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Semiconductor inspection

Semiconductor inspection, Total:434 items.

The international standard classification for "Semiconductor inspection" includes: Aerospace electric equipment and systems , Optoelectronics. Laser equipment , Integrated circuits. Microelectronics , Semiconductor devices in general , Semiconducting materials , Plug-and-socket devices. Connectors , Rectifiers. Convertors. Stabilized power supply , Nuclear energy in general , Chemical analysis .

The Chinese standard classification for "Semiconductor inspection" includes: Thermal Measurement , Special electronic technology material , Power semiconductor device and parts , Temperature and pressure instrument , Electronic components , Technical management , Optoelectronic device assembly , Technical management , Technical Management , Technical management , Semiconductor integrated circuit , Semiconductor discrete devices in general , Semimetal and semiconductor material in general , Semiconductor emitting device , Connector , Precious metals and their alloys , Laser device , Nuclear instrument and detector in general , Broadcasting and television transmission and receiving equipment , Industrial gas and chemical gas .


National Metrological Verification Regulations of the People's Republic of China

Group Standards of the People's Republic of China

Professional Standard - Machinery

  • JB/T 8669-1997 Semiconductor Frequency Changing Unit Intended to Be Used in Medium Frequency Induction Heating
  • JB/T 4277-1996 Packing of Power Semiconductor Parts
  • JB/T 7786-1995 Sampling Method for Test of Power Semiconductor Devices
  • JB/T 7059-1993 Guide for Preparation of Standard for Power Semiconductor Modules
  • JB/T 5537-2006 Semiconductor pressure sensors

Professional Standard - Aerospace

Professional Standard - Electron

  • SJ/T 10414-1993 Solder for semicoductor device
  • SJ/T 10705-1996 Standard practice for inspection of surface quality of semiconductor lead-bonding wire
  • SJ 2433-1984 Bonding sheet for semiconductor tubes
  • SJ 2073-1982 Cores for IF transformers and medium wave oscillator coil of transistor radio receivers
  • SJ/T 10482-1994 Test method for characterizing semiconductor deep levels by transient capacitance techniques
  • SJ 20072-1992 Semiconductor discrete device-Detail specification for semiconductor opto-couplers for Type GH24,GH25 and GH26
  • SJ/Z 9021.1-1987 Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices
  • SJ 50033.48-1994 Semiconductor discrete device - Detail specification for type 2DV8CP silicon microwave detector diode
  • SJ/T 10535-1994 Tungsten boat for semiconductor devices
  • SJ 20234-1993 Verification regulation of model HP4145A semiconductor parameter analyzer
  • SJ/T 11395-2009 Semiconductor lighting terminology
  • SJ 50033/109-1996 Semiconductor optoelectronic devices - Detail specification for Types GJ903T and GJ9032T and GJ9034T semiconductor laser diodes
  • SJ 20236-1993 Verification regulation of the model GH2050/51 calibrator for transistor characteristic tracer
  • SJ/T 10139-1991 Detail specification for electronic components--Semiconductor integrated circuits--CC4028 CMOS 4-line to 10-line decoder
  • SJ/T 10414-2015 Solder for semiconductor device
  • SJ 20233-1993 Verification regulation of model IMPACT-II semiconductor discrete device test sysytem

Military Standard of the People's Republic of China-General Armament Department

  • GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
  • GJB 762.1-1989 Semiconductor device radiation hardening test method Neutron irradiation test
  • GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
  • GJB 33/18-2011 Semiconductor optoelectronic device.Detail specification for type GO417 bidirectional analog switch semiconductor photocoupler
  • GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
  • GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
  • GB/T 3859.2-1993 Semiconductor convertors Application guide
  • GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part 11:Section 1:Internal visual examination for semiconductor integrated circuits (excluding hybrid circuits)
  • GB/T 7678-1987 Semiconductor self-commutated convertors
  • GB/T 11685-2003 Measurement procedures for semiconductor X-ray detector system and semiconductor X-ray energy spectrometers
  • GB/T 15872-2013 Power supply interface for semiconductor equipment
  • GB/T 15872-1995 Power supply interface for semiconductor equipment
  • GB/T 14264-2024 Terminology of semiconductor materials
  • GB/T 3859.4-2004 Semiconductor converter - Self-commutated semiconductor converters including direct d.c.converters
  • GB/T 14264-2009 Semiconductor materials - Terms and definitions
  • GB/T 31469-2015 Semiconductor materials cutting fluid
  • GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
  • GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
  • GB/T 14264-1993 Semiconductor materials-Terms and definitions
  • GB/T 4298-1984 The activation analysis method for the determination of elemental impurities in semiconductor silicon materials
  • GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
  • GB/T 36357-2018 Technical specification for middle power light-emitting diode chips
  • GB/T 31358-2015 General specification for semiconductor lasers

Taiwan Provincial Standard of the People's Republic of China

  • CNS 5074-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Free Fall)
  • CNS 5544-1988 Environmantal Testing Methods and Endurance Testing Methods for Discrate Semiconductor Devices (Intermittent Operation Test of Fleld Effect Transistor)
  • CNS 5541-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Continuous Operation Test of Transistor)
  • CNS 6122-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Applying Voltage Test of Thyristors)
  • CNS 5070-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Cycle Test for Temperature)
  • CNS 5068-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Solderability Testing for Adhesion)
  • CNS 5069-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Thermal Shock)
  • CNS 6118-1988 Environmental inspection method and durability inspection method of single semiconductor device – low temperature storage test
  • CNS 5545-1988 Environmental Testing Methods and Endurance Testing Methods for Discrate Semiconductor Devices Reverse Bias Test of Transistor Under High Temperature)
  • CNS 5077-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Terminal Strength)
  • CNS 5542-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Continuous Operation Test of Field Effect Transistor
  • CNS 5543-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Intermittent Operation Test of Transistor)
  • CNS 6124-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Intermittent Applying Voltage Test of Thyristors)
  • CNS 5078-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Salt Mist Spray)
  • CNS 5073-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Shock Test)
  • CNS 5547-1988 Environmental inspection method and durability inspection method of single semiconductor device – high temperature storage test
  • CNS 5066-1983 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (General Rules)
  • CNS 5072-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Sealing Test)
  • CNS 5071-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Cycle Test for Temperature & Humidity)
  • CNS 6117-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Damp Heat Test)
  • CNS 6126-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (High Temperature for Applying Voltage Test of Thyristors)
  • CNS 5076-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Vibration Test)
  • CNS 5075-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Constant Acceleration)
  • CNS 7011-1981 Numbering of Electrodes in Multiple Electrode Semiconductor Devices and Designation of Units in Multiple Unit Semiconductor Devices
  • CNS 6120-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Operation Test of Thyristors)

Guangdong Provincial Standard of the People's Republic of China

国家市场监督管理总局、中国国家标准化管理委员会

工业和信息化部

Professional Standard - Commodity Inspection

  • SN 0022-1992 Rule for inspection of portable radio receivers with AM broadcast transmissions for export

Guizhou Provincial Standard of the People's Republic of China

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

  • GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers
  • GB/T 34971-2017 Guide for gaseous effluent handling in semiconductor industry

Professional Standard - Post and Telecommunication

  • YD 576-1992 Semiconductor rectifier equipments For telecommunications

HU-MSZT

German Institute for Standardization

  • DIN 50443-1:1988 Testing of materials for use in semiconductor technology; detection of crystal defects and inhomogeneities in silicon single crystals by X-ray topography
  • DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
  • DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
  • DIN 50449-1:1997 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 1: Carbon in gallium arsenide
  • DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
  • DIN 50449-2:1998 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 2: Boron in gallium arsenide
  • DIN 50442-1:1981 Testing of semi-conductive inorganic materials; determination of the surface structure of circular monocrystalline semi-conductive slices; as-cut and lapped slices
  • DIN EN 60747-15:2012-08 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010); German version EN 60747-15:2012 / Note: DIN EN 60747-15 (2004-08) remains valid alongside this standard until 2014-01-20.
  • DIN 50454-2:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 2: Indium phosphide
  • DIN 50454-3:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 3: Gallium phosphide
  • DIN EN 62417:2010-12 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010); German version EN 62417:2010
  • DIN 50438-2:1982 Testing of materials for semiconductor technology; determination of impurty content in silicon by infrared absorption; carbon
  • DIN 50452-1:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 1: Microscopic determination of particles
  • DIN 50452-3:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters
  • DIN EN 60749-44:2017-04 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
  • DIN EN IEC 63287-1:2020-06 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for LSI reliability qualification (IEC 47/2614/CDV:2020); German and English version prEN IEC 63287-1:2020 / Note: Date of issue 2020-05-08*Intended as replacem...
  • DIN 50450-4:1993 Testing of materials for semiconductor technology; determination of impurities in carrier gases and dopant gases; determination of C<(Index)1>-C<(Index)3>-hydrocarbons in nitrogen by gas-chromatography
  • DIN SPEC 1994:2017-02 Testing of materials for semiconductor technology - Determination of anions in weak acids
  • DIN SPEC 1994 E:2016-07 Testing of materials for semiconductor technology - Determination of anions in weak acids
  • DIN EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002
  • DIN EN 60146-2:2001 Semiconductor convertors - Part 2: Self-commutated semiconductor convertors including direct d.c. convertors (IEC 60146-2:1999); German version EN 60146-2:2000

Japanese Industrial Standards Committee (JISC)

  • JIS K 1466:1995 Testing methods for hydrofluoric acid of semi-conductor grade

CZ-CSN

British Standards Institution (BSI)

  • BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
  • BS EN IEC 63364-1:2022 Semiconductor devices. Semiconductor devices for IoT system - Test method of sound variation detection
  • BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
  • BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
  • BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
  • BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
  • BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
  • BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
  • BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
  • BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
  • BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
  • BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
  • BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
  • BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
  • BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
  • BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
  • BS QC 790101:1992 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integr...
  • BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
  • BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
  • PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
  • BS EN 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - External visual examination
  • BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
  • BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
  • 18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
  • BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
  • PD ISO/PAS 19451-1:2016 Application of ISO 26262:2011-2012 to semiconductors. Application of concepts
  • BS EN 62779-3:2016 Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
  • BS EN IEC 63287-1:2021 Semiconductor devices. Generic semiconductor qualification guidelines - Guidelines for IC reliability qualification
  • 21/30432536 DC BS EN IEC 63364-1. Semiconductor devices. Semiconductor devices for IOT system. Part 1. Test method of sound variation detection
  • BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
  • PD ISO/PAS 19451-2:2016 Application of ISO 26262:2011-2012 to semiconductors. Application of hardware qualification
  • 23/30478757 DC BS EN IEC 63287-3. Semiconductor devices. Generic semiconductor qualification guidelines - Part 3. Guidelines for reliability qualification plans for power semiconductor module
  • BS EN 60749-3:2017 Semiconductor devices. Mechanical and climatic test methods - External visual examination
  • BS EN IEC 60749-17:2019 Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation
  • BS EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Neutron irradiation
  • 13/30264596 DC BS EN 60747-14-7. Semiconductor devices. Part 14-7. Semiconductor sensor. Flow meter
  • BS EN IEC 62969-1:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
  • PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
  • BS IEC 60747-8-4:2004 Discrete semiconductor devices - Metal-oxide semiconductor field-effect transistors (MOSFETs) for power switching applications
  • BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
  • BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • 19/30404095 DC BS EN IEC 60747-5-4. Semiconductor devices. Part 5-4. Optoelectronic devices. Semiconductor lasers
  • 23/30450091 DC BS IEC 62899-203-2 Printed electronics. Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
  • BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
  • 24/30497113 DC BS EN IEC 63567-1 Semiconductor devices. Performance evaluation of semiconductor processing components and inspection equipment - Part 1. Transmittance evaluation method of EUV pellicle
  • BS 3934-1:1992 Mechanical standardization of semiconductor devices - Recommendations for the preparation of drawings of semiconductor devices
  • 13/30264591 DC BS EN 60747-14-6. Semiconductor devices. Part 14-6. Semiconductor sensor. Humidity sensor

Association Francaise de Normalisation

  • NF EN IEC 63364-1:2023 Semiconductor devices - Semiconductor devices for IDO system - Part 1: Acoustic variation detection test method
  • NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
  • NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
  • NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15: isolated semiconductor power devices
  • NF EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: test method for the effects of a single event (SEE) irradiated by a neutron beam for semiconductor devices
  • NF C53-221:1980 Semiconductor self-commutated convertors.
  • NF C80-203*NF EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs).
  • NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
  • NF EN 62779-1:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 1 : exigences générales
  • NF C96-779-2*NF EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2 : characterization of interfacing performances
  • NF EN 62417:2010 Semiconductor Devices – Mobile Ion Testing for Metal Oxide Field Effect Semiconductor Transistors (MOSFETs)
  • NF C96-779-3*NF EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3 : functional type and its operational conditions
  • NF EN 62779-2:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 2 : caractérisation des performances d'interfaçage
  • NF C96-022-44*NF EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
  • NF C96-287-1*NF EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1 : guidelines for IC reliability qualification

GSO

  • GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
  • GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
  • BH GSO IEC 60748-11-1:2016 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • GSO IEC 60748-11-1:2014 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
  • OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
  • BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
  • OS GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
  • BH GSO IEC 60747-15:2016 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • OS GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • GSO IEC 62779-1:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
  • OS GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
  • BH GSO IEC 62779-1:2022 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
  • GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
  • BH GSO IEC 60747-14-1:2016 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
  • GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
  • OS GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • GSO IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
  • BH GSO IEC 60747-5-4:2016 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • GSO IEC 62779-2:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
  • GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
  • GSO IEC 63287-1:2024 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
  • GSO IEC 62779-3:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions

Standard Association of Australia (SAA)

  • AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
  • AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
  • AS 60146.2:2001/Amdt 1:2001 Semiconductor converters Self-commutated semiconductor converters include direct-to-dc converters
  • AS 60146.2:2001(R2013) Semiconductor converters Self-commutated semiconductor converters include direct-to-dc converters
  • AS 60146.2:2001 Semiconductor converters - Self-commutated semiconductor converters including direct d.c. converters
  • AS 1955.3:1983 Semiconductor Convertors, Part 3: Semiconductor Direct D.C. Convertors (D.C. Chopper Convertors)

SE-SIS

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

SCC

  • CEI EN IEC 63364-1:2023 Semiconductor devices - Semiconductor devices for IoT system Part 1: Test method of sound variation detection
  • DANSK DS/EN IEC 63364-1:2023 Semiconductor devices – Semiconductor devices for IoT system – Part 1: Test method of sound variation detection
  • BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
  • BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
  • IEC 60146:1973 Semiconductor convertors
  • SPC GB/T 14844-2018 Designations of semiconductor materials (TEXT OF DOCUMENT IS IN CHINESE)
  • DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
  • 12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
  • CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
  • 07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
  • BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
  • 12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
  • MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
  • BS IEC 60747-1:2006 Semiconductor devices. General
  • CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
  • DANSK DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • CEI EN 60747-15:2012 Semiconductor devices - Discrete devices Part 15: Isolated power semiconductor devices
  • SPC GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials (TEXT OF DOCUMENT IS IN CHINESE)
  • 05/30137514 DC IEC 60747-14-4. Discrete semiconductor devices. Part 14-4. Semiconductor accelerometers
  • MIL MIL-S-19500/530-1979 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3906
  • MIL MIL-S-19500/529-1978 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3904
  • DIN EN IEC 63364-1 E:2023 Draft Document - Semiconductor devices - Semiconductor devices for IOT system - Part 1: Test method of sound variation detection (IEC 47/2742/CDV:2021); German and English version prEN IEC 63364-1:2021
  • CEI EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication Part 2: Characterization of interfacing performances
  • CEI EN 62417:2011 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
  • DANSK DS/EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
  • BS PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
  • MIL MIL-PRF-19500P-2010 Semiconductor Devices, General Specification for
  • BS 4417:1969 Specification for semiconductor rectifier equipments
  • CEI EN 60749-44:2017 Semiconductor devices - Mechanical and climatic test methods Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
  • DANSK DS/EN 60749-44:2016 Semiconductor devices – Mechanical and climatic test methods – Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
  • MIL MIL-S-19500/288-1964 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON TYPE 2N2377
  • MIL MIL-S-19500/289-1964 Semiconductor Device, Transistor, PNP, Silicon Type 2N2378
  • BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
  • DIN IEC 60747-14-4 E:2002 Draft Document - Discrete semiconductor devices - Part 14-4: Semiconductor accelerometers (IEC 47E/220/CD:2002)
  • 08/30181404 DC BS IEC 60747-14-3. Semiconductor devices. Part 14-3. Semiconductor sensors. Pressure sensors
  • CEI EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • CEI EN 62779-3:2017 Semiconductor devices - Semiconductor interface for human body communication Part 3: Functional type and its operational conditions
  • 07/30162213 DC BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
  • DANSK DS/EN IEC 60749-39:2022 Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

International Electrotechnical Commission (IEC)

  • IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
  • IEC 63364-1:2022 Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
  • IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
  • IEC 60748-11-1:1992 Semiconductor devices; integrated circuits; part 11; section 1: internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
  • IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
  • IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
  • IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
  • IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
  • IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
  • IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
  • IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
  • IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • IEC 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
  • IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
  • IEC 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
  • IEC 60749-3:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
  • IEC 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
  • IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
  • IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
  • IEC 60191-1C:1974 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.

PT-IPQ

  • NP 3081-1985 Electronic component. Semiconductor chip inspection in microelectronics scanning, basic specifications

TR-TSE

  • TS 2643-1977 Test Procedures For Bemiconductor Detectors For Ionizing Radiation

American National Standards Institute (ANSI)

JP-JEITA

  • JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)

NEMA - National Electrical Manufacturers Association

National Fire Protection Association (NFPA)

YU-JUS

American Society for Testing and Materials (ASTM)

  • ASTM F584-87(2005) Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
  • ASTM F584-87(1999) Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
  • ASTM E1161-09 Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
  • ASTM E1161-09(2014) Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
  • ASTM F584-06e1 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
  • ASTM E1161-03 Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
  • ASTM F584-06 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
  • ASTM E1161-21 Standard Practice for Radiographic Examination of Semiconductors and Electronic Components

European Committee for Electrotechnical Standardization(CENELEC)

  • EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
  • EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
  • EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
  • EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
  • EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
  • EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices

Spanish Association for Standardization (UNE)

  • UNE-EN IEC 63364-1:2023 Semiconductor devices - Semiconductor devices for IOT system - Part 1: Test method of sound variation detection (Endorsed by Asociación Española de Normalización in March of 2023.)
  • UNE-EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (Endorsed by AENOR in June of 2012.)
  • UNE-EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
  • UNE-EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (Endorsed by AENOR in September of 2010.)
  • UNE 20-700 Pt.11-1991 Semiconductor devices. Part 11:Sectional specification for discrete devices
  • UNE-EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
  • UNE-EN 300386 V1.5.1:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
  • UNE-EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
  • UNE-EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification (Endorsed by Asociación Española de Normalización in November of 2021.)

Semiconductor Equipment and Materials International (SEMI)

  • SEMI F81-0611-2011 SPECIFICATION FOR VISUAL INSPECTION AND ACCEPTANCE OF GAS TUNGSTEN ARC (GTA) WELDS IN FLUID DISTRIBUTION SYSTEMS IN SEMICONDUCTOR MANUFACTURING APPLICATIONS

RU-GOST R

  • GOST 2.730-1973 Unified system for design documentation. Graphical symbols in diagrams. Semiconductor devices
  • GOST R IEC 60748-11-1-2001 Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • GOST R 50471-1993 Semiconductor photoemitters. Measuring method for halfintensity angle
  • GOST 19656.13-1976 Semiconductor UHF detector diodes. Measurement methods of tangential sensitivity
  • GOST 19656.7-1974 Semiconductor UHF detector diodes. Measurement method of current sensitivity
  • GOST R 57439-2017 Semiconductor devices. Basic dimensions
  • GOST R IEC 748-11-1-2001 Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • GOST 18472-1988 Semiconductor devices. Basic dimensions
  • GOST 11630-1984 Semiconductor devices. General specification
  • GOST 24458-1980 Semiconductor optoelectronic couplers. Essential parameters

Korean Agency for Technology and Standards (KATS)

  • KS C IEC 60748-11-1-2020 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • KS C IEC 60748-11-1:2004 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • KS C 2607-2002 TESTING METHODS OF SEMICONDUCTOR
  • KS C IEC 60748-11-1-2004(2020) Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • KS C IEC 60747-14-1:2003 Semiconductor devices-Part 14-1:Semiconductor sensors-General and classification
  • KS C IEC 60747-14-1:2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
  • KS C IEC 60747-14-1:2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
  • KS C 7013-1985 TYPE DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
  • KS C 7013-1971(2000) TYPE DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
  • KS C IEC 60749-39-2006(2021) Semiconductor devices-Mechanical and climatic test methods-Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Defense Logistics Agency

IEEE - The Institute of Electrical and Electronics Engineers@ Inc.

US-Unspecified Preparing Activity

BE-NBN

IEC - International Electrotechnical Commission

  • IEC 60146-2:1974 Semiconductor Convertors Part 2: Semiconductor Self-Commutated Convertors (Edition 1.0)
  • IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices (Edition 1.0)
  • IEC 60146-3:1977 Semiconductor Convertors Part 3: Semiconductor Direct D.C. Convertors (D.C. Chopper Convertors) (Edition 1.0)
  • IEC 62779-1:2016 Dispositifs à semiconducteurs – Interface à semiconducteurs pour les communications via le corps humain – Partie 1: Exigences générales (Edition 1.0)
  • IEC 62951-7:2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)

Danish Standards Foundation

  • DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • DS/EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
  • DS/EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test method - Part 3: External visual examination
  • DS/EN IEC 63287-1:2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification

Society of Automotive Engineers (SAE)

  • SAE AS6294/3-2019 Requirements for Plastic Encapsulated Discrete Semiconductors in Space Applications

KR-KS

  • KS C IEC 60747-14-1-2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
  • KS C IEC 60747-14-1-2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors

IET - Institution of Engineering and Technology

Underwriters Laboratories (UL)

  • UL 1557-1993 Electrically isolated semiconductor devices
  • UL 1557-2011 Electrically isolated semiconductor devices
  • UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006
  • UL 1557-1997 Electrically isolated semiconductor devices

ESD - ESD ASSOCIATION

RO-ASRO

  • SR CEI 748-11-1-1992 Semiconductor devices Integrated circuits Part 11: Section 1: Internai visual examination for semiconductor integrated circuits excluding hybrid circuits
  • STAS 1590/10-1974 SEMICONDUCTOR DEVICES Graphical symbols
  • STAS 11066/2-1980 THYRISTORS Test methods

CENELEC - European Committee for Electrotechnical Standardization

  • EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices

DIN

  • DIN EN 60747-15:2004 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2003); German version EN 60747-15:2004

JP-JEC

IN-BIS

PL-PKN

TH-TISI

GOST

PH-BPS

  • PNS IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices

Indonesia Standards

Institute of Electrical and Electronics Engineers (IEEE)

  • IEEE Std 1687-2014 IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device

South African Bureau of Standard

  • SANS 60146-2:1999 Semiconductor converters Part 2: Self-commutated semiconductor converters including direct d.c. converters

Lithuanian Standards Office

  • LST EN 60747-15-2012 Semiconductor devices - Discrete devices -- Part 15: Isolated power semiconductor devices (IEC 60747-15:2010)
  • LST EN 62417-2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010)

IECQ - IEC: Quality Assessment System for Electronic Components

  • PQC 82-1989 Semiconductors for Use in Electronic Equipment: Sectional Specification: Semiconductor Integrated Circuits Excluding Hybrid Circuits