GB/T 37031-2018 in English
VALIDSemiconductor lighting terminology
- Issued on:2018-12-28
- Implemented on:2018-12-28
- File Format:PDF
- Delivery:Via email within 5 business days
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《GB/T 37031-2018半导体照明术语》由339-1（工业和信息化部（电子））归口，主管部门为工业和信息化部（电子）。
Introduction
Standard Framework and Technology Evolution
GB/T 37031-2018, as the basic terminology standard in the field of semiconductor lighting in my country, has systematically constructed a complete terminology system for the first time, including the two major technical routes of LED and OLED. The standard was proposed by the Electronics Department of the Ministry of Industry and Information Technology and jointly drafted by six authoritative institutions including the China Electronics Technology Standardization Institute, reflecting the development level of cutting-edge technologies in 2018.
| Technical dimensions | LED lighting | OLED lighting |
|---|---|---|
| Core components | LED chips, LED modules | OLED light-emitting units, OLED lighting screens |
| Typical structures | Flip-chip/flip-chip, COB packaging | PIN structure, stacked structure |
| Performance indicators | Junction temperature, thermal resistance, light efficiency | Screen temperature, brightness uniformity |
Core Terminology
2.1 General Terminology
Semiconductor lighting (2.1.6) is clearly defined as "a lighting method that uses solid luminescent materials as a light source", covering two technical paths: LED lighting and OLED lighting. Among them:
- LED (2.1.3) emphasizes the spontaneous radiation luminescence mechanism at the PN junction
- OLED (2.1.4) highlights the diode characteristics of organic materials
2.2 LED Technology System
The standard is defined by industry chain:
- Material layer: 7 key materials such as patterned sapphire substrate (PSS) are defined
- Chip layer: Small/medium/high power chips are divided according to power, and the input power critical value is accurate to ±100mW
- Packaging layer: Heat sink requirements for three packaging forms such as COB are defined
Typical application cases
In the definition of LED flat panel lamps (2.2.6.4), the standard specifically stipulates the technical requirement that the overall thickness shall not exceed 70mm, which has direct guiding significance for the design of ultra-thin lamps.
Performance Evaluation System
Chapter 2.5 of the standard establishes complete quantitative evaluation indicators:
| Indicator Type | Key Parameters | Test Conditions |
|---|---|---|
| Photoelectric Characteristics | External Quantum Efficiency (2.5.4) | Room Temperature 25±1℃ |
| Thermal Characteristics | Junction-to-Ambient Thermal Resistance (2.5.12) | Steady-State Power Dissipation |
| System Characteristics | Total Harmonic Distortion (2.5.21) | Full Load Conditions |
Implementation Recommendations
Enterprise Application Guidelines
- Product R&D: Strictly distinguish the applicable scenarios of the terms LED modules (2.2.1.5) and LED lamps (2.2.1.7)
- Quality Control: Establish an accelerated aging test process based on the luminous flux maintenance rate (2.5.8)
- Technical Documentation: Standardize the use of grading terms such as "low-power chip" (2.2.3.1)
Prospects for Standard Development
With the development of new technologies such as Micro LED, it is recommended that in subsequent revisions:
- Add clear definitions of mini/micro LED
- Add terms for intelligent lighting systems
- Improve the quantitative indicators of non-visual biological effects (2.4.1.6)
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