 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by Asociación Española de Normalización in June of 2018.)
UNE-EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
UNE-EN 60191-6-3:2000 Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AEN...
UNE-EN 60191-6-4:2003 Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AEN...
UNE-EN 60191-6:2009 Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in April of 2010.)

Lithuanian Standards Office

LST EN 60191-4+A1-2002 Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999+A1:2001)
LST EN 60191-4+A1-2002/A2-2002 Mechanical standardization of semiconductor devices. Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999/A2:2002)
LST EN 60191-6-22-2013 Mechanical standardization of semiconductor devices -- Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic
LST EN 60191-6-20-2011 Mechanical standardization of semiconductor devices -- Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC
LST EN 60191-6-21-2011 Mechanical standardization of semiconductor devices -- Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-
LST EN 60191-6-3-2002 Mechanical standardization of semiconductor devices. Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000)

YU-JUS

JUS N.R1.500-1980 Semioonductor ?evices. Acceptance. Electrical tests
JUS N.R1.322-1979 Terms and definitions for semiconductor ?evices. Thyristors

European Committee for Electrotechnical Standardization（CENELEC）

EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
EN 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

JP-JEITA

JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)
JEITA ED 7300A-2008 Recommended practice on standard for the preparation of outline drawings of semiconductor package

German Institute for Standardization

DIN EN 60191-6-21:2011-03 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 6019...
DIN EN 60191-6-22:2013-08 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
DIN EN 60191-6-4:2004-01 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:20...
DIN EN 60191-6-20:2011-03 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (I...
DIN EN 60191-4:2019-02 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018 / Note: DIN EN 60191-...
DIN EN 60191-6:2010-06 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 / Note: DIN EN 60191-6 (2005-04) rem...
DIN EN 60191-6-3:2001-06 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:200...
DIN EN 60191-6-5:2002-05 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German vers...
DIN EN 60191-6-6:2002-02 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German vers...
DIN EN 60191-6-1:2002-08 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60...
DIN EN 60191-6-2:2002-09 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal package...
DIN EN 60191-6-8:2002-05 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); Ge...
DIN EN 60191-4:2003 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
DIN EN 60191-6-20:2011 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC

Society of Automotive Engineers (SAE)

SAE AS6294/3-2019 Requirements for Plastic Encapsulated Discrete Semiconductors in Space Applications

CENELEC - European Committee for Electrotechnical Standardization

EN 60191-6:2004 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Defense Logistics Agency

DLA MIL-DTL-19491 H-2002 SEMICONDUCTOR DEVICES, PACKAGING OF

CZ-CSN

CSN IEC 92-304:1993 Electrical installations in ships. Equipment. Semiconductor convertors

AENOR

UNE 21135-304:1993 ELECTRICAL INSTALLATIONS IN SHIPS. EQUIPMENT. SEMICONDUCTOR CONVERTORS

IEC - International Electrotechnical Commission

IEC 62951-7:2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)

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