GB/T 8750-1997 in English

SUPERSEDED

Gold wire for semiconductor devices lead bonding

Issued on:1997-01-02
Implemented on:1998-08-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $180.00
$175.00

Standard No:	GB/T 8750-1997
Document status:	SUPERSEDED
Superseded by:	GB/T 8750-2007 Gold bonding wire for semiconductor devices
Superseded on:	2008-06-01
Title in English:	Gold wire for semiconductor devices lead bonding
Title in Chinese:	半导体器件键合金丝
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	1997-01-02
Implemented on:	1998-08-01
Chinese Classification:	H68-Precious metals and their alloys
Professional Classification:	GB-National Standard
Related Keywords:	gold wire semiconductor devices semiconductor device gold wires wire
Related Topics:	Bond key Semiconducting sulfur cobalt semiconducting bonder Bonded phase Semiconductor paint Semiconductor outgassing Semiconductor bonder Semiconductor device high temperature semiconductor effect Semiconductor inspection high temperature semiconductor device semiconductor cv Triple Bond C18 Alkyl Bonding high temperature semiconductor device Semiconductor device bonding strength triple bond c18 Semiconductor bonder Bonding properties triple bond Zirconium compound semiconductor semiconductor alloy semiconductor Semimetals and Semiconductor Materials Semiconductor gold wire GBT8750 GB/T 8750-1997 GB/T 8750-2007 GB/T 8750-2014 Semiconductor device EFA and PFA Semiconductors Guide wire industry Bonding force bonding void test Semiconductor Wire Bonding Standard Document Bonding wire diameter Bonding wire diameter related Bonding wire industry Microassembly bonding wire bonding wire Semiconductor bonding strength detection Gold bond strength standard document Gold wire bonding related standards bonding wire gold wire Aluminum alloy for semiconductor equipment gb8750 Semiconductor device material references Bonding wire related standards Semiconductor Bonding and Technology

《GB/T 8750-1997半导体器件键合金丝》由TC243（全国有色金属标准化技术委员会）归口，主管部门为中国有色金属工业协会。
本标准规定了半导体器件键合金丝的产品分类、要求、试验方法、检测规则及标志、包装、运输、贮存。本标准适用于半导体器件内引线用的拉伸或挤压金丝。

Scope

This standard specifies the product classification, requirements, test methods, testing rules and signs, packaging, transportation and storage of semiconductor device bonding gold wire. This standard applies to drawn or extruded gold wires used in semiconductor devices as internal leads.

More samples: NB/T 47013.2-2015 GB 50021-2001(2009) YD/T 3934-2021

Sample only — not a preview of GB/T 8750-1997

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