GB/T 8750-2007 in English

SUPERSEDED

Gold bonding wire for semiconductor devices

Issued on:1988-02-25
Implemented on:2008-06-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $240.00
$233.00

Standard No:	GB/T 8750-2007
Document status:	SUPERSEDED
Superseded by:	GB/T 8750-2014 Gold bonding wire for semiconductor package
Superseded on:	2015-02-01
Title in English:	Gold bonding wire for semiconductor devices
Title in Chinese:	半导体器件键合用金丝
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	1988-02-25
Implemented on:	2008-06-01
ICS Classification:	77.150.99-Other products of non-ferrous metals
Chinese Classification:	H68-Precious metals and their alloys
Professional Classification:	GB-National Standard
Related Keywords:	gold bonding wire gold wire semiconductor devices semiconductor devices scopethis standard semiconductor device
Related Topics:	key Semiconducting sulfur Semiconductor Device Usage Rules bonder Bonded phase semiconductor ultrasound Semiconductor paint Semiconductor bonder semiconductor effect Triple Bond C18 Alkyl Bonding Semiconductor device bonding strength Semiconductor bonder triple bond Zirconium compound semiconductor semiconductor Semimetals and Semiconductor Materials Semiconductor gold wire GBT8750 GB/T 8750-1997 GB/T 8750-2007 GB/T 8750-2014 Semiconductor device conductor Use of metal materials in semiconductor equipment parts Bonding force bonding void test Bonding wire diameter Bonding wire diameter related Bonding wire industry Microassembly bonding wire bonding wire Manufacturing of special equipment for semiconductor devices gold filigree quote Semiconductor bonding strength detection Gold bond strength standard document Gold wire bonding related standards bonding wire gold wire Aluminum alloy for semiconductor equipment gb8750 Semiconductor device material references Bonding wire related standards Semiconductor Bonding and Technology

《GB/T 8750-2007半导体器件键合用金丝》由TC243（全国有色金属标准化技术委员会）归口，主管部门为中国有色金属工业协会。
本标准规定了半导体器件键合金丝的要求、试验方法、检验规则和标志、包装、运输和储存等。本标准适用于半导体器件内引线用的拉伸或挤压金丝。

Scope

This standard specifies the requirements, test methods, inspection rules and signs, packaging, transportation and storage of semiconductor device bonding gold wire. This standard applies to drawn or extruded gold wires used in semiconductor devices as internal leads.

More samples: NB/T 47013.2-2015 QC/T 942-2021 JJG 21-2008

Sample only — not a preview of GB/T 8750-2007

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