Semiconductor inspection
Semiconductor inspection, Total:434 items.
The international standard classification for "Semiconductor inspection" includes: Aerospace electric equipment and systems , Optoelectronics. Laser equipment , Integrated circuits. Microelectronics , Semiconductor devices in general , Semiconducting materials , Plug-and-socket devices. Connectors , Rectifiers. Convertors. Stabilized power supply , Nuclear energy in general , Chemical analysis .
The Chinese standard classification for "Semiconductor inspection" includes: Thermal Measurement , Special electronic technology material , Power semiconductor device and parts , Temperature and pressure instrument , Electronic components , Technical management , Optoelectronic device assembly , Technical management , Technical Management , Technical management , Semiconductor integrated circuit , Semiconductor discrete devices in general , Semimetal and semiconductor material in general , Semiconductor emitting device , Connector , Precious metals and their alloys , Laser device , Nuclear instrument and detector in general , Broadcasting and television transmission and receiving equipment , Industrial gas and chemical gas .
National Metrological Verification Regulations of the People's Republic of China
- JJG(电子) 31010-2007 Verification Regulations for Precision Analyzer of Semiconductor Parameters
- JJG 363-1984 Semiconductor Themistor Themometer
- JJG(电子) 310003-2006 Specification for verification of capacitor parameter testers for semiconductor discrete devices
- JJG(电子) 310002-2006 Specification for verification of DC parameter testers for semiconductor discrete devices
- JJG(电子) 04008-1987 Trial Verification Regulations for QE1A Double-base Semiconductor Tube Tester
- JJG(核工) 4-1991 Verification Regulations for Semiconductor Telescopes (Working Class)
- JJG(电子) 04023-1989 Specification for verification of BJ2970 model high power semiconductor triode tf tester
Group Standards of the People's Republic of China
- T/CZSBDTHYXH 001-2023 Wafer defects Automatic optical inspection equipment
- T/CIET 722-2024 High purity sputtering targets for semiconductors
- T/QGCML 4122-2024 Semiconductor chip sorting machine
- T/QGCML 3970-2024 Semiconductor workshop metal dust intelligent detection and analysis system
- T/IAWBS 019-2023 Equipment front end module
- T/CASME 698-2023 Semiconductor laser therapy apparatus
- T/CIE 120-2021 Semiconductor Integrated Circuit Hardware Trojan Horse Detection Method
- T/CEMIA 030-2022 Positive photoresist developer for semiconductor manufacture
- T/JGXH 008-2020 Diode pump solid state laser
- T/CASAS 002-2021 Terminology for wide bandgap semiconductors
- T/QGCML 4030-2024 Semiconductor car heating and cooling box
- T/QGCML 4031-2024 Semiconductor optical wafer
- T/ZZB 1718-2020 Gold bonding wire for semiconductor package
- T/CEEIA 782-2024 Low-voltage Semiconductor(solidstate) Circuit-Breaker
- T/ZSA 224-2024 Equipment front end module
- T/SZBSIA 007-2022 Semiconductor die bonder test specification
- T/JSXH 0002-2020 Regeneration solution for semiconductor
- T/CASME 1438-2024 Semiconductor device processing specification
Professional Standard - Machinery
- JB/T 8669-1997 Semiconductor Frequency Changing Unit Intended to Be Used in Medium Frequency Induction Heating
- JB/T 4277-1996 Packing of Power Semiconductor Parts
- JB/T 7786-1995 Sampling Method for Test of Power Semiconductor Devices
- JB/T 7059-1993 Guide for Preparation of Standard for Power Semiconductor Modules
- JB/T 5537-2006 Semiconductor pressure sensors
Professional Standard - Aerospace
- QJ 2225-1992 Semiconductor Device Usage Rules
- QJ 1908A-1998 Acceptance Uncovering Check Method of Semiconductor Devices
Professional Standard - Electron
- SJ/T 10414-1993 Solder for semicoductor device
- SJ/T 10705-1996 Standard practice for inspection of surface quality of semiconductor lead-bonding wire
- SJ 2433-1984 Bonding sheet for semiconductor tubes
- SJ 2073-1982 Cores for IF transformers and medium wave oscillator coil of transistor radio receivers
- SJ/T 10482-1994 Test method for characterizing semiconductor deep levels by transient capacitance techniques
- SJ 20072-1992 Semiconductor discrete device-Detail specification for semiconductor opto-couplers for Type GH24,GH25 and GH26
- SJ/Z 9021.1-1987 Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices
- SJ 50033.48-1994 Semiconductor discrete device - Detail specification for type 2DV8CP silicon microwave detector diode
- SJ/T 10535-1994 Tungsten boat for semiconductor devices
- SJ 20234-1993 Verification regulation of model HP4145A semiconductor parameter analyzer
- SJ/T 11395-2009 Semiconductor lighting terminology
- SJ 50033/109-1996 Semiconductor optoelectronic devices - Detail specification for Types GJ903T and GJ9032T and GJ9034T semiconductor laser diodes
- SJ 20236-1993 Verification regulation of the model GH2050/51 calibrator for transistor characteristic tracer
- SJ/T 10139-1991 Detail specification for electronic components--Semiconductor integrated circuits--CC4028 CMOS 4-line to 10-line decoder
- SJ/T 10414-2015 Solder for semiconductor device
- SJ 20233-1993 Verification regulation of model IMPACT-II semiconductor discrete device test sysytem
Military Standard of the People's Republic of China-General Armament Department
- GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
- GJB 762.1-1989 Semiconductor device radiation hardening test method Neutron irradiation test
- GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
- GJB 33/18-2011 Semiconductor optoelectronic device.Detail specification for type GO417 bidirectional analog switch semiconductor photocoupler
- GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
- GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
- GB/T 3859.2-1993 Semiconductor convertors Application guide
- GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part 11:Section 1:Internal visual examination for semiconductor integrated circuits (excluding hybrid circuits)
- GB/T 7678-1987 Semiconductor self-commutated convertors
- GB/T 11685-2003 Measurement procedures for semiconductor X-ray detector system and semiconductor X-ray energy spectrometers
- GB/T 15872-2013 Power supply interface for semiconductor equipment
- GB/T 15872-1995 Power supply interface for semiconductor equipment
- GB/T 14264-2024 Terminology of semiconductor materials
- GB/T 3859.4-2004 Semiconductor converter - Self-commutated semiconductor converters including direct d.c.converters
- GB/T 14264-2009 Semiconductor materials - Terms and definitions
- GB/T 31469-2015 Semiconductor materials cutting fluid
- GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
- GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
- GB/T 14264-1993 Semiconductor materials-Terms and definitions
- GB/T 4298-1984 The activation analysis method for the determination of elemental impurities in semiconductor silicon materials
- GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
- GB/T 36357-2018 Technical specification for middle power light-emitting diode chips
- GB/T 31358-2015 General specification for semiconductor lasers
Taiwan Provincial Standard of the People's Republic of China
- CNS 5074-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Free Fall)
- CNS 5544-1988 Environmantal Testing Methods and Endurance Testing Methods for Discrate Semiconductor Devices (Intermittent Operation Test of Fleld Effect Transistor)
- CNS 5541-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Continuous Operation Test of Transistor)
- CNS 6122-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Applying Voltage Test of Thyristors)
- CNS 5070-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Cycle Test for Temperature)
- CNS 5068-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Solderability Testing for Adhesion)
- CNS 5069-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Thermal Shock)
- CNS 6118-1988 Environmental inspection method and durability inspection method of single semiconductor device – low temperature storage test
- CNS 5545-1988 Environmental Testing Methods and Endurance Testing Methods for Discrate Semiconductor Devices Reverse Bias Test of Transistor Under High Temperature)
- CNS 5077-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Terminal Strength)
- CNS 5542-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Continuous Operation Test of Field Effect Transistor
- CNS 5543-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Intermittent Operation Test of Transistor)
- CNS 6124-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Intermittent Applying Voltage Test of Thyristors)
- CNS 5078-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Salt Mist Spray)
- CNS 5073-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Shock Test)
- CNS 5547-1988 Environmental inspection method and durability inspection method of single semiconductor device – high temperature storage test
- CNS 5066-1983 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (General Rules)
- CNS 5072-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Sealing Test)
- CNS 5071-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Cycle Test for Temperature & Humidity)
- CNS 6117-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Damp Heat Test)
- CNS 6126-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (High Temperature for Applying Voltage Test of Thyristors)
- CNS 5076-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Vibration Test)
- CNS 5075-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Constant Acceleration)
- CNS 7011-1981 Numbering of Electrodes in Multiple Electrode Semiconductor Devices and Designation of Units in Multiple Unit Semiconductor Devices
- CNS 6120-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Operation Test of Thyristors)
Guangdong Provincial Standard of the People's Republic of China
- DB44/T 1873-2016 semiconductor refrigeration wine cabinet
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 37031-2018 Semiconductor lighting terminology
工业和信息化部
- QB/T 5369-2019 Semiconductor refrigeration appliance
Professional Standard - Commodity Inspection
- SN 0022-1992 Rule for inspection of portable radio receivers with AM broadcast transmissions for export
Guizhou Provincial Standard of the People's Republic of China
- DB52/T 796-2013 Industrial semiconductor electric detonator
- DB52/T 844-2013 Semiconductor Current Regulator
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会
- GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers
- GB/T 34971-2017 Guide for gaseous effluent handling in semiconductor industry
Professional Standard - Post and Telecommunication
- YD 576-1992 Semiconductor rectifier equipments For telecommunications
HU-MSZT
- MNOSZ 700-16.lap-1955 Detection of Nickel Content in Semiconductors
- MNOSZ 700-18.lap-1956 Detection of chlorine content in semiconductors
- MSZ 700/36.lap-1961 Semiconductor testing experiments in coal mines
- MSZ 7200/2-1984 General process requirements and testing of high-power semiconductors
- MSZ 9200/18-1980 Electronic signals. semiconductor
- MSZ 7200/1-1984 General concepts, inspections and letter designations of high-efficiency semiconductors
- MSZ 700/23.lap-1965 STMicroelectronics tests coke
- MNOSZ 700-19.lap-1955 STMicroelectronics Pitch Content
- MSZ 700/24.lap-1965 STMicroelectronics Coke Test
German Institute for Standardization
- DIN 50443-1:1988 Testing of materials for use in semiconductor technology; detection of crystal defects and inhomogeneities in silicon single crystals by X-ray topography
- DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
- DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
- DIN 50449-1:1997 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 1: Carbon in gallium arsenide
- DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
- DIN 50449-2:1998 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 2: Boron in gallium arsenide
- DIN 50442-1:1981 Testing of semi-conductive inorganic materials; determination of the surface structure of circular monocrystalline semi-conductive slices; as-cut and lapped slices
- DIN EN 60747-15:2012-08 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010); German version EN 60747-15:2012 / Note: DIN EN 60747-15 (2004-08) remains valid alongside this standard until 2014-01-20.
- DIN 50454-2:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 2: Indium phosphide
- DIN 50454-3:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 3: Gallium phosphide
- DIN EN 62417:2010-12 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010); German version EN 62417:2010
- DIN 50438-2:1982 Testing of materials for semiconductor technology; determination of impurty content in silicon by infrared absorption; carbon
- DIN 50452-1:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 1: Microscopic determination of particles
- DIN 50452-3:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters
- DIN EN 60749-44:2017-04 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
- DIN EN IEC 63287-1:2020-06 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for LSI reliability qualification (IEC 47/2614/CDV:2020); German and English version prEN IEC 63287-1:2020 / Note: Date of issue 2020-05-08*Intended as replacem...
- DIN 50450-4:1993 Testing of materials for semiconductor technology; determination of impurities in carrier gases and dopant gases; determination of C<(Index)1>-C<(Index)3>-hydrocarbons in nitrogen by gas-chromatography
- DIN SPEC 1994:2017-02 Testing of materials for semiconductor technology - Determination of anions in weak acids
- DIN SPEC 1994 E:2016-07 Testing of materials for semiconductor technology - Determination of anions in weak acids
- DIN EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002
- DIN EN 60146-2:2001 Semiconductor convertors - Part 2: Self-commutated semiconductor convertors including direct d.c. convertors (IEC 60146-2:1999); German version EN 60146-2:2000
Japanese Industrial Standards Committee (JISC)
- JIS K 1466:1995 Testing methods for hydrofluoric acid of semi-conductor grade
CZ-CSN
- CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
- CSN 35 8701 Z1-1997 Semiconductor naming
- CSN 35 1531-1973 Silicon semiconductor rectifiers
- CSN 35 8720 Cast.1-1987 Semiconductor devices. Dimensions
- CSN 35 1530-1979 Power semiconductor converters
- CSN 35 8754-1973 Semiconductor devices. Transistors. Measurement of short-circuit output admittance
- CSN 34 5910-1986 Gold bonding wire for semiconductor devices
- CSN 01 3368-1990 Graphical symbols for semiconductor devices
- CSN 01 3347-1989 Graphical symbols for semiconductor devices
British Standards Institution (BSI)
- BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
- BS EN IEC 63364-1:2022 Semiconductor devices. Semiconductor devices for IoT system - Test method of sound variation detection
- BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
- BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
- BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
- BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
- BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
- BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
- BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
- BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
- BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
- BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
- BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
- BS QC 790101:1992 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integr...
- BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- BS EN 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - External visual examination
- BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
- 18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
- BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- PD ISO/PAS 19451-1:2016 Application of ISO 26262:2011-2012 to semiconductors. Application of concepts
- BS EN 62779-3:2016 Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
- BS EN IEC 63287-1:2021 Semiconductor devices. Generic semiconductor qualification guidelines - Guidelines for IC reliability qualification
- 21/30432536 DC BS EN IEC 63364-1. Semiconductor devices. Semiconductor devices for IOT system. Part 1. Test method of sound variation detection
- BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
- PD ISO/PAS 19451-2:2016 Application of ISO 26262:2011-2012 to semiconductors. Application of hardware qualification
- 23/30478757 DC BS EN IEC 63287-3. Semiconductor devices. Generic semiconductor qualification guidelines - Part 3. Guidelines for reliability qualification plans for power semiconductor module
- BS EN 60749-3:2017 Semiconductor devices. Mechanical and climatic test methods - External visual examination
- BS EN IEC 60749-17:2019 Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation
- BS EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Neutron irradiation
- 13/30264596 DC BS EN 60747-14-7. Semiconductor devices. Part 14-7. Semiconductor sensor. Flow meter
- BS EN IEC 62969-1:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
- PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- BS IEC 60747-8-4:2004 Discrete semiconductor devices - Metal-oxide semiconductor field-effect transistors (MOSFETs) for power switching applications
- BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
- BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- 19/30404095 DC BS EN IEC 60747-5-4. Semiconductor devices. Part 5-4. Optoelectronic devices. Semiconductor lasers
- 23/30450091 DC BS IEC 62899-203-2 Printed electronics. Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
- BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
- 24/30497113 DC BS EN IEC 63567-1 Semiconductor devices. Performance evaluation of semiconductor processing components and inspection equipment - Part 1. Transmittance evaluation method of EUV pellicle
- BS 3934-1:1992 Mechanical standardization of semiconductor devices - Recommendations for the preparation of drawings of semiconductor devices
- 13/30264591 DC BS EN 60747-14-6. Semiconductor devices. Part 14-6. Semiconductor sensor. Humidity sensor
Association Francaise de Normalisation
- NF EN IEC 63364-1:2023 Semiconductor devices - Semiconductor devices for IDO system - Part 1: Acoustic variation detection test method
- NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
- NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
- NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15: isolated semiconductor power devices
- NF EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: test method for the effects of a single event (SEE) irradiated by a neutron beam for semiconductor devices
- NF C53-221:1980 Semiconductor self-commutated convertors.
- NF C80-203*NF EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs).
- NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
- NF EN 62779-1:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 1 : exigences générales
- NF C96-779-2*NF EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2 : characterization of interfacing performances
- NF EN 62417:2010 Semiconductor Devices – Mobile Ion Testing for Metal Oxide Field Effect Semiconductor Transistors (MOSFETs)
- NF C96-779-3*NF EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3 : functional type and its operational conditions
- NF EN 62779-2:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 2 : caractérisation des performances d'interfaçage
- NF C96-022-44*NF EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- NF C96-287-1*NF EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1 : guidelines for IC reliability qualification
GSO
- GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- BH GSO IEC 60748-11-1:2016 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- GSO IEC 60748-11-1:2014 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- OS GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- BH GSO IEC 60747-15:2016 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- OS GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- GSO IEC 62779-1:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
- OS GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- BH GSO IEC 62779-1:2022 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
- GSO IEC 60747-14-1:2014 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- BH GSO IEC 60747-14-1:2016 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- OS GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- GSO IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- BH GSO IEC 60747-5-4:2016 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- GSO IEC 62779-2:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
- GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- GSO IEC 63287-1:2024 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
- GSO IEC 62779-3:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
Standard Association of Australia (SAA)
- AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
- AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
- AS 60146.2:2001/Amdt 1:2001 Semiconductor converters Self-commutated semiconductor converters include direct-to-dc converters
- AS 60146.2:2001(R2013) Semiconductor converters Self-commutated semiconductor converters include direct-to-dc converters
- AS 60146.2:2001 Semiconductor converters - Self-commutated semiconductor converters including direct d.c. converters
- AS 1955.3:1983 Semiconductor Convertors, Part 3: Semiconductor Direct D.C. Convertors (D.C. Chopper Convertors)
SE-SIS
- SIS SS IEC 759:1986 Nuclear instrumentation —Test procedures for semiconductor X-ray energy spectrometers
- SIS SEN 01 03 51-1966 Semiconductor devices Terminology
- SIS SEN 01 03 51-1976 Semiconductor devices Terminology
- SIS SS IEC 333:1986 Nuclear instrumentation - Testprocedures for semiconductor chargedparticle detectors
- SIS SS-IEC 748:1991 Semiconductor devices — Integrated circuits
- SIS SS IEC 596:1981 Nuclear instrumentation - Definitions of test method terms for semi-conductor radiation detectors and scintillation counting
- SIS SS-IEC 747:1991 Semiconductor devices — Discrete devices
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- JEDEC JEP167-2013 Characterization of Interfacial Adhesion in Semiconductor Packages
- JEDEC JEP167A-2020 Characterization of Interfacial Adhesion in Semiconductor Packages
- JEDEC JESD22-B118-2011 Semiconductor Wafer and Die Backside External Visual Inspection
- JEDEC JESD14-1986 Semiconductor Power Control Modules
- JEDEC JEP140-2002 Beaded Thermocouple Temperature Measurement of Semiconductor Packages
SCC
- CEI EN IEC 63364-1:2023 Semiconductor devices - Semiconductor devices for IoT system Part 1: Test method of sound variation detection
- DANSK DS/EN IEC 63364-1:2023 Semiconductor devices – Semiconductor devices for IoT system – Part 1: Test method of sound variation detection
- BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
- BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
- IEC 60146:1973 Semiconductor convertors
- SPC GB/T 14844-2018 Designations of semiconductor materials (TEXT OF DOCUMENT IS IN CHINESE)
- DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
- 12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
- CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
- 07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
- BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- 12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
- BS IEC 60747-1:2006 Semiconductor devices. General
- CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
- DANSK DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- CEI EN 60747-15:2012 Semiconductor devices - Discrete devices Part 15: Isolated power semiconductor devices
- SPC GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials (TEXT OF DOCUMENT IS IN CHINESE)
- 05/30137514 DC IEC 60747-14-4. Discrete semiconductor devices. Part 14-4. Semiconductor accelerometers
- MIL MIL-S-19500/530-1979 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3906
- MIL MIL-S-19500/529-1978 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3904
- DIN EN IEC 63364-1 E:2023 Draft Document - Semiconductor devices - Semiconductor devices for IOT system - Part 1: Test method of sound variation detection (IEC 47/2742/CDV:2021); German and English version prEN IEC 63364-1:2021
- CEI EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication Part 2: Characterization of interfacing performances
- CEI EN 62417:2011 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- DANSK DS/EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- BS PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- MIL MIL-PRF-19500P-2010 Semiconductor Devices, General Specification for
- BS 4417:1969 Specification for semiconductor rectifier equipments
- CEI EN 60749-44:2017 Semiconductor devices - Mechanical and climatic test methods Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- DANSK DS/EN 60749-44:2016 Semiconductor devices – Mechanical and climatic test methods – Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- MIL MIL-S-19500/288-1964 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON TYPE 2N2377
- MIL MIL-S-19500/289-1964 Semiconductor Device, Transistor, PNP, Silicon Type 2N2378
- BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
- DIN IEC 60747-14-4 E:2002 Draft Document - Discrete semiconductor devices - Part 14-4: Semiconductor accelerometers (IEC 47E/220/CD:2002)
- 08/30181404 DC BS IEC 60747-14-3. Semiconductor devices. Part 14-3. Semiconductor sensors. Pressure sensors
- CEI EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- CEI EN 62779-3:2017 Semiconductor devices - Semiconductor interface for human body communication Part 3: Functional type and its operational conditions
- 07/30162213 DC BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
- DANSK DS/EN IEC 60749-39:2022 Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
International Electrotechnical Commission (IEC)
- IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- IEC 63364-1:2022 Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
- IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
- IEC 60748-11-1:1992 Semiconductor devices; integrated circuits; part 11; section 1: internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
- IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
- IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
- IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
- IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
- IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
- IEC 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- IEC 60749-3:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
- IEC 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
- IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
- IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
- IEC 60191-1C:1974 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.
PT-IPQ
- NP 3081-1985 Electronic component. Semiconductor chip inspection in microelectronics scanning, basic specifications
TR-TSE
- TS 2643-1977 Test Procedures For Bemiconductor Detectors For Ionizing Radiation
American National Standards Institute (ANSI)
- ANSI/IEEE 300:1988 Test Procedures for Semiconductor Charged-Particle Detectors
- ANSI/ASTM E1161:1996 Test Method for Radiologic Examination of Semiconductors and Electronic Components
JP-JEITA
- JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)
NEMA - National Electrical Manufacturers Association
- NEMA CB-4:1989 Semiconductor Graphite
National Fire Protection Association (NFPA)
- NFPA FPH SECTION 6-30-2003 Semiconductor Manufacturing
YU-JUS
- JUS N.R1.322-1979 Terms and definitions for semiconductor ?evices. Thyristors
- JUS N.R1.520-1988 Seml?ouductor devices. Preparat ion of draurings
- JUS N.A3.500-1980 Semiconductor devices. Graphical symbols
- JUS A.A4.302-1990 Tabular layouts ofarticle characteristics for semiconductor diodes
American Society for Testing and Materials (ASTM)
- ASTM F584-87(2005) Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
- ASTM F584-87(1999) Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
- ASTM E1161-09 Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
- ASTM E1161-09(2014) Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
- ASTM F584-06e1 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
- ASTM E1161-03 Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
- ASTM F584-06 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
- ASTM E1161-21 Standard Practice for Radiographic Examination of Semiconductors and Electronic Components
European Committee for Electrotechnical Standardization(CENELEC)
- EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
- EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
- EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
- EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
- EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
Spanish Association for Standardization (UNE)
- UNE-EN IEC 63364-1:2023 Semiconductor devices - Semiconductor devices for IOT system - Part 1: Test method of sound variation detection (Endorsed by Asociación Española de Normalización in March of 2023.)
- UNE-EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (Endorsed by AENOR in June of 2012.)
- UNE-EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
- UNE-EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (Endorsed by AENOR in September of 2010.)
- UNE 20-700 Pt.11-1991 Semiconductor devices. Part 11:Sectional specification for discrete devices
- UNE-EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
- UNE-EN 300386 V1.5.1:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
- UNE-EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
- UNE-EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification (Endorsed by Asociación Española de Normalización in November of 2021.)
Semiconductor Equipment and Materials International (SEMI)
- SEMI F81-0611-2011 SPECIFICATION FOR VISUAL INSPECTION AND ACCEPTANCE OF GAS TUNGSTEN ARC (GTA) WELDS IN FLUID DISTRIBUTION SYSTEMS IN SEMICONDUCTOR MANUFACTURING APPLICATIONS
RU-GOST R
- GOST 2.730-1973 Unified system for design documentation. Graphical symbols in diagrams. Semiconductor devices
- GOST R IEC 60748-11-1-2001 Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- GOST R 50471-1993 Semiconductor photoemitters. Measuring method for halfintensity angle
- GOST 19656.13-1976 Semiconductor UHF detector diodes. Measurement methods of tangential sensitivity
- GOST 19656.7-1974 Semiconductor UHF detector diodes. Measurement method of current sensitivity
- GOST R 57439-2017 Semiconductor devices. Basic dimensions
- GOST R IEC 748-11-1-2001 Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- GOST 18472-1988 Semiconductor devices. Basic dimensions
- GOST 11630-1984 Semiconductor devices. General specification
- GOST 24458-1980 Semiconductor optoelectronic couplers. Essential parameters
Korean Agency for Technology and Standards (KATS)
- KS C IEC 60748-11-1-2020 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- KS C IEC 60748-11-1:2004 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- KS C 2607-2002 TESTING METHODS OF SEMICONDUCTOR
- KS C IEC 60748-11-1-2004(2020) Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- KS C IEC 60747-14-1:2003 Semiconductor devices-Part 14-1:Semiconductor sensors-General and classification
- KS C IEC 60747-14-1:2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
- KS C IEC 60747-14-1:2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
- KS C 7013-1985 TYPE DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
- KS C 7013-1971(2000) TYPE DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
- KS C IEC 60749-39-2006(2021) Semiconductor devices-Mechanical and climatic test methods-Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Defense Logistics Agency
- DLA MIL-PRF-19500/74 E NOTICE 1-1999 SEMICONDUCTOR DEVICE, TRANSISTORS, NPN, SILICON, MEDIUM POWER, TYPES 2N497, 2N498, 2N656 AND 2N657
- DLA MIL-DTL-19491 H-2002 SEMICONDUCTOR DEVICES, PACKAGING OF
- DLA MIL-S-19500/74 E VALID NOTICE 3-2011 Semiconductor Device, Transistors, NPN, Silicon, Medium Power, Types 2N497, 2N498, 2N656 and 2N657
- DLA MIL-PRF-19500 N-2005 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
- DLA DESC-DWG-84002-1984 HEAT SINKS FOR SEMICONDUCTOR DEVICES
- DLA MIL-S-19500/529 VALID NOTICE 4-2011 Semiconductor Device, Transistor, Silicon Type 2N3904
- DLA QML-19500-QPD-2012 Semiconductor Devices, General Specification for
- DLA QML-19500-QPD-2011 Semiconductor Devices, General Specification for
- DLA QML-19500-2013 Semiconductor Devices, General Specification for
- DLA QML-19500-2011 Semiconductor Devices, General Specification for
- DLA QML-19500-31-2007 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
- DLA MIL-S-19500/339 VALID NOTICE 3-2011 Semiconductor Device, Diode, Silicon, Video Detector Types 1N358A, 1N358AR, 1N358AM, and 1N358AMR
- DLA QML-19500-QPD-2010 Semiconductor Devices, General Specification for
- DLA QML-19500-2012 Semiconductor Devices, General Specification for
- DLA MIL-S-19500/216 A VALID NOTICE 3-2004 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON TYPE 2N1051
- DLA MIL-S-19500/303 VALID NOTICE 3-2011 Semiconductor Device, Transistor, Types 2N2631 and 2N2876
- DLA MIL-S-19500/273 A VALID NOTICE 3-2011 Semiconductor Device, Transistor Type Type 2N744
- DLA MIL-S-19500/99 E VALID NOTICE 3-2011 Semiconductor Device, Transistor, NPN, Silicon, Switching, Medium-Power Types 2N696, 2N697, 2N696S and 2N697S
- DLA DSCC-DWG-91011 REV B-2003 SEMICONDUCTOR DEVICE, DIODE, ULTRA FAST
IEEE - The Institute of Electrical and Electronics Engineers@ Inc.
- IEEE 256-1963 SEMICONDUCTOR DIODES
- IEEE 59-1962 SEMICONDUCTOR RECTIFIER COMPONENTS
US-Unspecified Preparing Activity
- DI-QCIC-80924 A-2006 SEMICONDUCTOR PROCESS SPECIFICATION
BE-NBN
- NBN C 95-001-1977 Semiconductor equipment. the term
- NBN C 95-001-1973 Semiconductor devices. specialized vocabulary
IEC - International Electrotechnical Commission
- IEC 60146-2:1974 Semiconductor Convertors Part 2: Semiconductor Self-Commutated Convertors (Edition 1.0)
- IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices (Edition 1.0)
- IEC 60146-3:1977 Semiconductor Convertors Part 3: Semiconductor Direct D.C. Convertors (D.C. Chopper Convertors) (Edition 1.0)
- IEC 62779-1:2016 Dispositifs à semiconducteurs – Interface à semiconducteurs pour les communications via le corps humain – Partie 1: Exigences générales (Edition 1.0)
- IEC 62951-7:2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)
Danish Standards Foundation
- DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- DS/EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- DS/EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test method - Part 3: External visual examination
- DS/EN IEC 63287-1:2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification
Society of Automotive Engineers (SAE)
- SAE AS6294/3-2019 Requirements for Plastic Encapsulated Discrete Semiconductors in Space Applications
KR-KS
- KS C IEC 60747-14-1-2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
- KS C IEC 60747-14-1-2019 Semiconductor devices — Part 14-1: Semiconductor sensors —Generic specification for sensors
IET - Institution of Engineering and Technology
- HIST WLD SEMI IND-1990 A History of the World Semiconductor Industry
Underwriters Laboratories (UL)
- UL 1557-1993 Electrically isolated semiconductor devices
- UL 1557-2011 Electrically isolated semiconductor devices
- UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006
- UL 1557-1997 Electrically isolated semiconductor devices
ESD - ESD ASSOCIATION
- EP118-2007 Physics of Semiconductor Devices
RO-ASRO
- SR CEI 748-11-1-1992 Semiconductor devices Integrated circuits Part 11: Section 1: Internai visual examination for semiconductor integrated circuits excluding hybrid circuits
- STAS 1590/10-1974 SEMICONDUCTOR DEVICES Graphical symbols
- STAS 11066/2-1980 THYRISTORS Test methods
CENELEC - European Committee for Electrotechnical Standardization
- EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices
DIN
- DIN EN 60747-15:2004 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2003); German version EN 60747-15:2004
JP-JEC
- JEC 2440-2005 SEMICONDUCTOR SELF-COMMUTATED CONVERTERS
IN-BIS
- IS 4411-1967 Semiconductor device name code
- IS 5001-1969 Semiconductor Device Drawing Guide
- IS 5001 Pt.1-1969 Semiconductor Device Drawing Guide
PL-PKN
- PN T01503 ArkusZ50-1973 Semiconductor devicesDimensions Case C9
- PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits
- PN T01503 ArkusZ06-1973 Semiconductor devices Dimensions Device A 24
TH-TISI
- TIS 1863-2009 Semiconductor devices.discrete devices
GOST
- GOST R 71055-2023 Semiconductor devices. System of designations
- GOST R 70999-2023 Semiconductor diodes. Parameters system
PH-BPS
- PNS IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
Indonesia Standards
- SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials
Institute of Electrical and Electronics Engineers (IEEE)
- IEEE Std 1687-2014 IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
South African Bureau of Standard
- SANS 60146-2:1999 Semiconductor converters Part 2: Self-commutated semiconductor converters including direct d.c. converters
Lithuanian Standards Office
- LST EN 60747-15-2012 Semiconductor devices - Discrete devices -- Part 15: Isolated power semiconductor devices (IEC 60747-15:2010)
- LST EN 62417-2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010)
IECQ - IEC: Quality Assessment System for Electronic Components
- PQC 82-1989 Semiconductors for Use in Electronic Equipment: Sectional Specification: Semiconductor Integrated Circuits Excluding Hybrid Circuits
Zhongjian,Inspection machine,Natural rubber inspection and testing,First inspection, middle inspection,China Inspection Level 2,China Inspection Information,flying inspection,China Inspection Certificate,CCIC Radiation,CCIC South,China Inspection and Testing,Semiconductor inspection,China Inspection and Testing,CCIC Security,China Inspection Evaluation,Middle joint verticality inspection tool,CCDI,Elimination + middle inspection,Internal Visual Inspection of Semiconductor Devices