GB/T 31469-2015 in English

VALID

Semiconductor materials cutting fluid

Issued on:2015-05-15
Implemented on:2016-01-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $100.00
$97.00

Standard No:	GB/T 31469-2015
Document status:	VALID
Title in English:	Semiconductor materials cutting fluid
Title in Chinese:	半导体材料切削液
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2015-05-15
Implemented on:	2016-01-01
Chinese Classification:	L90-Special electronic technology material
Professional Classification:	GB-National Standard
Related Keywords:	semiconductor materials fluid scopethis standard wire cutting cutting semiconductor
Related Topics:	liquid resistant material Semiconductor material Organic Semiconductor Materials cutting fluid Semiconductor Material Cutting Fluid Semiconductor Material Cutting Fluid GB/T 31469-2015 Semiconducting sulfur semiconductor mass spectrometry Semiconductor material testing Molybdenum ditelluride - a new semiconductor material icp-ms semiconductor icp-ms and semiconductors new semiconductor materials Semiconductor material new semiconductor materials Properties of Organic Semiconductor Materials Semiconductor material purity Semiconductor Material Density Half change cobalt semiconducting liquid material Semiconductor liquid tank Molybdenum ditelluride-a new semiconductor material semiconductor icp-ms semiconductor material growth Semiconductor main material Commonly Used Semiconductor Materials Liquid thermal conductivity meter Semiconductor Material Properties Material Semiconductor Thin Film Molybdenum ditelluride new semiconductor material cut Liquid thermal conductivity meter conductor Advanced Semiconductor Materials and semiconductor materials Semiconductor Materials and Technologies Optoelectronic Materials and Semiconductor Lighting Semiconductor material testing semiconductor energy level Optoelectronic Materials Semiconductor Lighting Semiconductor material testing cobalt phosphide semiconductor electrical semiconductor material Semiconductor paint cutting equipment Semiconductor plastic conductor material conductor material Semiconductor outgassing liquid conductivity semiconductor effect Semiconductor Materials Microscope Semiconductor inspection Semiconductor material properties semiconductor energy level semiconductor cv Semiconductor material properties quinone semiconductor Semiconductor materials and semiconductor photocatalytic materials body material Semiconductor materials are isotropic Semiconductor Material Density Commonly Used Semiconductor Materials semiconductor material semiconducting layer material compound semiconductor material semiconductor cv Semiconductor strip edge Plasma Materials Semiconductor Materials semiconductor chip material phase of semiconductor material Semiconductor Materials Microscope UV Analysis of Semiconductor Materials Semiconductor material series what liquid material semiconducting layer material semiconductor Semimetals and Semiconductor Materials semiconducting material semiconducting material GBT31469 GB/T 31469-2015 CdZnTe semiconductor material conductor liquid thermal conductivity Calculation of cutting fluid concentration EFA and PFA Semiconductors EFM analysis of semiconductors What are the commonly used semiconductor materials? Semiconductor material luminescence characteristics testing Cutting Fluids International Cutting fluid water ratio Semiconductor technology Cleaning Standards for Semiconductor Application Materials Preparation method of semiconductor materials Semiconductor material purification methods Cutting fluid detection Spray paint resistant to cutting fluid Semiconductor polishing materials Semiconductor equipment materials Semiconductor appearance Hydrogen content testing of semiconductor materials Semiconductor inspection China Semiconductor Semiconductor material certification Liquid medicinal materials Execution of Semiconductor Raw Materials Semiconductor raw material inspection standards Semiconductor equipment plastics Semiconductor device material references

《GB/T 31469-2015半导体材料切削液》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。
本标准规定了半导体材料切削液的各项技术要求、试验方法、检验规则、标志、包装、储存及运输等要求。
本标准适用于半导体材料线切割加工采用的切削液。

Scope

This standard stipulates various technical requirements, test methods, inspection rules, marking, packaging, storage and transportation requirements of cutting fluid for semiconductor materials. This standard applies to cutting fluids used in wire cutting of semiconductor materials.

More samples: JGJ 94-2008 NB/T 47013.2-2015 GB 18306-2015

Sample only — not a preview of GB/T 31469-2015

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