GB/T 8750-2022 in English
VALIDGold-based bonding wire and bandlet for semiconductor package
- Issued on:2022-12-30
- Implemented on:2023-07-01
- File Format:PDF
- Delivery:Via email within 5 business days
$408.00
《GB/T 8750-2022半导体封装用金基键合丝、带》由TC243（全国有色金属标准化技术委员会）归口，TC243SC5（全国有色金属标准化技术委员会贵金属分会）执行，主管部门为中国有色金属工业协会。
Introduction
1. Standard background and technical evolution analysis
GB/T8750-2022 "Gold-based bonding wire and ribbon for semiconductor packaging" national standard will be officially implemented on July 1, 2023, replacing the previous GB/T8750-2014 version. This standard is mainly applicable to the classification, technical requirements and test methods of gold-based bonding wire and ribbon for semiconductor discrete devices and integrated circuit packaging.
2. Standard framework comparison
| Standard version | Main technical changes | Scope of application |
|---|---|---|
| GB/T8750-2014 | Applicable to gold bonding wire for semiconductor packaging, without clearly distinguishing between gold wire and gold ribbon. | LED packaging and general semiconductor packaging |
| GB/T8750-2022 | 1. Added technical requirements for gold-based bonding tape. 2. Clearly distinguished the chemical composition and properties of gold wire and gold alloy wire. 3. Updated the test methods and inspection rules. | Gold-based bonding wire and ribbon for semiconductor discrete devices and integrated circuit packaging |
3. Detailed explanation of technical requirements
Chemical composition: Table 2 specifies the chemical composition of gold wire and gold ribbon, where the mass fraction of gold is not less than 99%, and the sum of the mass fractions of the six impurity elements is not more than 1%.
Dimensional tolerance: There are strict regulations for diameter, width and thickness. For example, the diameter tolerance of gold wire is ±0.001mm (Table 4).
4. Implementation suggestions
Case study: How to choose the right product specifications?
When selecting gold-based bonding wires and ribbons, the following parameters need to be determined according to specific application requirements:
- Chemical purity: 4N (99.99%) or 3N (99.9%)
- Diameter/width: Select according to packaging process requirements, such as 0.013mm to 0.070mm
- Mechanical properties: Ensure that the minimum tensile force and elongation requirements are met (Table 7)
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